Abstract: The ink jet head producing method includes: forming a first flow path forming member in a portion constituting a flow path side wall, which constitutes at least a partitioning portion between flow paths on a substrate; forming a pattern as a mold for the flow path; wherein the pattern is formed over the substrate and a portion of the first flow path forming member, constituting a flow path side wall, and a portion constituting the flow path side wall is covered with the pattern and another portion is not covered with the pattern; forming a second flow path forming member on the first flow path forming member and the pattern; wherein the second flow path forming member is formed by a material corresponding to the first flow path forming member; forming the discharge port in the second flow path forming member; and forming the flow path by removing the pattern.

Abstract: A manufacturing method of an ink jet recording head has: forming a liquid flow path mold material of a soluble resin on a substrate on which an energy generating elements is formed, the energy generating element being configured to generate energy for use in discharging ink; forming a coating resin layer of a negative photosensitive resin on the substrate on which the mold material is formed; exposing and developing the coating resin layer to form an ink discharge port in the coating resin layer; and dissolving and removing the mold material to form a liquid flow path, wherein during the exposing of the coating resin layer, a total amount of exposure energy per unit area, applied to an exposure region other than a region of the coating resin layer positioned above the mold material, is larger than that of exposure energy per unit area, applied to the region of the coating resin layer positioned above the mold material.

Abstract: An optical semiconductor device for emitting a light beam includes an outer envelope that forms an indentation in which a light emitting element is positioned. The indentation is divided into a first indentation part corresponding to a lower part of the indentation, and a second indentation part corresponding to an upper part of the indentation. A projection strip between the first and second indentation parts, projects from the inner surface of the outer envelope. A conductive lead supplies an electrical power to the light emitting element.

Abstract: A method of forming a laminate and a method of manufacturing a photovoltaic device using the laminate are provided. The laminate forming method includes a first step of forming an intermediate layer on a base member, and a second step of forming a metal layer on the intermediate layer, the adhesion of the metal layer to the base member being lower than that of the intermediate layer, the reflectance of the metal layer being higher than that of the intermediate layer. The rate of formation of the metal layer is increased at an intermediate stage in the second step. The laminate thereby formed has improved characteristics and is capable of maintaining improved reflection characteristics and adhesion even under high-temperature and high-humidity conditions or during long-term use.

Abstract: A method of forming a laminate and a method of manufacturing a photovoltaic device using the laminate are provided. The laminate forming method includes a first step of forming an intermediate layer on a base member, and a second step of forming a metal layer on the intermediate layer, the adhesion of the metal layer to the base member being lower than that of the intermediate layer, the reflectance of the metal layer being higher than that of the intermediate layer. The rate of formation of the metal layer is increased at an intermediate stage in the second step. The laminate thereby formed has improved characteristics and is capable of maintaining improved reflection characteristics and adhesion even under high-temperature and high-humidity conditions or during long-term use.

Abstract: In the case of a small-sized motor of the present invention, a printed board to which an electric circuit including an electric element is attached is mounted on a case cover. The printed board has a soldering part to be connected to a member attached to an interior of the case cover for being connected to an electric power source supplied from an outside and a soldering part to be connected to a projection in a notch provided on an opening part side of the metal case to body-earth the electric circuit. In the soldering part for the body-earthing, at the time of assembling the motor, after fitting the case cover to the metal case opening part, a pair of electrodes are brought into contact from an outside of the metal case near the soldering part, to weld the soldering part by a principle of the electric resistance welding.

Abstract: An optical semiconductor device for emitting a light beam includes an outer envelope that forms an indentation in which a light emitting element is positioned. The indentation is divided into a first indentation part corresponding to a lower part of the indentation, and a second indentation part corresponding to an upper part of the indentation. A projection strip between the first and second indentation parts, projects from the inner surface of the outer envelope. A conductive lead supplies an electrical power to the light emitting element.

Abstract: The stacked photovoltaic element of the present invention is a stacked photovoltaic element comprising a stack formed of a plurality of unit elements each having a pin constitution, and a transparent electrode provided on the surface of a light incident side of the stacked unit elements, wherein the transparent electrode provided on the surface of the light incident side comprises indium tin oxide (ITO), and the transparent electrode has 90% or more and 99.8% or less in transmittivity of a light of the maximum absorption wavelength of a unit element having the smallest current in a light collection efficiency measurement among the plurality of unit elements, and 50 ?/? or more and 300 ?/? or less in sheet resistance. Such a constitution of the present invention provides a stacked photovoltaic element having an excellent photoelectric conversion efficiency and high reliability at a low cost.

Abstract: A gas adsorptive member is disposed in a space communicating with film deposition chambers, and deposition films are deposited while continuously feeding gas components released from this member, thereby enabling the high quality and uniform deposition films to be formed on the substrate with good reproducibility.

Abstract: A fiber optic connector is provided for mating with a complementary connecting device along a mating optical axis. The connector includes an outer housing having a forward mating end, a rear end and a resilient latch arm for latching engagement with the complementary connecting device. The outer housing includes walls at the rear end thereof substantially surrounding the optical axis to define a cavity opening rearwardly of the housing. An inner housing is fitted into the rearwardly opening cavity in the outer housing, wherein the walls of the outer housing constrain the inner housing in “X” and “Y” directions generally perpendicular to the optical axis. The inner housing includes an optical element receiving cavity communicating with the optical axis.

Abstract: A method of forming a laminate and a method of manufacturing a photovoltaic device using the laminate are provided. The laminate forming method includes a first step of forming an intermediate layer on a base member, and a second step of forming a metal layer on the intermediate layer, the adhesion of the metal layer to the base member being lower than that of the intermediate layer, the reflectance of the metal layer being higher than that of the intermediate layer. The rate of formation of the metal layer is increased at an intermediate stage in the second step. The laminate thereby formed has improved characteristics and is capable of maintaining improved reflection characteristics and adhesion even under high-temperature and high-humidity conditions or during long-term use.

Abstract: A connector assembly includes a multi-part housing for mating with a complementary connecting device. The housing has a first housing part of a first, resilient plastic material and includes a resilient latch portion for latching engagement with the complementary connecting device. The housing has a second housing part of a second plastic material with less resiliency than the first plastic material and includes a cavity for receiving and retaining an operative component of the connector assembly.

Abstract: In the case of a small-sized motor of the present invention, a printed board to which an electric circuit including an electric element is attached is mounted on a case cover. The printed board has a soldering part to be connected to a member attached to an interior of the case cover for being connected to an electric power source supplied from an outside and a soldering part to be connected to a projection in a notch provided on an opening part side of the metal case to body-earth the electric circuit. In the soldering part for the body-earthing, at the time of assembling the motor, after fitting the case cover to the metal case opening part, a pair of electrodes are brought into contact from an outside of the metal case near the soldering part, to weld the soldering part by a principle of the electric resistance welding.

Abstract: In the case of a small-sized motor of the present invention, a printed board to which an electric circuit including an electric element is attached is mounted on a case cover. The printed board has a soldering part to be connected to a member attached to an interior of the case cover for being connected to an electric power source supplied from an outside and a soldering part to be connected to a projection in a notch provided on an opening part side of the metal case to body-earth the electric circuit. In the soldering part for the body-earthing, at the time of assembling the motor, after fitting the case cover to the metal case opening part, a pair of electrodes are brought into contact from an outside of the metal case near the soldering part, to weld the soldering part by a principle of the electric resistance welding.

Abstract: A gas adsorptive member is disposed in a space communicating with film deposition chambers, and deposition films are deposited while continuously feeding gas components released from this member, thereby enabling the high quality and uniform deposition films to be formed on the substrate with good reproducibility.

Abstract: In the case of a small-sized motor of the present invention, a printed board to which an electric circuit including an electric element is attached is mounted on a case cover. The printed board has a soldering part to be connected to a member attached to an interior of the case cover for being connected to an electric power source supplied from an outside and a soldering part to be connected to a projection in a notch provided on an opening part side of the metal case to body-earth the electric circuit. In the soldering part for the body-earthing, at the time of assembling the motor, after fitting the case cover to the metal case opening part, a pair of electrodes are brought into contact from an outside of the metal case near the soldering part, to weld the soldering part by a principle of the electric resistance welding.

Abstract: A gas adsorptive member is disposed in a space communicating with film deposition chambers, and deposition films are deposited while continuously feeding gas components released from this member, thereby enabling the high quality and uniform deposition films to be formed on the substrate with good reproducibility.

Abstract: A method of forming a photovoltaic element according to the present invention comprises at least the steps of depositing a metal layer on a supporting member, depositing a metal oxide layer on the above metal layer, and arranging at least one or more pin structures, each of which is formed by stacking the predetermined n-type, i-type and p-type semiconductor layers, on a substrate formed by stacking on the above supporting member, the above metal layer and the above metal oxide layer in this order, wherein a step of subjecting the supporting member having the metal layer formed thereon to heat treatment is carried out between the two steps of depositing the above metal layer and depositing the above metal oxide layer.

Abstract: Provided are a substrate with a zinc oxide layer, in which at least a zinc oxide layer is provided on a support substrate, wherein the zinc oxide layer comprises a zinc oxide layer having the c axis perpendicular to the support substrate and a zinc oxide layer having the c axis slantindicular to the support substrate in the order from the side of the support substrate; and a photovoltaic device in which a semiconductor layer is formed on the substrate with the zinc oxide layer. Thus provided is the inexpensive photovoltaic device with excellent reflective performance and optical confinement effect and with high photoelectric conversion efficiency.

Abstract: A gas adsorptive member is disposed in a space communicating with film deposition chambers, and deposition films are deposited while continuously feeding gas components released from this member, thereby enabling the high quality and uniform deposition films to be formed on the substrate with good reproducibility.