Patents by Inventor Hideo Nakako
Hideo Nakako has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11890681Abstract: An embodiment of the present invention provides a method for producing a bonded object. The method comprises a step for preparing a laminate in which a first member, a copper bonding paste, and a second member are laminated in order and a step for sintering the copper bonding paste under a pressure of 0.1-1 MPa. The copper bonding paste contains metal particles and a dispersion medium, wherein the content of metal particles is at 50 mass % or more with respect to the total mass of the copper bonding paste, and the metal particles contain 95 mass % or more of submicro copper particles with respect to the total mass of the metal particles.Type: GrantFiled: November 29, 2018Date of Patent: February 6, 2024Assignee: RESONAC CORPORATIONInventors: Yuki Kawana, Hideo Nakako, Motohiro Negishi, Chie Sugama, Yoshinori Ejiri, Yuichi Yanaka
-
Patent number: 11887960Abstract: This member connection method includes a printing step. In the printing step, a coating film-formed region in which the coating film is formed, and a coating film non-formed region in which the coating film is not formed are formed in the print pattern, and the coating film-formed region is divided into a plurality of concentric regions and a plurality of radial regions by means of a plurality of line-shaped regions provided so as to connect various points, which are separated apart from one another in the marginal part of the connection region.Type: GrantFiled: October 23, 2018Date of Patent: January 30, 2024Assignee: RESONAC CORPORATIONInventors: Motohiro Negishi, Hideo Nakako, Yuki Kawana, Dai Ishikawa, Chie Sugama, Yoshinori Ejiri
-
Publication number: 20230356294Abstract: Provided is a copper paste for forming a wick of a heat pipe, the copper paste containing copper particles, thermally decomposable resin particles, a dispersion medium for dispersing the copper particles and the thermally decomposable resin particles, and a thermally decomposable resin that is soluble in the dispersion medium.Type: ApplicationFiled: September 16, 2021Publication date: November 9, 2023Inventors: Hideo NAKAKO, Toshiaki TANAKA, Dai ISHIKAWA, Yoshinori EJIRI, Michiko NATORI
-
Patent number: 11575076Abstract: A method for manufacturing a thermoelectric conversion module of the present invention is a method for manufacturing a thermoelectric conversion module including a thermoelectric semiconductor part in which a plurality of p-type semiconductors and a plurality of n-type semiconductors are alternately arranged, and a high temperature side electrode bound to a binding surface of the p-type semiconductor and the n-type semiconductor on a high temperature heat source side and a low temperature side electrode bound to a binding surface of the p-type semiconductor and the n-type semiconductor on a low temperature heat source side, which electrically connect the p-type semiconductor and the n-type semiconductor adjacent to each other in series, and includes a binding step of binding at least one of the high temperature side electrode and the low temperature side electrode, and the p-type semiconductor and the n-type semiconductor together, by sintering a binding layer containing metal particles, which is provided betType: GrantFiled: October 24, 2018Date of Patent: February 7, 2023Assignee: Showa Denko Materials Co., Ltd.Inventors: Motohiro Negishi, Yuki Kawana, Dai Ishikawa, Chie Sugama, Hideo Nakako, Yoshinori Ejiri
-
Patent number: 11532588Abstract: A copper paste for pressureless bonding is a copper paste for pressureless bonding, containing: metal particles; and a dispersion medium, in which the metal particles include sub-micro copper particles having a volume average particle diameter of greater than or equal to 0.01 ?m and less than or equal to 0.8 ?m, and micro copper particles having a volume average particle diameter of greater than or equal to 2.0 ?m and less than or equal to 50 ?m, and the dispersion medium contains a solvent having a boiling point of higher than or equal to 300° C., and a content of the solvent having a boiling point of higher than or equal to 300° C. is greater than or equal to 2 mass % on the basis of a total mass of the copper paste for pressureless bonding.Type: GrantFiled: January 21, 2021Date of Patent: December 20, 2022Assignee: SHOWA DENKO MATERIALS CO., LTD.Inventors: Hideo Nakako, Kazuhiko Kurafuchi, Yoshinori Ejiri, Dai Ishikawa, Chie Sugama, Yuki Kawana
-
Publication number: 20220371087Abstract: A copper paste for joining contains metal particles and a dispersion medium, in which the copper paste for joining contains copper particles as the metal particles, and the copper paste for joining contains dihydroterpineol as the dispersion medium. A method for manufacturing a joined body is a method for manufacturing a joined body which includes a first member, a second member, and a joining portion that joins the first member and the second member, the method including: a first step of printing the above-described copper paste for joining to at least one joining surface of the first member and the second member to prepare a laminate having a laminate structure in which the first member, the copper paste for joining, and the second member are laminated in this order; and a second step of sintering the copper paste for joining of the laminate.Type: ApplicationFiled: September 30, 2019Publication date: November 24, 2022Inventors: Motohiro NEGISHI, Hideo NAKAKO, Michiko NATORI, Dai ISHIKAWA, Chie SUGAMA, Yuki KAWANA
-
Patent number: 11483936Abstract: Provided is a method for producing a joined body, the method including a first step of preparing a laminated body which includes a first member having a metal pillar provided on a surface thereof, a second member having an electrode pad provided on a surface thereof, and a joining material provided between the metal pillar and the electrode pad and containing metal particles and an organic compound, and a second step of heating the laminated body to sinter the joining material at a predetermined sintering temperature, in which the joining material satisfies the condition of the following Formula (I): (M1?M2)/M1×100?1.0??(I) [in Formula (I), M1 represents a mass of the joining material when a temperature of the joining material reaches the sintering temperature in the second step, and M2 represents a non-volatile content in the joining material.Type: GrantFiled: November 8, 2018Date of Patent: October 25, 2022Assignee: Showa Denko Materials Co., Ltd.Inventors: Hideo Nakako, Yoshinori Ejiri, Dai Ishikawa, Chie Sugama, Yuki Kawana, Motohiro Negishi, Yuichi Yanaka
-
Patent number: 11462502Abstract: Provided is a metal paste for joints, containing: metal particles; and linear or branched monovalent aliphatic alcohol having 1 to 20 carbon atoms, in which the metal particles include sub-micro copper particles having a volume average particle diameter of 0.12 ?m to 0.8 ?M.Type: GrantFiled: January 18, 2018Date of Patent: October 4, 2022Assignee: Showa Denko Materials Co., Ltd.Inventors: Yuki Kawana, Hideo Nakako, Motohiro Negishi, Dai Ishikawa, Chie Sugama, Yoshinori Ejiri
-
Publication number: 20220230918Abstract: An aspect of the invention is a method for producing a substrate having through-silicon vias, the method including a preparation step of preparing a silicon substrate provided with through-holes, in which the through-holes communicate with both principal surfaces; a copper sintered body formation step of forming a copper sintered body having a porous structure such that the copper sintered body fills at least the through-holes; a resin impregnation step of impregnating the copper sintered body with a curable resin composition; and a resin curing step of curing the curable resin composition impregnated into the copper sintered body to form an electric conductor that includes the copper sintered body having pores filled with a resin cured product, and providing through-silicon vias in the through-holes.Type: ApplicationFiled: April 24, 2019Publication date: July 21, 2022Inventors: Yoshinori EJIRI, Hideo NAKAKO, Yuki KAWANA, Motoki YONEKURA, Shinichirou SUKATA, Manabu ISHII, Masaru FUJITA, Michiko NATORI, Masahiro KIMURA, Ryo HONNA
-
Patent number: 11370066Abstract: Provided is A metal paste for joints, containing: metal particles; and monovalent carboxylic acid having 1 to 9 carbon atoms, in which the metal particles include sub-micro copper particles having a volume average particle diameter of 0.12 ?m to 0.8 ?m, and a content of the monovalent carboxylic acid having 1 to 9 carbon atoms is 0.015 part by mass to 0.2 part by mass with respect to 100 parts by mass of the metal particles.Type: GrantFiled: January 18, 2018Date of Patent: June 28, 2022Assignee: Showa Denko Materials Co., Ltd.Inventors: Yuki Kawana, Hideo Nakako, Motohiro Negishi, Dai Ishikawa, Chie Sugama, Yoshinori Ejiri
-
Publication number: 20220053647Abstract: One aspect of the present invention is a method for manufacturing an electronic component, the method including: a first step of applying a metal paste containing metal particles onto a polymer compact in a prescribed pattern to form a metal paste layer; a second step of sintering the metal particles to form metal wiring; a third step of applying a solder paste containing solder particles and a resin component onto the metal wiring to form a solder paste layer; a fourth step of disposing an electronic element on the solder paste layer; and a fifth step of heating the solder paste layer so as to form a solder layer bonding the metal wiring and the electronic element, and so as to form a resin layer covering at least a portion of the solder layer.Type: ApplicationFiled: September 5, 2019Publication date: February 17, 2022Applicant: Showa Denko Materials Co., Ltd.Inventors: Yoshinori EJIRI, Shinichirou SUKATA, Masaya TOBA, Hideo NAKAKO, Yuki KAWANA, Kosuke URASHIMA, Motoki YONEKURA, Takaaki NOHDOH, Yoshiaki KURIHARA, Hiroshi MASUDA, Keita SONE
-
Publication number: 20220028824Abstract: An embodiment of the present invention provides a method for producing a bonded object. The method comprises a step for preparing a laminate in which a first member, a copper bonding paste, and a second member are laminated in order and a step for sintering the copper bonding paste under a pressure of 0.1-1 MPa. The copper bonding paste contains metal particles and a dispersion medium, wherein the content of metal particles is at 50 mass % or more with respect to the total mass of the copper bonding paste, and the metal particles contain 95 mass % or more of submicro copper particles with respect to the total mass of the metal particles.Type: ApplicationFiled: November 29, 2018Publication date: January 27, 2022Applicant: Showa Denko Materials Co., Ltd.Inventors: Yuki KAWANA, Hideo NAKAKO, Motohiro NEGISHI, Chie SUGAMA, Yoshinori EJIRI, Yuichi YANAKA
-
Publication number: 20210351157Abstract: This member connection method includes a printing step. In the printing step, a coating film-formed region in which the coating film is formed, and a coating film non-formed region in which the coating film is not formed are formed in the print pattern, and the coating film-formed region is divided into a plurality of concentric regions and a plurality of radial regions by means of a plurality of line-shaped regions provided so as to connect various points, which are separated apart from one another in the marginal part of the connection region.Type: ApplicationFiled: October 23, 2018Publication date: November 11, 2021Inventors: Motohiro NEGISHI, Hideo NAKAKO, Yuki KAWANA, Dai ISHIKAWA, Chie SUGAMA, Yoshinori EJIRI
-
Patent number: 11040416Abstract: Provided is copper paste for joining including metal particles, and a dispersion medium. The metal particles include sub-micro copper particles having a volume-average particle size of 0.12 ?m to 0.8 ?m, and flake-shaped micro copper particles having a maximum particle size of 1 ?m to 20 ?m, and an aspect ratio of 4 or greater, and the amount of the micro copper particles contained, which are included in the metal particles and have a maximum particle size of 1 ?m to 20 ?m and an aspect ratio of less than 2, is 50% by mass or less on the basis of a total amount of the flake-shaped micro copper particles.Type: GrantFiled: September 7, 2016Date of Patent: June 22, 2021Assignee: Showa Denko Materials Co., Ltd.Inventors: Dai Ishikawa, Yuki Kawana, Chie Sugama, Hideo Nakako, Yoshinori Ejiri, Kazuhiko Kurafuchi
-
Publication number: 20210143121Abstract: A copper paste for pressureless bonding is a copper paste for pressureless bonding, containing: metal particles; and a dispersion medium, in which the metal particles include sub-micro copper particles having a volume average particle diameter of greater than or equal to 0.01 ?m and less than or equal to 0.8 ?m, and micro copper particles having a volume average particle diameter of greater than or equal to 2.0 ?m and less than or equal to 50 ?m, and the dispersion medium contains a solvent having a boiling point of higher than or equal to 300° C., and a content of the solvent having a boiling point of higher than or equal to 300° C. is greater than or equal to 2 mass % on the basis of a total mass of the copper paste for pressureless bonding.Type: ApplicationFiled: January 21, 2021Publication date: May 13, 2021Inventors: Hideo NAKAKO, Kazuhiko KURAFUCHI, Yoshinori EJIRI, Dai ISHIKAWA, Chie SUGAMA, Yuki KAWANA
-
Patent number: 10930612Abstract: A copper paste for pressureless bonding is a copper paste for pressureless bonding, containing: metal particles; and a dispersion medium, in which the metal particles include sub-micro copper particles having a volume average particle diameter of greater than or equal to 0.01 ?m and less than or equal to 0.8 ?m, and micro copper particles having a volume average particle diameter of greater than or equal to 2.0 ?m and less than or equal to 50 ?m, and the dispersion medium contains a solvent having a boiling point of higher than or equal to 300° C., and a content of the solvent having a boiling point of higher than or equal to 300° C. is greater than or equal to 2 mass % on the basis of a total mass of the copper paste for pressureless bonding.Type: GrantFiled: January 11, 2017Date of Patent: February 23, 2021Assignee: Showa Denko Materials Co., Ltd.Inventors: Hideo Nakako, Kazuhiko Kurafuchi, Yoshinori Ejiri, Dai Ishikawa, Chie Sugama, Yuki Kawana
-
Publication number: 20200344893Abstract: Provided is a method for producing a joined body, the method including a first step of preparing a laminated body which includes a first member having a metal pillar provided on a surface thereof, a second member having an electrode pad provided on a surface thereof, and a joining material provided between the metal pillar and the electrode pad and containing metal particles and an organic compound, and a second step of heating the laminated body to sinter the joining material at a predetermined sintering temperature, in which the joining material satisfies the condition of the following Formula (I): (M1?M2)/M1×100?1.0??(I) [in Formula (I), M1 represents a mass of the joining material when a temperature of the joining material reaches the sintering temperature in the second step, and M2 represents a non-volatile content in the joining material.Type: ApplicationFiled: November 8, 2018Publication date: October 29, 2020Inventors: Hideo NAKAKO, Yoshinori EJIRI, Dai ISHIKAWA, Chie SUGAMA, Yuki KAWANA, Motohiro NEGISHI, Yuichi YANAKA
-
Publication number: 20200295248Abstract: A method for manufacturing a thermoelectric conversion module of the present invention is a method for manufacturing a thermoelectric conversion module including a thermoelectric semiconductor part in which a plurality of p-type semiconductors and a plurality of n-type semiconductors are alternately arranged, and a high temperature side electrode bound to a binding surface of the p-type semiconductor and the n-type semiconductor on a high temperature heat source side and a low temperature side electrode bound to a binding surface of the p-type semiconductor and the n-type semiconductor on a low temperature heat source side, which electrically connect the p-type semiconductor and the n-type semiconductor adjacent to each other in series, and includes a binding step of binding at least one of the high temperature side electrode and the low temperature side electrode, and the p-type semiconductor and the n-type semiconductor together, by sintering a binding layer containing metal particles, which is provided betType: ApplicationFiled: October 24, 2018Publication date: September 17, 2020Inventors: Motohiro NEGISHI, Yuki KAWANA, Dai ISHIKAWA, Chie SUGAMA, Hideo NAKAKO, Yoshinori EJIRI
-
Patent number: 10748865Abstract: Provided is a copper paste for joining including copper particles, second particles including a metal element other than copper, and a dispersion medium, in which the copper particles include submicro copper particles having a volume-average particle diameter of 0.12 ?m or more and 0.8 ?m or less and micro copper particles having a volume-average particle diameter of 2 ?m or more and 50 ?m or less, a sum of a content of the submicro copper particles and a content of the micro copper particles is 80% by mass or more of a sum of masses of the copper particles and the second particles, the content of the submicro copper particles is 30% by mass or more and 90% by mass or less of a sum of a mass of the submicro copper particles and a mass of the micro copper particles, and a content of the second particles is 0.01% by mass or more and 10% by mass or less of the sum of the masses of the copper particles and the second particles.Type: GrantFiled: April 20, 2017Date of Patent: August 18, 2020Assignee: HITACHI CHEMICAL COMPANY, LTD.Inventors: Yuki Kawana, Hideo Nakako, Dai Ishikawa, Chie Sugama, Kazuhiko Kurafuchi, Yoshinori Ejiri
-
Publication number: 20200176411Abstract: Provided is a copper paste for joining including copper particles, second particles including a metal element other than copper, and a dispersion medium, in which the copper particles include submicro copper particles having a volume-average particle diameter of 0.12 ?m or more and 0.8 ?m or less and micro copper particles having a volume-average particle diameter of 2 ?m or more and 50 ?m or less, a sum of a content of the submicro copper particles and a content of the micro copper particles is 80% by mass or more of a sum of masses of the copper particles and the second particles, the content of the submicro copper particles is 30% by mass or more and 90% by mass or less of a sum of a mass of the submicro copper particles and a mass of the micro copper particles, and a content of the second particles is 0.01% by mass or more and 10% by mass or less of the sum of the masses of the copper particles and the second particles.Type: ApplicationFiled: April 20, 2017Publication date: June 4, 2020Inventors: Yuki KAWANA, Hideo NAKAKO, Dai ISHIKAWA, Chie SUGAMA, Kazuhiko KURAFUCHI, Yoshinori EJIRI