Abstract: An electronic apparatus has a printed circuit board, a semiconductor device mounted on the printed circuit board by a plurality of solder bumps, a heater that heats the printed circuit, a power supply unit that supplies electric power to the semiconductor device and the heater, and a controller that controls the power supply unit to supply electric power to the heater when the electric power is not supplied to the semiconductor device.

Abstract: A printed circuit board unit includes a printed wiring board, an electronic component package mounted on a front surface of the printed wiring board, a radiating plate that is placed on an upper surface of the electronic component package, a bolt that has a head and a tip protruding from a back surface of the printed wiring board, and penetrates through the radiating plate and the printed wiring board, a reinforcing plate separated from the back surface of the printed wiring board by a predetermined gap, a stud arranged on a front surface of the reinforcing plate and coupled with the tip of the bolt, and a shock absorbing plate that is arranged between the reinforcing plate and the back surface of the printed wiring board.

Abstract: Upper and lower support members (25, 26), supporting a valve (13), are lowered toward a valve guide (12) with at least the lower support member (25) vibrated by a vibrating device (19). When a lower-end chamfered surface (13g) of the valve has failed to be brought into contact with the opening edge (12c) of the guide through the lowering, not only the upper support member is caused to gradually move away from an umbrella section (13b) of the valve but also the position of supporting, by the lower support member, of a shaft section (13a) of the valve is displaced downward after the lower end of the shaft section of the valve contacts the upper end surface (12b) of the guide, so that vibrating movement of the lower end of the shaft section is reduced to allow the chamfered surface to contact the opening edge. Then, the valve is inserted into the guide by a pressing member (32).

Abstract: A semiconductor component includes a semiconductor element that has a plurality of signals, a wiring board that is disposed below the semiconductor element and that draws the plurality of signals of the semiconductor element, a heat conduction member that dissipates heat generated by the semiconductor element, a joining member that is disposed between the semiconductor element and the heat conduction member and that joins the heat conduction member to the semiconductor element, a support member formed with an opening so as to surround the semiconductor element that supports the heat conduction member, a first adhesive member that is disposed between the support member and the wiring board to bond the support member with the wiring board and a second adhesive member that is disposed between the support member and the heat conduction member to bond the support member with the heat conduction member.

Abstract: An electronic device package includes an electronic device including a plurality of input/output terminals, a wiring board which places the electronic device on a first surface and includes wiring connected to the input/output terminals of the electronic device, and a first connection terminal formed on a second surface of the wiring board and connected to the wiring, wherein the first connection terminal has an uneven contact surface formed to receive solder material placed thereon.

Abstract: A cutter device includes a fixing holder, a spherical cylinder, and a cutter holder. The fixing holder has a through hole, and a spherical outer circumferential surface in which a key groove is formed. The spherical cylinder includes a through hole that has a spherical inner circumferential surface in which a key groove having a spherical bottom surface is formed, and a spherical outer circumferential surface having a key groove formed at a position shifted around a rotational axis with respect to the key groove. The cutter holder includes a through hole that has a spherical inner circumferential surface in which a through hole having a spherical bottom surface is formed, and a cutter blade. These components are rotationally slidably connected by keys.

Abstract: Disclosed are an acrylic acid-based polymer which is a star polymer containing a repeating unit derived from an (?-lower alkyl)acrylic ester represented by formula (I): (wherein R1 represents a hydrogen atom or a lower alkyl group, and R2 represents an organic group having a polar group) in an arm portion; an acrylic acid-based polymer containing a repeating unit derived from an poly(?-lower alkyl)acrylic ester and a repeating unit derived from an (?-lower alkyl)acrylic ester represented by formula (I), and a method for producing a polymer through living polymerization, comprising forming an oligomer having a polymerization active end, which is an oligomer higher than an average 1.0-mer and lower than an average 4.0-mer or an average 4.0-mer, and polymerizing using the oligomer having a polymerization active end as an initiating species.

Abstract: A heat spreading member is received on a predetermined surface of an electronic component. The heat spreading member extends larger than the predetermined surface. A contact piece is contacted with the heat spreading member over a contact area smaller than the predetermined surface. The contact piece serves to realize concentration of an urging force applied to the heat spreading member. The heat spreading member is thus reliably urged against the electronic component. The concentration of the urging force serves to prevent the heat spreading member and the electronic component from camber even if heat is applied to the heat spreading member and the electronic component. Separation is thus avoided between the heat spreading member and the electronic component. The heat spreading member reliably keeps contacting with the electronic component, so that the electronic component package is allowed to enjoy improvement in heat radiation.

Abstract: A semiconductor includes a board, a semiconductor element mounted on the board, an electronic component, with the semiconductor element, mounted on the board, a heat radiation member provided so as to face the board, the heat radiation member configured to radiate heat of the semiconductor element, and a thermal connecting member being configured to thermally connect the heat radiation member and the semiconductor element. A metal material is used as the thermal connecting member, and an adhesion preventing member is provided so as to be separated from the electronic component, the adhesion preventing member being configured to prevent the metal material molten and flowing at a heating time being adhered to the electronic component.

Abstract: An electronic part having mounting terminals made of a thermally-meltable bonding material is mounted on a mounting board. A structural part is used for moving a height-adjusting member to a position under the electronic part in a process of heating and melting the thermally-meltable bonding material so as to maintain a predetermined distance between the electronic part and the mounting board.

Abstract: A package unit to be mounted on an external printed board includes a package board mounted with an exoergic circuit element, a heat spreader that transmits heat from the exoergic circuit element to a heat sink that radiates the heat, a joining member that seals between the exoergic circuit element and the heat spreader, and forms a sealing space in cooperation with the exoergic circuit element and the heat spreader, and a liquid metal sealed in the sealing space.

Abstract: The object of the present invention is to provide a process for industrially advantageously producing a polymer having a high molecular weight and a narrow, monodispersed molecular weight distribution, and more particularly, a block copolymer of an anionic polymerizeable monomer and an acrylic monomer. The object of the present invention was able to be achieved by reacting an acrylic monomer with a polymer anion, the terminal of which has been modified by a compound that forms a living carbanion capable of polymerizing an anionic polymerizeable monomer by reacting with an anion, but which itself does not polymerize, in the presence of a compound represented by formula (1): (R1)nM (wherein, R1 represents a C1-C20 alkyl group or a C6-C20 aryl group, R1 may be the same or different in the case n is 2 or more, M represents an atom belonging to Group 2, 12 or 13 of the long form of the periodic table, and n represents the valency of M).

Abstract: It is intended to provide compositions to be used in resists and the like for forming fine patterns with a high sensitivity and a high resolution by increasing the difference in the solubilities between exposed parts and unexposed parts. Acid-degradable compositions contain a polymer having a repeating unit represented by the following general formula (I): wherein R1 and R2 independently represent hydrogen atom, halogen atom, C1-20 hydrocarbon group, a heterocyclic group, a cyano group, a nitro group, C(?O)R4 group, S(O)nR4 group, P(?O)(R4)2 group or M(R4)3 group; R3 represents C1-20 hydrocarbon group or a heterocyclic group: R4 represents C1-20 hydrocarbonoxy group, C1-20 hydrocarbon group, C1-20 hydrocarbonthio group or mono- or di-C1-20 hydrocarbonamino group; M represents a silicon, germanium, tin or lead atom; and n is 0, 1 or 2, and an acid or a compound capable of generating an acid in response to an external stimulus.

Abstract: A heat spreading member is received on a predetermined surface of an electronic component. The heat spreading member extends larger than the predetermined surface. A contact piece is contacted with the heat spreading member over a contact area smaller than the predetermined surface. The contact piece serves to realize concentration of an urging force applied to the heat spreading member. The heat spreading member is thus reliably urged against the electronic component. The concentration of the urging force serves to prevent the heat spreading member and the electronic component from camber even if heat is applied to the heat spreading member and the electronic component. Separation is thus avoided between the heat spreading member and the electronic component. The heat spreading member reliably keeps contacting with the electronic component, so that the electronic component package is allowed to enjoy improvement in heat radiation.

Abstract: A package unit to be mounted on an external printed board includes a package board mounted with an exoergic circuit element, a heat spreader that transmits heat from the exoergic circuit element to a heat sink that radiates the heat, a joining member that seals between the exoergic circuit element and the heat spreader, and forms a sealing space in cooperation with the exoergic circuit element and the heat spreader, and a liquid metal sealed in the sealing space.

Abstract: A refrigeration system allows the refrigerant to circulate through a closed circulation channel. A dry evaporator is incorporated in the circulation channel. The dry evaporator is designed to keep a quality smaller than 1.0 in evaporating the refrigerant. The quantity of heat transfer per unit area, namely, a heat transfer coefficient depends on the quality. The heat transfer coefficient remarkably drops when the quality of the refrigerant exceeds a predetermined threshold level before the quality actually reaches 1.0. The quality of the refrigerant kept below the predetermined threshold level during vaporization of the refrigetant in the dry evaporator allows a reliable establishment of a higher performance of cooling. On the other hand, if a refrigerant completely evaporates in a dry evaporator in a conventional manner, the heat transfer coefficient of the refrigerant remarkably drops after the quality of the refrigerant exceeds the predetermined threshold level.

Abstract: It is intended to provide compositions to be used in resists and the like for forming fine patterns with a high sensitivity and a high resolution by increasing the difference in the solubilities between exposed parts and unexposed parts. Acid-degradable compositions contain a polymer having a repeating unit represented by the following general formula (I): wherein R1 and R2 independently represent hydrogen atom, halogen atom, C1-20 hydrocarbon group, a heterocyclic group, a cyano group, a nitro group, C(?O)R4 group, S(O)nR4 group, P(?O)(R4)2 group or M(R4)3 group; R3 represents C1-20 hydrocarbon group or a heterocyclic group: R4 represents C1-20 hydrocarbonoxy group, C1-20 hydrocarbon group, C1-20 hydrocarbonthio group or mono- or di-C1-20 hydrocarbonamino group; M represents a silicon, germanium, tin or lead atom; and n is 0, 1 or 2, and an acid or a compound capable of generating an acid in response to an external stimulus.

Abstract: Plural CPUs 20-1 through 20-6 are mounted on a circuit board 11, and heat sinks 30-1 through 30-6 are mounted on these CPUS, respectively. The CPUs 20-1 through 20-6 are cooled by an air flow generated by motor fan units 14-1, 14-2, 15-1, and 15-2. The CPUs 20-1 through 20-6 are arranged such that a ratio of a sectional clearance area at the downstream side of the air flow to a sectional area of a tunnel 12 is lower than a corresponding ratio at the upstream side of the air flow. This clearance is formed between a cover member 13 and the heat sinks 30-1 through 30-6. Air flow passages 85 and 86 are formed at both sides at the upstream side. By the air flow passages 85 and 86, the amount of fresh air that is sent to the heat sinks 30-5 and 30-6 at the downstream side is increased. Accordingly, the cooling of the CPUs 20-5 and 20-6 at the downstream side is promoted compared to the conventional case.

Abstract: A refrigeration system allows the refrigerant to circulate through a closed circulation channel. A dry evaporator is incorporated in the circulation channel. The dry evaporator is designed to keep a quality smaller than 1.0 in evaporating the refrigerant. The quantity of heat transfer per unit area, namely, a heat transfer coefficient depends on the quality. The heat transfer coefficient remarkably drops when the quality of the refrigerant exceeds a predetermined threshold level before the quality actually reaches 1.0. The quality of the refrigerant kept below the predetermined threshold level during vaporization of the refrigetant in the dry evaporator allows a reliable establishment of a higher performance of cooling. On the other hand, if a refrigerant completely evaporates in a dry evaporator in a conventional manner, the heat transfer coefficient of the refrigerant *remarkably drops after the quality of the refrigerant exceeds the predetermined threshold level.

Abstract: A refrigeration system allows the refrigerant to circulate through a closed circulation channel. A dry evaporator is incorporated in the circulation channel. The dry evaporator is designed to keep a quality smaller than 1.0 in evaporating the refrigerant. The quantity of heat transfer per unit area, namely, a heat transfer coefficient depends on the quality. The heat transfer coefficient remarkably drops when the quality of the refrigerant exceeds a predetermined threshold level before the quality actually reaches 1.0. The quality of the refrigerant kept below the predetermined threshold level during vaporization of the refrigerant in the dry evaporator allows a reliable establishment of a higher performance of cooling. On the other hand, if a refrigerant completely evaporates in a dry evaporator in a conventional manner, the heat transfer coefficient of the refrigerant remarkably drops after the quality of the refrigerant exceeds the predetermined threshold level.