Abstract: In a casing, a printed circuit board is arranged such that a first side of the printed circuit board has a first angle of ?° with respect to a first side surface plate. A cooling device is arranged to have a second angle of ? with respect to the first side surface plate. Accordingly, an amount of cooling air flowing in and out via an air intake port and an air discharge port may be increased. Furthermore, by reducing the angle of the change in the flow direction of the cooling air flowing over the printed circuit board, the cooling air flowing over the printed circuit board may be made to efficiently flow through an air discharge port 119a. Furthermore, the efficiency with which a heat-generating component on the printed circuit board is cooled may be improved.

Abstract: Upper and lower support members, supporting a valve, are lowered toward a valve guide with at least the lower support member vibrated by a vibrating device. When a lower-end chamfered surface of the valve has failed to be brought into contact with the opening edge of the guide through the lowering, not only the upper support member is caused to gradually move away from an umbrella section of the valve but also the position of supporting, by the lower support member, of a shaft section of the valve is displaced downward after the lower end of the shaft section of the valve contacts the upper end surface of the guide, so that vibrating movement of the lower end of the shaft section is reduced to allow the chamfered surface to contact the opening edge. Then, the valve is inserted into the guide by a pressing member.

Abstract: DIMMs to be cooled are mounted in DIMM areas of a printed circuit board of a system board. An air intake port that introduces cooling air is arranged on a side plate of the system board, whereas an air discharge port that discharges the cooling air is arranged on another side plate. The cooling air flows in a direction that is oblique with respect to the side plate. The air intake port is arranged at a position that is offset in the direction in which the cooling air is supplied. Accordingly, cooling is possible by efficiently bringing the cooling air into contact with the DIMMs.

Abstract: A printed circuit board unit includes a printed wiring board, an electronic component package mounted on a front surface of the printed wiring board, a radiating plate that is placed on an upper surface of the electronic component package, a bolt that has a head and a tip protruding from a back surface of the printed wiring board, and penetrates through the radiating plate and the printed wiring board, a reinforcing plate separated from the back surface of the printed wiring board by a predetermined gap, a stud arranged on a front surface of the reinforcing plate and coupled with the tip of the bolt, and a shock absorbing plate that is arranged between the reinforcing plate and the back surface of the printed wiring board.

Abstract: A semiconductor component includes a semiconductor element that has a plurality of signals, a wiring board that is disposed below the semiconductor element and that draws the plurality of signals of the semiconductor element, a heat conduction member that dissipates heat generated by the semiconductor element, a joining member that is disposed between the semiconductor element and the heat conduction member and that joins the heat conduction member to the semiconductor element, a support member formed with an opening so as to surround the semiconductor element that supports the heat conduction member, a first adhesive member that is disposed between the support member and the wiring board to bond the support member with the wiring board and a second adhesive member that is disposed between the support member and the heat conduction member to bond the support member with the heat conduction member.

Abstract: An electronic apparatus has a printed circuit board, a semiconductor device mounted on the printed circuit board by a plurality of solder bumps, a heater that heats the printed circuit, a power supply unit that supplies electric power to the semiconductor device and the heater, and a controller that controls the power supply unit to supply electric power to the heater when the electric power is not supplied to the semiconductor device.

Abstract: An electronic device package includes an electronic device including a plurality of input/output terminals, a wiring board which places the electronic device on a first surface and includes wiring connected to the input/output terminals of the electronic device, and a first connection terminal formed on a second surface of the wiring board and connected to the wiring, wherein the first connection terminal has an uneven contact surface formed to receive solder material placed thereon.

Abstract: A dew-condensation detecting apparatus includes a dew-condensation detector provided in a middle of a cold-liquid supply passage. The cold-liquid supply passage supplies a cooling liquid to electronic equipment. The dew-condensation detector detects dew condensation by detecting water droplets due to the dew condensation. A heating part heats the cooling liquid which has exited from the dew-condensation detector.

Abstract: A condensation sensing device that detects a water droplet to sense the condensation, the condensation sensing device comprising: a surface having a recesses and productions; and a water droplet detector that detects a water droplet guided by any of the recesses on the surface.

Abstract: DIMMs to be cooled are mounted in DIMM areas of a printed circuit board of a system board. An air intake port that introduces cooling air is arranged on a side plate of the system board, whereas an air discharge port that discharges the cooling air is arranged on another side plate. The cooling air flows in a direction that is oblique with respect to the side plate. The air intake port is arranged at a position that is offset in the direction in which the cooling air is supplied. Accordingly, cooling is possible by efficiently bringing the cooling air into contact with the DIMMs.

Abstract: In a casing, a printed circuit board is arranged such that a first side of the printed circuit board has a first angle of ? ° with respect to a first side surface plate. A cooling device is arranged to have a second angle of ? with respect to the first side surface plate. Accordingly, an amount of cooling air flowing in and out via an air intake port and an air discharge port may be increased. Furthermore, by reducing the angle of the change in the flow direction of the cooling air flowing over the printed circuit board, the cooling air flowing over the printed circuit board may be made to efficiently flow through an air discharge port 119a. Furthermore, the efficiency with which a heat-generating component on the printed circuit board is cooled may be improved.

Abstract: Disclosed is a method for producing a polymer through living polymerization, comprising forming an oligomer having a polymerization active end, which is an oligomer higher than an average 1.0-mer and lower than an average 4.0-mer or an average 4.0-mer, and polymerizing using the oligomer having a polymerization active end as an initiating species, wherein the acrylic acid-based polymer comprising a repeating unit derived from a poly(?-lower alkyl)acrylate, and a repeating unit derived from an (?-lower alkyl)acrylic ester represented by formula (I) wherein R1 represents a hydrogen atom or a lower alkyl group, and R2 represents an organic group having a polar group in an arm portion.

Abstract: A semiconductor component includes a semiconductor element that has a plurality of signals, a wiring board that is disposed below the semiconductor element and that draws the plurality of signals of the semiconductor element, a heat conduction member that dissipates heat generated by the semiconductor element, a joining member that is disposed between the semiconductor element and the heat conduction member and that joins the heat conduction member to the semiconductor element, a support member formed with an opening so as to surround the semiconductor element that supports the heat conduction member, a first adhesive member that is disposed between the support member and the wiring board to bond the support member with the wiring board and a second adhesive member that is disposed between the support member and the heat conduction member to bond the support member with the heat conduction member.

Abstract: A semiconductor component includes a semiconductor element that has a plurality of signals, a wiring board that is disposed below the semiconductor element and that draws the plurality of signals of the semiconductor element, a heat conduction member that dissipates heat generated by the semiconductor element, a joining member that is disposed between the semiconductor element and the heat conduction member and that joins the heat conduction member to the semiconductor element, a support member formed with an opening so as to surround the semiconductor element that supports the heat conduction member, a first adhesive member that is disposed between the support member and the wiring board to bond the support member with the wiring board and a second adhesive member that is disposed between the support member and the heat conduction member to bond the support member with the heat conduction member.

Abstract: A cutter device includes a fixing holder, a spherical cylinder, and a cutter holder. The fixing holder has a through hole, and a spherical outer circumferential surface in which a key groove is formed. The spherical cylinder includes a through hole that has a spherical inner circumferential surface in which a key groove having a spherical bottom surface is formed, and a spherical outer circumferential surface having a key groove formed at a position shifted around a rotational axis with respect to the key groove. The cutter holder includes a through hole that has a spherical inner circumferential surface in which a through hole having a spherical bottom surface is formed, and a cutter blade. These components are rotationally slidably connected by keys.

Abstract: The object of the present invention is to provide a process for industrially advantageously producing a polymer having a high molecular weight and a narrow, monodispersed molecular weight distribution, and more particularly, a block copolymer of an anionic polymerizable monomer and an acrylic monomer. The object of the present invention was able to be achieved by reacting an acrylic monomer with a polymer anion, the terminal of which has been modified by a compound that forms a living carbanion capable of polymerizing an anionic polymerizable monomer by reacting with an anion, but which itself does not polymerize, in the presence of a compound represented by formula (1): (R1)nM (wherein, R1 represents a C1-C20 alkyl group or a C6-C20 aryl group, R1 may be the same or different in the case n is 2 or more, M represents an atom belonging to Group 2, 12 or 13 of the long form of the periodic table, and n represents the valency of M).

Abstract: Disclosed are an acrylic acid-based polymer which is a star polymer containing a repeating unit derived from an (?-lower alkyl)acrylic ester represented by formula (I): (wherein R1 represents a hydrogen atom or a lower alkyl group, and R2 represents an organic group having a polar group) in an arm portion; an acrylic acid-based polymer containing a repeating unit derived from an poly(?-lower alkyl)acrylic ester and a repeating unit derived from an (?-lower alkyl)acrylic ester represented by formula (I), and a method for producing a polymer through living polymerization, comprising forming an oligomer having a polymerization active end, which is an oligomer higher than an average 1.0-mer and lower than an average 4.0-mer or an average 4.0-mer, and polymerizing using the oligomer having a polymerization active end as an initiating species.

Abstract: An electronic part having mounting terminals made of a thermally-meltable bonding material is mounted on a mounting board. A structural part is used for moving a height-adjusting member to a position under the electronic part in a process of heating and melting the thermally-meltable bonding material so as to maintain a predetermined distance between the electronic part and the mounting board.

Abstract: Disclosed are an acrylic acid-based polymer which is a star polymer containing a repeating unit derived from an (?-lower alkyl)acrylic ester represented by formula (I): (wherein R1 represents a hydrogen atom or a lower alkyl group, and R2 represents an organic group having a polar group) in an arm portion; an acrylic acid-based polymer containing a repeating unit derived from an poly(?-lower alkyl)acrylic ester and a repeating unit derived from an (?-lower alkyl)acrylic ester represented by formula (I), and a method for producing a polymer through living polymerization, comprising forming an oligomer having a polymerization active end, which is an oligomer higher than an average 1.0-mer and lower than an average 4.0-mer or an average 4.0-mer, and polymerizing using the oligomer having a polymerization active end as an initiating species.

Abstract: A semiconductor includes a board, a semiconductor element mounted on the board, an electronic component, with the semiconductor element, mounted on the board, a heat radiation member provided so as to face the board, the heat radiation member configured to radiate heat of the semiconductor element, and a thermal connecting member being configured to thermally connect the heat radiation member and the semiconductor element. A metal material is used as the thermal connecting member, and an adhesion preventing member is provided so as to be separated from the electronic component, the adhesion preventing member being configured to prevent the metal material molten and flowing at a heating time being adhered to the electronic component.