Abstract: A control computer 110 determines, for each detected pattern defect, a defect inspection pattern area of predetermined X and Y dimensions containing the coordinates of the defect, then determines the clusters or cells whose reference points are located within the defect inspection pattern area. Then extracts the data of these clusters or cells from design pattern data read from a first magnetic disk unit 109a. The control computer 110 then generates an output file containing the extracted data. The output file is then converted into the same format as the input design pattern data or into OASIS format, before it is output to a second magnetic disk unit 109b. The extracted pattern data specifying the clusters or cells within each defect inspection pattern area can be output from the mask inspection system 100 to external systems.

Abstract: A pattern inspection apparatus includes a light source configured to emit a pulsed light, a stage on which an inspection target workpiece is placed, a sensor, including a plurality of light receiving elements two-dimensionally arrayed, configured to capture a pattern image in a two-dimensional region of the inspection target workpiece which is irradiated with the pulsed light, by using the plurality of light receiving elements, and a comparing unit configured to compare data of the pattern image with predetermined reference pattern image data, wherein the stage moves to be shifted by a number of pixels, being the number of natural number times one pixel, between pulses of the pulsed light.

Abstract: A pattern inspection apparatus includes a pulsed light source configured to emit pulsed light; a stage configured to mount thereon an inspection target object with a pattern formed thereon; a time delay integration (TDI) sensor configured to detect, a plurality of times with a time delay, each pixel value of an optical image of the inspection target object, wherein the optical image is acquired by emitting the pulsed light onto the inspection target object, and to integrate a detected each pixel value for each pixel of the optical image; a light quantity sensor configured to detect a light quantity of the pulsed light after emitting the pulsed light onto the inspection target object; a light quantity measurement circuit configured to input the light quantity detected by the light quantity sensor, and to measure a light quantity of each pulse while being synchronized with a period of the pulsed light; a correction unit configured to input the light quantity of each pulse and an integrated pixel value output fr

Abstract: The present invention provides a reticle defect inspection method and a reticle defect inspection apparatus capable of calibrating the offset and gain of a sensor amplifier using a product reticle even though black and white regions each sufficiently wider than a TDI sensor imaging area do not exist in the product reticle. An output of each pixel of the TDI sensor is amplified by the sensor amplifier. A bottom value of the amplified amount-of-light signal of each pixel is stored by bottom value storing means of offset/gain calibrating means, and a peak value thereof is stored by peak value storing means. The offset of each pixel is calculated by offset calculating means based on the bottom value of each pixel. The gain of each pixel is calculated by gain calculating means based on the offset of each pixel and the peak value of each pixel. The calculated offset and gain of each pixel are stored in a register and thereby the offset and gain of the sensor amplifier are calibrated.

Abstract: A pattern inspection apparatus uses a die-to-database comparison method which compares detected pattern data obtained from an optical image of a pattern of a plate to be inspected with first reference pattern data obtained from designed pattern data in combination with a die-to-die comparison method which compares the detected pattern data with second reference pattern data obtained by detecting an area to be a basis for repetition. A computer detects presence of a plurality of repeated pattern areas from layout information contained in the designed pattern data, reads the arrangement, the number, the dimension and the repeated pitch of the repeated pattern areas, and automatically fetches an inspection area of the die-to-die comparison method.

Abstract: A pattern inspection apparatus includes a stage configured to mount thereon a target workpiece to be inspected where patterns are formed, at least one sensor configured to move relatively to the stage and capture optical images of the target workpiece to be inspected, a first comparing unit configured to compare first pixel data of an optical image captured by one of the at least one sensor with first reference data at a position corresponding to a position of the first pixel data, and a second comparing unit configured to compare second pixel data of an optical image captured by one of the at least one sensor at a position shifted by a sub-pixel unit from the position where the optical image of the first pixel data is captured, with second reference data at a position corresponding to the position of the second pixel data.

Abstract: A pattern inspection apparatus includes a stage configured to mount a target workpiece to be inspected thereon, a sensor configured to include a plurality of light receiving elements arrayed in a second direction orthogonal to a first direction which moves relatively to the stage, and to capture optical images of the target workpiece by using the plurality of light receiving elements, an accumulation unit configured to accumulate each pixel data of the optical images overlappingly captured by the sensor at positions shifted each other in the second direction by a pixel unit, for each pixel, and a comparison unit configured to compare the each pixel data accumulated for each pixel with predetermined reference data.

Abstract: A pattern inspection apparatus includes a light source configured to emit a pulsed light, a stage on which an inspection target workpiece is placed, a sensor, including a plurality of light receiving elements two-dimensionally arrayed, configured to capture a pattern image in a two-dimensional region of the inspection target workpiece which is irradiated with the pulsed light, by using the plurality of light receiving elements, and a comparing unit configured to compare data of the pattern image with predetermined reference pattern image data, wherein the stage moves to be shifted by a number of pixels, being the number of natural number times one pixel, between pulses of the pulsed light.

Abstract: A pattern inspecting method, comprising preparing a sample having a first and a second inspection regions and an imaging device having a plurality of pixels, scanning the first inspection region to a first direction using the imaging device to obtain a first measurement pattern representing at least parts of the first inspection region, scanning the second inspection region to the first direction using the imaging device to obtain a second measurement pattern representing at least parts of the second inspection region, comparing the first measurement pattern and the second measurement pattern with each other to determine presence or absence of a defect formed on the sample, and controlling a scanning condition for scanning a pattern of the second inspection region by the imaging device so as to keep the same with the scanning condition when the pattern of the first inspection region is scanned by the imaging device.

Abstract: A pattern inspection apparatus uses a die-to-database comparison method which compares detected pattern data obtained from an optical image of a pattern of a plate to be inspected with first reference pattern data obtained from designed pattern data in combination with a die-to-die comparison method which compares the detected pattern data with second reference pattern data obtained by detecting an area to be a basis for repetition. A computer detects presence of a plurality of repeated pattern areas from layout information contained in the designed pattern data, reads the arrangement, the number, the dimension and the repeated pitch of the repeated pattern areas, and automatically fetches an inspection area of the die-to-die comparison method.

Abstract: A pattern inspection apparatus uses a die-to-database comparison method which compares detected pattern data obtained from an optical image of a pattern of a plate to be inspected with first reference pattern data obtained from designed pattern data in combination with a die-to-die comparison method which compares the detected pattern data with second reference pattern data obtained by detecting an area to be a basis for repetition. A computer detects presence of a plurality of repeated pattern areas from layout information contained in the designed pattern data, reads the arrangement, the number, the dimension and the repeated pitch of the repeated pattern areas, and automatically fetches an inspection area of the die-to-die comparison method.

Abstract: A pattern inspecting method, comprising preparing a sample having a first and a second inspection regions and an imaging device having a plurality of pixels, scanning the first inspection region to a first direction using the imaging device to obtain a first measurement pattern representing at least parts of the first inspection region, scanning the second inspection region to the first direction using the imaging device to obtain a second measurement pattern representing at least parts of the second inspection region, comparing the first measurement pattern and the second measurement pattern with each other to determine presence or absence of a defect formed on the sample, and controlling a scanning condition for scanning a pattern of the second inspection region by the imaging device so as to keep the same with the scanning condition when the pattern of the first inspection region is scanned by the imaging device.

Abstract: An assistance device of workpiece inspection apparatus embodying this invention includes a regional image data conversion unit which inputs region data indicative of a specified region of a workpiece being tested with a pattern formed thereon, and then converts the data to regional image data. The device also includes a data distribution processing unit which distributes the regional image data for output to the workpiece inspection apparatus in conformity with an inspection processing speed of the external workpiece inspection apparatus, which performs pattern defect inspection while comparing optical image data of the workpiece to prespecified reference image data.

Abstract: A pattern inspection apparatus uses a die-to-database comparison method which compares detected pattern data obtained from an optical image of a pattern of a plate to be inspected with first reference pattern data obtained from designed pattern data in combination with a die-to-die comparison method which compares the detected pattern data with second reference pattern data obtained by detecting an area to be a basis for repetition. A computer detects presence of a plurality of repeated pattern areas from layout information contained in the designed pattern data, reads the arrangement, the number, the dimension and the repeated pitch of the repeated pattern areas, and automatically fetches an inspection area of the die-to-die comparison method.

Abstract: A pattern inspection apparatus determines a difference of the measured dislocation of respective alignment marks of an opaque pattern and a phase shifting pattern (measurement difference), in addition to a difference between the both alignment mark positions in design (design difference). A difference between the measurement difference and the design difference is set as a difference in alignment mark position between the opaque pattern and the phase shifting pattern in a reference pattern which is later used in inspection. In this manner, by correcting one pattern data with respect to the other pattern data in the reference pattern, the displacement generated in the both patterns can be reflected, and the reference pattern data regarding an image of a sample which is actually observed can be created.

Abstract: An assistance device of workpiece inspection apparatus embodying this invention includes a regional image data conversion unit which inputs region data indicative of a specified region of a workpiece being tested with a pattern formed thereon, and then converts the data to regional image data. The device also includes a data distribution processing unit which distributes the regional image data for output to the workpiece inspection apparatus in conformity with an inspection processing speed of the external workpiece inspection apparatus, which performs pattern defect inspection while comparing optical image data of the workpiece to prespecified reference image data.

Abstract: A pattern inspection apparatus includes a light source irradiating a plate having a pattern, a photoelectric device photoelectrically converting the image of the pattern, a generator generating detected pattern data based on a photoelectrically converted signal, a generator generating reference pattern data from designed data, a comparator comparing the detected pattern data with the reference pattern data, a sensor detecting a light intensity of the light source, a barometric pressure sensor detecting a barometric pressure in the apparatus, a detector detecting at least one of the light intensity and barometric pressure deviating from predetermined ranges, a memory storing the detected and reference pattern data at a point of time when the abnormal status is generated in synchronization with position data and detected values of the light intensity and barometric pressure and an output device which outputs these.

Abstract: A pattern data converting method comprises reconstructing the design data into column regions, segmenting the column region into apparatus strips, and extracting unit data of the design data for each apparatus strip, wherein reconstructing the design data includes defining an rectangular region start code and a rectangular region end code to the rectangle regions, collating the rectangular region start and end codes, dividing the rectangular regions at the Y coordinate of the other rectangular region, and subjecting the rectangular region start code and rectangular region end code having the same Y coordinates to the region operation.

Abstract: A pattern inspection apparatus determines a difference of the measured dislocation of respective alignment marks of an opaque pattern and a phase shifting pattern (measurement difference), in addition to a difference between the both alignment mark positions in design (design difference). A difference between the measurement difference and the design difference is set as a difference in alignment mark position between the opaque pattern and the phase shifting pattern in a reference pattern which is later used in inspection. In this manner, by correcting one pattern data with respect to the other pattern data in the reference pattern, the displacement generated in the both patterns can be reflected, and the reference pattern data regarding an image of a sample which is actually observed can be created.

Abstract: A pattern inspection apparatus determines a difference of the measured dislocation of respective alignment marks of an opaque pattern and a phase shifting pattern (measurement difference), in addition to a difference between the both alignment mark positions in design (design difference). A difference between the measurement difference and the design difference is set as a difference in alignment mark position between the opaque pattern and the phase shifting pattern in a reference pattern which is later used in inspection. In this manner, by correcting one pattern data with respect to the other pattern data in the reference pattern, the displacement generated in the both patterns can be reflected, and the reference pattern data regarding an image of a sample which is actually observed can be created.