Patents by Inventor Hideo Nakagoshi

Hideo Nakagoshi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HOLDING JIG FOR ELECTRONIC PARTS
    Publication number: 20100018041
    Abstract: An elastic material, in which at least the surface thereof is adhesive and conductive, is provided on a plate, and while a substrate constituting a component of an electronic part is held on the surface of the elastic material by the adhesiveness of the elastic material, an element such as a semiconductor chip is mounted at a fixed location on the substrate.
    Type: Application
    Filed: October 6, 2009
    Publication date: January 28, 2010
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Akio Katsube, Hideo Nakagoshi, Hidemasa Kawai
  • Method for manufacturing electronic parts
    Patent number: 7624492
    Abstract: An elastic material, in which at least the surface thereof is adhesive and conductive, is provided on a plate, and while a substrate constituting a component of an electronic part is held on the surface of the elastic material by the adhesiveness of the elastic material, an element such as a semiconductor chip is mounted at a fixed location on the substrate.
    Type: Grant
    Filed: October 13, 2000
    Date of Patent: December 1, 2009
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Akio Katsube, Hideo Nakagoshi, Hidemasa Kawai
  • SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT MODULE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    Publication number: 20090072383
    Abstract: A semiconductor element is provided with a heat dissipating path defined by a non-through hole in a first principal surface and that is filled with a conductive material. The semiconductor element is bonded to a heat sink with the conductive material disposed therebetween. Solder can be used as the conductive material, for example. By introducing molten solder into the non-through hole while having solder disposed between the semiconductor element and the heat sink, the heat dissipating path is provided and the heat sink is bonded to the semiconductor element.
    Type: Application
    Filed: November 25, 2008
    Publication date: March 19, 2009
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventor: Hideo Nakagoshi