Abstract: An organic EL device includes at least one insulating bank disposed on a translucent substrate, a translucent electrode in contact with the bank, an organic layer containing a light-emitting layer and formed on the translucent electrode, and a reflection electrode formed on the organic layer. The bank is made from a translucent dielectric material having a low refractive index that is equal to or less than that of the organic layer. The bank has a side face that is a slope inclined with respect to the translucent substrate. The side face has a concave surface shape that faces the light-emitting layer from a slope in contact with the light-emitting layer to a slope in contact with a portion of the organic layer in the vicinity of the reflection electrode.

Abstract: The invention is directed to a method for slicing an ingot in the form of a wafer by winding a wire around a plurality of grooved rollers and pressing the wire against the ingot while making the wire travel and supplying slicing slurry to the grooved rollers, in which when the ingot is sliced, an amount of displacement of the ingot changing in an axial direction is measured and an amount of axial displacement of the grooved rollers is controlled so as to correspond to the measured amount of axial displacement of the ingot, and thereby, the ingot is sliced while controlling a relative position of the wire relative to an entire length of the ingot changing in the axial direction. As a result, a slicing method and a wire saw apparatus are provided that can perform slicing in such a way that a Bow or a Warp in a wafer obtained by slicing can be reduced, for example, by controlling a slicing path built into an ingot so that, in particular, the slicing path becomes flattened.

Abstract: On a surface of a semiconductor substrate, a plurality of terraces formed stepwise by an atomic step are formed in the substantially same direction. Using the semiconductor substrate, a MOS transistor is formed so that no step exists in a carrier traveling direction (source-drain direction).

Abstract: Provided is a polishing apparatus comprising a lower stool (12), a motor (18a) and a speed reducer (19a) for driving the lower stool, and a box (17) for covering at least the portion of the lower stool below the working action face. The polishing apparatus polishes a wafer by forcing the wafer to contact the lower stool and by rotating the lower stool. The box has its inside separated by partitions (31a and 31b) into a plurality of regions, and the motor for driving the lower stool is arranged in a region other than the region containing the lower stool. The polishing apparatus can manufacture a wafer of a stable shape, irrespective of the time elapsed from the running start and the presence/absence of the stop of the polishing apparatus.

Abstract: A multicolor molding article is integrally formed of first and second molding materials in combination. At least part of the peripheral portion in the boundary between a first molding part of the first molding material and a second molding part of the second molding material is formed with a thin projected piece. The tapering inclined angle of the thin projected piece is specified to range from 5° to 40°.

Abstract: A carrier for a double-side polishing apparatus, including at least: a carrier base placed between upper and lower turn tables, the carrier base having a holding hole therein, the holding hole holds the wafer sandwiched between the upper and lower turn tables. A ring-shaped resin ring disposed along an inner circumference of the holding hole, the resin ring protecting a chamfered portion by making contact with the chamfered portion of the held wafer, wherein the resin ring has a concave groove on an inner circumference thereof, upper and lower tapered surfaces are formed in the concave groove. A double-side polishing apparatus using the carrier and a double-side polishing method that can reduce the generation of taper in a polished surface and improve the flatness while suppressing the generation of an outer peripheral sag of the wafer.

Abstract: A carrier for a double-side polishing apparatus, including at least: a carrier base placed between upper and lower turn tables, the carrier base having a holding hole therein, the holding hole holds the wafer sandwiched between the upper and lower turn tables. A ring-shaped resin ring disposed along an inner circumference of the holding hole, the resin ring protecting a chamfered portion by making contact with the chamfered portion of the held wafer, wherein the resin ring has a concave groove on an inner circumference thereof, upper and lower tapered surfaces are formed in the concave groove. A double-side polishing apparatus using the carrier and a double-side polishing method that can reduce the generation of taper in a polished surface and improve the flatness while suppressing the generation of an outer peripheral sag of the wafer.

Abstract: A multicolor molding article is integrally formed of first and second molding materials in combination. At least part of the peripheral portion in the boundary between a first molding part of the first molding material and a second molding part of the second molding material is formed with a thin projected piece. The tapering inclined angle of the thin projected piece is specified to range from 5° to 40°.

Abstract: On a surface of a semiconductor substrate, a plurality of terraces formed stepwise by an atomic step are formed in the substantially same direction. Using the semiconductor substrate, a MOS transistor is formed so that no step exists in a carrier traveling direction (source-drain direction).

Abstract: Provided is a polishing apparatus comprising a lower stool (12), a motor (18a) and a speed reducer (19a) for driving the lower stool, and a box (17) for covering at least the portion of the lower stool below the working action face. The polishing apparatus polishes a wafer by forcing the wafer to contact the lower stool and by rotating the lower stool. The box has its inside separated by partitions (31a and 31b) into a plurality of regions, and the motor for driving the lower stool is arranged in a region other than the region containing the lower stool. The polishing apparatus can manufacture a wafer of a stable shape, irrespective of the time elapsed from the running start and the presence/absence of the stop of the polishing apparatus.

Abstract: The invention is directed to a method for slicing an ingot in the form of a wafer by winding a wire around a plurality of grooved rollers and pressing the wire against the ingot while making the wire travel and supplying slicing slurry to the grooved rollers, in which when the ingot is sliced, an amount of displacement of the ingot changing in an axial direction is measured and an amount of axial displacement of the grooved rollers is controlled so as to correspond to the measured amount of axial displacement of the ingot, and thereby, the ingot is sliced while controlling a relative position of the wire relative to an entire length of the ingot changing in the axial direction. As a result, a slicing method and a wire saw apparatus are provided that can perform slicing in such a way that a Bow or a Warp in a wafer obtained by slicing can be reduced, for example, by controlling a slicing path built into an ingot so that, in particular, the slicing path becomes flattened.

Abstract: There is provided a semiconductor wafer fabricating method comprising at least: a double-side polishing step of mirror-polishing a front surface and a back surface of a semiconductor wafer; and a mirror edge polishing step of mirror-polishing a chamfered part of the double-side-polished semiconductor wafer, wherein a protection film made of a resin which suppresses polishing is formed on the front surface or both the front and back surfaces of the semiconductor wafer after the double-side polishing step, then the mirror edge polishing step is carried out, and thereafter the protection film made of a resin is removed. As a result, it is possible to provide a step of eliminating an increase in a cost due to, e.g.

Abstract: A presser member (1) of the present invention is formed of different materials for the contacting part (5) to press-hold the precision substrates (15) and for the parts other than the contacting part (5). The presser member (1) is shaped from a thermoplastic elastomer for a rectangular frame part, and the contacting part (5) has a pair of structuring parts (4) provided in such a fashion as to inwardly extend from each of a pair of oppositely facing sides. A second contacting part (11) is formed in the extension peripheral part extending via a supporting part (10). The other parts are shaped from a thermoplastic resin. The aforementioned contacting part (5) is provided with grooves of a V-shaped cross section with inclinations changed in the middle for receiving the peripheries of precision substrates (15), and V-grooves for press-holding the peripheries of precision substrates are provided in resilient pieces (12) separated and protruding in a comb teeth-like fashion to form the second contacting part (11).

Abstract: Provided are a gasket member for a substrate-holding container which is little liable to contamination of the substrate materials contained with organic matters due to the low content of organic matters to be emitted as a gas still without decreasing the operability in opening and closing of the covering as well as a substrate-holding container by using the same. The gasket member for a substrate-holding container provided is formed from a thermoplastic polyester-based elastomer resin containing absolutely no softening agent and having a surface hardness not exceeding 80A by the hardness testing method specified in JIS K6301, of which the amount of gas emission as determined under heating conditions for 60 minutes at 80° C. does not exceed 10 ppm based on the weight of the material. Disclosure is given of a polyester-based block copolymer suitable as a molding material of the said gasket member.

Abstract: An object of the present invention is to provide a phase-change optical recording medium of an amorphous recording mark type. The optical recording medium is a write once type medium capable of decreasing the degradation of an information signal which has been already recorded. The recording layer of the optical recording medium according to the present invention includes a first recording layer and a second recording layer. The first recording layer comprises a first composition which can be changed into another composition more stable in an amorphous state by combining with a component included in the second recording layer.

Abstract: A film constitution in an optical recording medium including a light incident side substrate and a light reflecting side substrate cooperatively acting as a base of the medium, and includes, between these substrates, those layers formed by sputtering so as to constitute a laminated structure, which layers include: a phase-change recording layer to be phase-changed between an amorphous phase and a crystal phase by laser light irradiation; a first dielectric layer and a second dielectric layer, each having a protective function and an optical adjusting function for the phase-change recording layer; a reflecting film layer for reflecting the laser light transmitted through the phase-change recording layer; a hardness enhancing layer for enhancing the mechanical strength of the medium; and a protecting layer having a function for reducing thermal damages to the light incident side substrate and an optical adjusting function.

Abstract: Provided are a gasket member for a substrate-holding container which is little liable to contamination of the substrate materials contained with organic matters due to the low content of organic matters to be emitted as a gas still without decreasing the operability in opening and closing of the covering as well as a substrate-holding container by using the same. The gasket member for a substrate-holding container provided is formed from a thermoplastic polyester-based elastomer resin containing absolutely no softening agent and having a surface hardness not exceeding 80A by the hardness testing method specified in JIS K6301, of which the amount of gas emission as determined under heating conditions for 60 minutes at 80° C. does not exceed 10 ppm based on the weight of the material. Disclosure is given of a polyester-based block copolymer suitable as a molding material of the said gasket member.

Abstract: A multi-layer optical recording medium includes a light transmissive intermediate layer. This intermediate layer is formed by at least two times of laminating steps. The recording medium has smaller bending, and the intermediate layer has uniform thickness.

Abstract: An object of the present invention is to provide a phase-change optical recording medium of an amorphous recording mark type. The optical recording medium is a write once type medium capable of decreasing the degradation of an information signal which has been already recorded. The recording layer of the optical recording medium according to the present invention includes a first recording layer and a second recording layer. The first recording layer comprises a first composition which can be changed into another composition more stable in an amorphous state by combining with a component included in the second recording layer.

Abstract: The presser member (1) of the present invention is shaped from different materials for the contacting part (5) to press-hold the precision substrates (15) and for the parts excepting the said contacting part (5). The presser member (1) is shaped from a thermoplastic elastomer for a rectangular frame part, a contacting part (5) formed in a pair of structuring parts (4) provided in such a fashion as to inwardly extend from each of a pair of oppositely facing two sides and a second contacting part (11) formed in the extension peripheral part extending via a supporting part (10), the other parts being shaped from a thermoplastic resin.