Patents by Inventor Hideo Matsuoka
Hideo Matsuoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11955640Abstract: An inorganic particle layer for use in an electrode of a non-aqueous electrolyte power storage element is provided. The inorganic particle layer includes an inorganic particle and a polymer. The inorganic particle is insulating and has a surface potential. The polymer has an ionic functional group (A) and an ion-conducting functional group (B) each charged opposite to the surface potential of the inorganic particle. The inorganic particle and the polymer are bonded to each other.Type: GrantFiled: October 31, 2019Date of Patent: April 9, 2024Assignee: Ricoh Company, Ltd.Inventors: Yuu Zama, Masahiro Masuzawa, Kohji Matsuoka, Hideo Yanagita, Ryuji Higashi, Anna Hirowatari
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Patent number: 11774952Abstract: A management apparatus manages works to supply components to component mounting devices in a component mounting line. The management apparatus includes a component remaining number information acquisition portion that acquires, from each of the component mounting devices, a remaining number of components stored in the component mounting device, a worker information storage portion that stores worker information including a working range of each of workers in the component mounting line, a work sequence decision portion that generates work sequence information indicating a work sequence of component supply works for each of the workers based on the worker information and component remaining number information about a plurality of components within a predetermined period of time, and an information transmission portion that transmits the work sequence information to the workers who should perform the works.Type: GrantFiled: October 27, 2022Date of Patent: October 3, 2023Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Atsushi Nakazono, Hisashi Maezono, Kazunori Tomotake, Hideo Matsuoka
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Publication number: 20230073424Abstract: A management apparatus manages works to supply components to component mounting devices in a component mounting line. The management apparatus includes a component remaining number information acquisition portion that acquires, from each of the component mounting devices, a remaining number of components stored in the component mounting device, a worker information storage portion that stores worker information including a working range of each of workers in the component mounting line, a work sequence decision portion that generates work sequence information indicating a work sequence of component supply works for each of the workers based on the worker information and component remaining number information about a plurality of components within a predetermined period of time, and an information transmission portion that transmits the work sequence information to the workers who should perform the works.Type: ApplicationFiled: October 27, 2022Publication date: March 9, 2023Inventors: Atsushi NAKAZONO, Hisashi MAEZONO, Kazunori TOMOTAKE, Hideo MATSUOKA
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Patent number: 11526157Abstract: A management apparatus manages works to supply components to component mounting devices in a component mounting line. The management apparatus includes a component remaining number information acquisition portion that acquires, from each of the component mounting devices, a remaining number of components stored in the component mounting device, a worker information storage portion that stores worker information including a working range of each of workers in the component mounting line, a work sequence decision portion that generates work sequence information indicating a work sequence of component supply works for each of the workers based on the worker information and component remaining number information about a plurality of components within a predetermined period of time, and an information transmission portion that transmits the work sequence information to the workers who should perform the works.Type: GrantFiled: April 30, 2021Date of Patent: December 13, 2022Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Atsushi Nakazono, Hisashi Maezono, Kazunori Tomotake, Hideo Matsuoka
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Patent number: 11358643Abstract: This composite structure is characterized in that: an internally inserted component, which is molded from a resin material having a tensile elongation of 10% or more, is placed inside a metal member having a hollow closed cross-section such that an external load can be received by both the internally inserted component and the metal member, and the outer shape of the internally inserted component occupies 50% or more relative to the hollow closed cross-section of the metal member as projection area ratio. By disposing the resin-made internally inserted component having a specific toughness at a specified state inside the metal member having a hollow closed cross-section, especially when a collision load occurs, the metal member undergoes ductile deformation and the internally inserted component also deforms correspondingly, and thus the waveform of the load-displacement curve can approach an ideal rectangular waveform, and excellent impact energy absorbing performance can be exhibited.Type: GrantFiled: March 1, 2019Date of Patent: June 14, 2022Assignee: TORAY INDUSTRIES, INC.Inventors: Hideo Matsuoka, Kosaku Hashimoto, Yukitane Kimoto
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Patent number: 11160201Abstract: A component mounting system includes a component mounting apparatus, a data creating apparatus and a component arranging operation supporting apparatus. The component mounting apparatus mounts components on a substrate. The data creating apparatus creates component data for each component. The component arranging operation supporting apparatus includes an identification information acquiring unit that acquires component identification information given to the component supplying member, and a control unit which checks a component to be disposed in a position based on the component identification information. The control unit of the component arranging operation supporting apparatus performs a request for a creation of component data regarding an alternative component, and the data creating apparatus receives the request and creates the component data regarding the alternative component.Type: GrantFiled: June 11, 2015Date of Patent: October 26, 2021Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventor: Hideo Matsuoka
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Publication number: 20210247747Abstract: A management apparatus manages works to supply components to component mounting devices in a component mounting line. The management apparatus includes a component remaining number information acquisition portion that acquires, from each of the component mounting devices, a remaining number of components stored in the component mounting device, a worker information storage portion that stores worker information including a working range of each of workers in the component mounting line, a work sequence decision portion that generates work sequence information indicating a work sequence of component supply works for each of the workers based on the worker information and component remaining number information about a plurality of components within a predetermined period of time, and an information transmission portion that transmits the work sequence information to the workers who should perform the works.Type: ApplicationFiled: April 30, 2021Publication date: August 12, 2021Inventors: Atsushi NAKAZONO, Hisashi MAEZONO, Kazunori TOMOTAKE, Hideo MATSUOKA
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Patent number: 11029670Abstract: A management apparatus manages works to supply components to component mounting devices in a component mounting line. The management apparatus includes a component remaining number information acquisition portion that acquires, from each of the component mounting devices, a remaining number of components stored in the component mounting device, a worker information storage portion that stores worker information including a working range of each of workers in the component mounting line, a work sequence decision portion that generates work sequence information indicating a work sequence of component supply works for each of the workers based on the worker information and component remaining number information about a plurality of components within a predetermined period of time, and an information transmission portion that transmits the work sequence information to the workers who should perform the works.Type: GrantFiled: March 2, 2020Date of Patent: June 8, 2021Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Atsushi Nakazono, Hisashi Maezono, Kazunori Tomotake, Hideo Matsuoka
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Publication number: 20210129456Abstract: A fiber bundle affixing device comprises an affixing head configured to affix fiber bundles that have been cut in advance to a predetermined length, one by one to an affixing surface under heating and/or pressure. The affixing head includes a heater configured to heat the fiber bundles and/or the affixing surface, and a feeder configured to hold and/or convey only one fiber bundle that is being affixed by the affixing head during an affixing operation of affixing the fiber bundles by the affixing head.Type: ApplicationFiled: March 2, 2018Publication date: May 6, 2021Inventors: Jun INAGAKI, Shimpei AOKI, Toshifumi TAKEGAMI, Masato SUGAMORI, Kimihiko HATTORI, Hideo MATSUOKA
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Patent number: 10919271Abstract: A composite molded article has (A) a fiber-reinforced resin molded article (A) including a fiber-reinforced resin having a polyamide-based resin as a matrix resin, a molded article (B) including a modified vinyl-based copolymer, and a molded article (C) including a styrene-based resin layered in this order. A layer (B) including a modified vinyl-based copolymer is interposed as a joining layer between a layer (A) of a fiber-reinforced resin having a polyamide-based resin as a matrix resin and a layer (C) including a styrene-based resin, whereby a composite molded article can be obtained in which the layers (A), (B) and (C) are strongly joined and integrated, and a composite molded article can be obtained which has excellent characteristics not realizable by a single layer of the layer (A) or the layer (C).Type: GrantFiled: December 14, 2016Date of Patent: February 16, 2021Assignee: Toray Industries, Inc.Inventors: Kimihiko Hattori, Shinsuke Hidaka, Hideo Matsuoka
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Publication number: 20210039717Abstract: This composite structure is characterized in that: an internally inserted component, which is molded from a resin material having a tensile elongation of 10% or more, is placed inside a metal member having a hollow closed cross-section such that an external load can be received by both the internally inserted component and the metal member, and the outer shape of the internally inserted component occupies 50% or more relative to the hollow closed cross-section of the metal member as projection area ratio. By disposing the resin-made internally inserted component having a specific toughness at a specified state inside the metal member having a hollow closed cross-section, especially when a collision load occurs, the metal member undergoes ductile deformation and the internally inserted component also deforms correspondingly, and thus the waveform of the load-displacement curve can approach an ideal rectangular waveform, and excellent impact energy absorbing performance can be exhibited.Type: ApplicationFiled: March 1, 2019Publication date: February 11, 2021Applicant: TORAY INDUSTRIES, INC.Inventors: Hideo MATSUOKA, Kosaku HASHIMOTO, Yukitane KIMOTO
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Publication number: 20200201302Abstract: A management apparatus manages works to supply components to component mounting devices in a component mounting line. The management apparatus includes a component remaining number information acquisition portion that acquires, from each of the component mounting devices, a remaining number of components stored in the component mounting device, a worker information storage portion that stores worker information including a working range of each of workers in the component mounting line, a work sequence decision portion that generates work sequence information indicating a work sequence of component supply works for each of the workers based on the worker information and component remaining number information about a plurality of components within a predetermined period of time, and an information transmission portion that transmits the work sequence information to the workers who should perform the works.Type: ApplicationFiled: March 2, 2020Publication date: June 25, 2020Inventors: Atsushi NAKAZONO, Hisashi MAEZONO, Kazunori TOMOTAKE, Hideo MATSUOKA
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Patent number: 10675787Abstract: A method of manufacturing a composite molded body includes a first step of introducing an FRP base material into a mold via a slit part provided in the mold, and inserting the FRP base material along a mold cavity; and a second step of injecting a molten thermoplastic resin composition A into the mold cavity to form the FRP base material into a three-dimensional shape and integrate the injected thermoplastic resin composition A and the FRP base material. The method makes it possible to easily and accurately mold a composite molded body of which a desired portion is efficiently and accurately reinforced in the same mold.Type: GrantFiled: December 14, 2016Date of Patent: June 9, 2020Assignee: Toray Industries, Inc.Inventors: Kimihiko Hattori, Masato Sugamori, Kazuyoshi Nakano, Yoshito Kuroda, Hideo Matsuoka, Tomoyuki Onodera, Yoshiyuki Honda, Nobuhiko Shimizu
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Publication number: 20200171724Abstract: A composite molded article is obtained by laminating (A) a fiber-reinforced resin molded article comprising a fiber-reinforced resin having a polyamide-based resin as a matrix resin, (B) a molded article comprising a polyolefin-based resin containing an epoxy group and/or a glycidyl group, and (C) a molded article having at least one selected from a polyester-based resin, a polyethylene-based resin and a polyarylene sulfide-based resin as a matrix resin, in this order, and a method produces the same.Type: ApplicationFiled: December 14, 2016Publication date: June 4, 2020Inventors: Shinsuke Hidaka, Kimihiko Hattori, Hideo Matsuoka
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Patent number: 10620614Abstract: A management apparatus manages works to supply components to component mounting devices in a component mounting line. The management apparatus includes a component remaining number information acquisition portion that acquires, from each of the component mounting devices, a remaining number of components stored in the component mounting device, a worker information storage portion that stores worker information including a working range of each of workers in the component mounting line, a work sequence decision portion that generates work sequence information indicating a work sequence of component supply works for each of the workers based on the worker information and component remaining number information about a plurality of components within a predetermined period of time, and an information transmission portion that transmits the work sequence information to the workers who should perform the works.Type: GrantFiled: November 10, 2015Date of Patent: April 14, 2020Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Atsushi Nakazono, Hisashi Maezono, Kazunori Tomotake, Hideo Matsuoka
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Patent number: 10587061Abstract: Provided is an electrical junction box with a novel structure with which the occurrence of solder cracks can be advantageously avoided, while also achieving a reduction in manufacturing costs. In an electrical junction box including an terminal-equipped printed circuit board in which an intermediate section of a board terminal in the length direction is press-fitted into and held by a resin block, and a lead portion of the board terminal is connected to a conductive path of a printed circuit board by soldering, the resin block is formed of a flat-shaped printed circuit board base material, and is arranged on the printed circuit board with a gap therebetween, and the resin block is supported in a fixed position on the printed circuit board by a block-receiving portion that is separate from the resin block.Type: GrantFiled: October 17, 2017Date of Patent: March 10, 2020Assignee: Sumitomo Wiring Systems, Ltd.Inventor: Hideo Matsuoka
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Publication number: 20190288419Abstract: Provided is an electrical junction box with a novel structure with which the occurrence of solder cracks can be advantageously avoided, while also achieving a reduction in manufacturing costs. In an electrical junction box including an terminal-equipped printed circuit board in which an intermediate section of a board terminal in the length direction is press-fitted into and held by a resin block, and a lead portion of the board terminal is connected to a conductive path of a printed circuit board by soldering, the resin block is formed of a flat-shaped printed circuit board base material, and is arranged on the printed circuit board with a gap therebetween, and the resin block is supported in a fixed position on the printed circuit board by a block-receiving portion that is separate from the resin block.Type: ApplicationFiled: October 17, 2017Publication date: September 19, 2019Inventor: Hideo Matsuoka
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Publication number: 20190030760Abstract: A method of manufacturing a composite molded body includes a first step of introducing an FRP base material into a mold via a slit part provided in the mold, and inserting the FRP base material along a mold cavity; and a second step of injecting a molten thermoplastic resin composition A into the mold cavity to form the FRP base material into a three-dimensional shape and integrate the injected thermoplastic resin composition A and the FRP base material. The method makes it possible to easily and accurately mold a composite molded body of which a desired portion is efficiently and accurately reinforced in the same mold.Type: ApplicationFiled: December 14, 2016Publication date: January 31, 2019Inventors: Kimihiko Hattori, Masato Sugamori, Kazuyoshi Nakano, Yoshito Kuroda, Hideo Matsuoka, Tomoyuki Onodera, Yoshiyuki Honda, Nobuhiko Shimizu
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Publication number: 20190022905Abstract: A composite molded article has (A) a fiber-reinforced resin molded article (A) including a fiber-reinforced resin having a polyamide-based resin as a matrix resin, a molded article (B) including a modified vinyl-based copolymer, and a molded article (C) including a styrene-based resin layered in this order. A layer (B) including a modified vinyl-based copolymer is interposed as a joining layer between a layer (A) of a fiber-reinforced resin having a polyamide-based resin as a matrix resin and a layer (C) including a styrene-based resin, whereby a composite molded article can be obtained in which the layers (A), (B) and (C) are strongly joined and integrated, and a composite molded article can be obtained which has excellent characteristics not realizable by a single layer of the layer (A) or the layer (C).Type: ApplicationFiled: December 14, 2016Publication date: January 24, 2019Inventors: Kimihiko Hattori, Shinsuke Hidaka, Hideo Matsuoka
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Publication number: 20190001641Abstract: A composite molded article has a fiber-reinforced resin molded article (A) including a fiber-reinforced resin in which a polyamide-based resin is used as a matrix resin, a molded article (B) including an acid-modified-olefin-based copolymer, a molded article (C) including an unmodified-olefin-based polymer not containing an acid, and a molded article (D) including a polypropylene-based polymer layered in this order. The layer (B) including an acid-modified-olefin-based copolymer and the layer (C) including an unmodified-olefin-based polymer not containing an acid are interposed as joining layers between the layer (A) of the fiber-reinforced resin in which a polyamide-based resin is used as a matrix resin and the layer (D) including a polypropylene-based polymer, whereby a composite molded article can be obtained in which the layers (A), (B), (C) and (D) are strongly joined and integrated.Type: ApplicationFiled: December 14, 2016Publication date: January 3, 2019Inventors: Shinsuke Hidaka, Kimihiko Hattori, Hideo Matsuoka