Abstract: An inspection method according to the embodiments includes applying light of a light source to an inspection target; receiving light from the inspection target to obtain a first image of the inspection target by a sensor; based on an image of a first pattern comprising repetitive patterns unresolvable with a wavelength of the light source in the first image, calculating a deviation of luminance values with respect to each of first regions in the first pattern by a processor; obtaining a second image of the inspection target by the sensor; correcting luminance values of the second image by the processor based on the deviations of the luminance values; and comparing the repetitive patterns of the corrected second image with each other by a comparer.

Abstract: A substrate to be inspected includes a first pattern constructed with a repetitive pattern that is not resolved by a wavelength of a light source, and at least one alignment mark that is arranged on the same plane as the first pattern. The alignment mark includes a second pattern constructed with a repetitive pattern that is not resolved by the wavelength of the light source, and a programmed defect that is provided in the second pattern and not resolved by the wavelength of the light source. A focus offset is adjusted such that the strongest signal of the programmed defect is obtained with respect to a base value of a gradation value in an optical image of the programmed defect by capturing the optical image while changing a focal distance between the surface in which the first pattern is provided and an optical system.

Abstract: An inspection method for inspecting a substrate by using an optical image obtained by irradiating the substrate with light from a light source through an optical unit, and causing the light reflected by the substrate to be incident to a sensor, includes adjusting a focus offset value such that a focal distance for setting the signal-to-noise ratio of a programmed defect to the maximum level, is obtained by acquiring the optical image while changing a focal distance between the surface in which a first pattern is provided and the optical unit. The substrate includes the first pattern, a second pattern on the same plane as the first pattern, the programmed defect in the second pattern, and a third pattern on the same plane as the first pattern. The existence of a defect is detected by acquiring the optical image of the first pattern after the focus offset is adjusted.

Abstract: In one embodiment, a charged particle beam drawing apparatus includes a drawing unit that draws a pattern in a drawing area on a substrate and a control processing circuitry that controls the drawing unit via a process including receiving drawing data with a hierarchical correction map input to the control processing circuitry. The drawing data with the hierarchical map includes a plurality of files in which division maps are respectively described in files in units of subframes. Each division map includes dose correction information associated with corresponding one of blocks of the drawing area. The process further includes generating shot data by performing a data conversion process on the drawing data, reading a division map corresponding to a block in the area to be drawn from the hierarchical correction map, calculating a dose, and controlling the drawing unit based on the shot data and the calculated dose.

Abstract: In a mask inspection apparatus, an optical image acquisition unit acquires an optical image of a pattern in a mask by irradiating light. A reference image generation unit generates a corresponding reference image. A defect detection unit detects a defect of the pattern by comparing the two images. A misplacement data processing unit obtains a misplacement amount of the pattern from the images, and generates misplacement data. A misplacement map processing unit generates and outputs the map to the defect detection unit. The defect detection unit includes, a first comparison unit for comparing the images, a threshold value reconfiguring unit for specifying a portion of the map corresponding to the defect detected, reconfiguring a threshold value according to the shape of the defect and the misplacement direction of the optical image of the specified portion, and a second comparison unit for re-comparing both images using the reconfigured threshold value.

Abstract: A pattern inspection method according to one aspect of the present invention includes generating a first positional deviation amount map by using data acquired by a pre-scan, generating a second positional deviation amount map by using data acquired by a full scan, generating a first positional deviation difference map by calculating a difference between the first positional deviation amount map and the second positional deviation amount map, generating a third positional deviation amount map from the first positional deviation difference map and the second positional deviation amount map, and judging existence of a value exceeding an allowable value, in values defined by the third positional deviation amount map.

Abstract: An inspection method for inspecting a substrate by using an optical image obtained by irradiating the substrate with light from a light source through an optical unit, and causing the light reflected by the substrate to be incident to a sensor, includes adjusting a focus offset value such that a focal distance for setting the signal-to-noise ratio of a programmed defect to the maximum level, is obtained by acquiring the optical image while changing a focal distance between the surface in which a first pattern is provided and the optical unit. The substrate includes the first pattern, a second pattern on the same plane as the first pattern, the programmed defect in the second pattern, and a third pattern on the same plane as the first pattern. The existence of a defect is detected by acquiring the optical image of the first pattern after the focus offset is adjusted.

Abstract: In one embodiment, a charged particle beam drawing apparatus includes a drawing unit that draws a pattern in a drawing area on a substrate and a control processing circuitry that controls the drawing unit via a process including receiving drawing data with a hierarchical correction map input to the control processing circuitry, the drawing data with the hierarchical map including a plurality of files in which division maps are respectively described in files in units of subframes, each division map including dose information associated with corresponding one of blocks of the drawing area, and the process further including generating shot data by performing a data conversion process on the drawing data, reading a division map corresponding to a block in the area to be drawn from the hierarchical correction map, calculating a dose, and controlling the drawing unit based on the shot data and the calculated dose.

Abstract: An inspection apparatus includes a lighting unit, an imaging unit, an optical image comparison unit, a map creation unit, a map storage unit, a first storage unit, a map comparison unit, and a first determination unit. The lighting unit irradiates a sample including a defect to be inspected with a lighting light. The imaging unit obtains either or both of a first optical image formed by the lighting light transmitted through the sample to be inspected and a second optical image formed by the lighting light reflected by the sample to be inspected and obtains either or both of a third optical image formed by the lighting light transmitted through the sample to be inspected and having a corrected defect and a fourth optical image formed by the lighting light reflected by the sample to be inspected and having a corrected defect.

Abstract: An inspection apparatus according to embodiments includes a lightening unit, an imaging unit, a first storage unit, a comparison unit, and a first determination unit. The lighting unit irradiates a sample including a defect to be inspected with a lighting light. The imaging unit obtains an optical image formed by the lightening light transmitted through or reflected by the sample to be inspected. The first storage unit stores information on a defect correction method for the defect. The comparison unit compares the optical image and a reference image based on the information on the defect correction method. The first determination unit determines, based on a comparison result by the comparison unit and the information on the defect correction method, whether correction of the defect is appropriate.

Abstract: A work management system (1) includes: an image capturing device (20) worn by a worker; and a server device (60). The image capturing device (20) includes: an image capturing section (21) for capturing an image of a work range of the worker; and a communication section (30) for transmitting, to the server device (60), at least one of (i) the image captured by the image capturing section (21) and (ii) generated information generated in accordance with the image. The server device (60) includes a control section (70) for managing the at least one of the image and the generated information which one is received from the communication section.

Abstract: In a mask inspection apparatus, an optical image acquisition unit acquires an optical image of a pattern in a mask by irradiating light. A reference image generation unit generates a corresponding reference image. A defect detection unit detects a defect of the pattern by comparing the two images. A misplacement data processing unit obtains a misplacement amount of the pattern from the images, and generates misplacement data. A misplacement map processing unit generates and outputs the map to the defect detection unit. The defect detection unit includes, a first comparison unit for comparing the images, a threshold value reconfiguring unit for specifying a portion of the map corresponding to the defect detected, reconfiguring a threshold value according to the shape of the defect and the misplacement direction of the optical image of the specified portion, and a second comparison unit for re-comparing both images using the reconfigured threshold value.

Abstract: A work management system (1) includes: an image capturing device (20) worn by a worker; and a server device (60). The image capturing device (20) includes: an image capturing section (21) for capturing an image of a work range of the worker; and a communication section (30) for transmitting, to the server device (60), at least one of (i) the image captured by the image capturing section (21) and (ii) generated information generated in accordance with the image. The server device (60) includes a control section (70) for managing the at least one of the image and the generated information which one is received from the communication section.

Abstract: A work management system (1) includes: an image capturing device (20) worn by a worker; and a server device (60). The image capturing device (20) includes: an image capturing section (21) for capturing an image of a work range of the worker; and a communication section (30) for transmitting, to the server device (60), at least one of (i) the image captured by the image capturing section (21) and (ii) generated information generated in accordance with the image. The server device (60) includes a control section (70) for managing the at least one of the image and the generated information which one is received from the communication section.

Abstract: A work management system (1) includes: an image capturing device (20) worn by a worker; and a server device (60). The image capturing device (20) includes: an image capturing section (21) for capturing an image of a work range of the worker; and a communication section (30) for transmitting, to the server device (60), at least one of (i) the image captured by the image capturing section (21) and (ii) generated information generated in accordance with the image. The server device (60) includes a control section (70) for managing the at least one of the image and the generated information which one is received from the communication section.

Abstract: A work management system (1) includes: an image capturing device (20) worn by a worker; and a server device (60). The image capturing device (20) includes: an image capturing section (21) for capturing an image of a work range of the worker; and a communication section (30) for transmitting, to the server device (60), at least one of (i) the image captured by the image capturing section (21) and (ii) generated information generated in accordance with the image. The server device (60) includes a control section (70) for managing the at least one of the image and the generated information which one is received from the communication section.

Abstract: A mask inspection apparatus includes an optical image acquisition unit configured to acquire an optical image by irradiating light on a mask, a reference image generation unit configured to generate a reference image from design data of the mask, a comparison circuit configured to compare the optical image with the reference image, a pattern data extraction unit configured to obtain coordinates of a defective portion determined to be defective by the comparison unit and to extract, from the design data, pattern data of a predetermined dimension range including the coordinates, and an interface unit configured to supply an aerial image measurement apparatus with information associated with the defect, the information including the defect coordinates and the extracted pattern data.

Abstract: In accordance with one aspect of this invention, a pattern inspection apparatus includes an optical image acquisition unit configured to acquire optical images regarding dies of a target object to be inspected on which the dies having a same pattern formed therein is arranged; a sub-optical image division unit configured to divide an optical image of the optical images regarding a die of the dies positioned in a non-resolved pattern region into sub-optical images using non-resolved pattern region information capable of recognizing the non-resolved pattern region in which a non-resolved pattern that is not resolved is formed; a first comparison unit configured to compare the sub-optical images divided from the optical image of the same die regarding the non-resolved pattern region pixel by pixel; and a second comparison unit configured to compare optical images of the optical images regarding different dies of the dies pixel by pixel.

Abstract: A substrate to be inspected includes a first pattern constructed with a repetitive pattern that is not resolved by a wavelength of a light source, and at least one alignment mark that is arranged on the same plane as the first pattern. The alignment mark includes a second pattern constructed with a repetitive pattern that is not resolved by the wavelength of the light source, and a programmed defect that is provided in the second pattern and not resolved by the wavelength of the light source. A focus offset is adjusted such that the strongest signal of the programmed defect is obtained with respect to a base value of a gradation value in an optical image of the programmed defect by capturing the optical image while changing a focal distance between the surface in which the first pattern is provided and an optical system.

Abstract: Acquired mask data of a defect portion is sent to a simulated repair circuit 300 to be simulated. The simulation of the acquired mask data 204 is returned to the mask inspection results 205 and thereafter sent to a wafer transfer simulator 400 along with a reference image at the corresponding portion. A wafer transfer image estimated by the wafer transfer simulator 400 is sent to a comparing circuit 301. When it is determined that there is a defect in the comparing circuit 301, the coordinates and the wafer transfer image which is a basis for the defect determination are stored as transfer image inspection results 206. The mask inspection results 205 and the transfer image inspection result 206 are then sent to the review device 500.