Patents by Inventor Hideo Yumi

Hideo Yumi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190003787
    Abstract: Provided is a thermally conductive liquid pack including a liquid thermal conductive material and a hollow pliable outer package filled with the liquid thermal conductive material, the pliable outer package having a first contact surface and a second contact surface different from the first contact surface and being in a closed state, the pliable outer package including a first sheet including the first contact surface, a second sheet including the second contact surface and disposed opposite to the first sheet, the first sheet and the second sheet including a plurality of fine discharge holes capable of discharging the thermal conductive material, a release sheet configured to seal the discharged holes from the outside being releasably layered on the first sheet and the second sheet, and the second sheet including a third sheet formed from a non-woven fabric or mesh in the inside thereof.
    Type: Application
    Filed: June 27, 2018
    Publication date: January 3, 2019
    Applicant: KITAGAWA INDUSTRIES CO., LTD.
    Inventors: Ken TANAKA, Hideo YUMI
  • Patent number: 10132575
    Abstract: The heat conduction member comprises a laminate formed by laminating a resin layer and a metal layer. The resin layer is formed from a thermally conductive resin material. The thickness of the laminate is smaller at the peripheral edge of the laminate than in the center portion of the laminate, and the thickness of the laminate is greater in the intermediate portion of the laminate than in the center portion of the laminate. An inclined surface is formed on the laminate so as to form a falling gradient from the intermediate portion toward the peripheral edge.
    Type: Grant
    Filed: March 28, 2017
    Date of Patent: November 20, 2018
    Assignee: KITAGAWA INDUSTRIES CO., LTD.
    Inventors: Takashi Mizuno, Hideo Yumi
  • Patent number: 10014610
    Abstract: A contact in one aspect of the present disclosure comprises a fixing portion, an elastic contact piece, and a pair of projecting tabs, which are formed as an integrated entity from a metal thin plate. The projecting tabs project from the fixing portion at positions on both sides of the elastic contact piece. A dimension of the elastic contact piece in a width direction, which matches the direction of an interval between the projecting tabs, is a first dimension. The projecting tabs are formed such that each projecting tab is a flat plate having the same thickness as the thin plate. The projecting tabs are arranged such that the thickness directions thereof are the same direction, in locations that have inner surfaces of the projecting tabs facing each other, and an interval between the inner surfaces is a second dimension greater than the first dimension.
    Type: Grant
    Filed: March 28, 2017
    Date of Patent: July 3, 2018
    Assignee: KITAGAWA INDUSTRIES, CO., LTD.
    Inventors: Tomohisa Kurita, Hideo Yumi
  • Publication number: 20170288329
    Abstract: A contact in one aspect of the present disclosure comprises a fixing portion, an elastic contact piece, and a pair of projecting tabs, which are formed as an integrated entity from a metal thin plate. The projecting tabs project from the fixing portion at positions on both sides of the elastic contact piece. A dimension of the elastic contact piece in a width direction, which matches the direction of an interval between the projecting tabs, is a first dimension. The projecting tabs are formed such that each projecting tab is a flat plate having the same thickness as the thin plate. The projecting tabs are arranged such that the thickness directions thereof are the same direction, in locations that have inner surfaces of the projecting tabs facing each other, and an interval between the inner surfaces is a second dimension greater than the first dimension.
    Type: Application
    Filed: March 28, 2017
    Publication date: October 5, 2017
    Applicant: Kitagawa Industries Co., Ltd.
    Inventors: Tomohisa KURITA, Hideo YUMI
  • Publication number: 20170276442
    Abstract: The heat conduction member comprises a laminate formed by laminating a resin layer and a metal layer. The resin layer is formed from a thermally conductive resin material. The thickness of the laminate is smaller at the peripheral edge of the laminate than in the center portion of the laminate, and the thickness of the laminate is greater in the intermediate portion of the laminate than in the center portion of the laminate. An inclined surface is formed on the laminate so as to form a falling gradient from the intermediate portion toward the peripheral edge.
    Type: Application
    Filed: March 28, 2017
    Publication date: September 28, 2017
    Inventors: Takashi MIZUNO, Hideo YUMI
  • Patent number: 9570827
    Abstract: A contact member according to one aspect of the present disclosure comprises: a thin plate member having spring characteristics and electrical conductivity. The thin plate member comprises: a joint portion having a joint surface to be joined to a first member; a contact portion contactable with a second member; and a connecting portion having a length component in a direction intersecting the joint surface, and having a first end continuous to the joint portion and a second end continuous to the contact portion. The connecting portion comprises a narrow portion having a smaller dimension in a width direction than a dimension around the narrow portion.
    Type: Grant
    Filed: October 30, 2015
    Date of Patent: February 14, 2017
    Assignee: KITAGAWA INDUSTRIES CO., LTD.
    Inventors: Tomohisa Kurita, Hideo Yumi
  • Patent number: 9510452
    Abstract: An electromagnetic shielding member comprises: a shielding portion, including a metal material, for sealing an electronic component on an electronic circuit board, between the shielding portion itself and the electronic circuit board; a dielectric portion between a conductive portion of the electronic component, and the shielding portion, the dielectric portion including a dielectric material having a relative permittivity of 6 or more; and a laminated portion around the electronic component, the laminated portion being a laminate of the shielding portion and the dielectric portion.
    Type: Grant
    Filed: March 25, 2015
    Date of Patent: November 29, 2016
    Assignee: KITAGAWA INDUSTRIES CO., LTD.
    Inventor: Hideo Yumi
  • Patent number: 9455389
    Abstract: In a thermoelectric conversion module, each of a p-type element and an n-type element is configured by aligning a plurality of particles in series and connecting the particles to each other. Around a connection part in which the particles are connected to each other, a protrusion is protruded. The protrusion has a shape of continuously extending around the entire periphery of the connection part. The protrusion may be partly interrupted, but in such a case, a circumferential length of one interrupted portion is less than one half of the periphery of the connection part.
    Type: Grant
    Filed: November 16, 2012
    Date of Patent: September 27, 2016
    Assignees: National Institute of Advanced Industrial Science and Technology, KITAGAWA INDUSTRIES CO., LTD.
    Inventors: Yasuhiro Kawaguchi, Hideo Yumi, Hiroki Kitano, Kenta Takagi, Kimihiro Ozaki
  • Publication number: 20160126653
    Abstract: A contact member according to one aspect of the present disclosure comprises: a thin plate member having spring characteristics and electrical conductivity. The thin plate member comprises: a joint portion having a joint surface to be joined to a first member; a contact portion contactable with a second member; and a connecting portion having a length component in a direction intersecting the joint surface, and having a first end continuous to the joint portion and a second end continuous to the contact portion. The connecting portion comprises a narrow portion having a smaller dimension in a width direction than a dimension around the narrow portion.
    Type: Application
    Filed: October 30, 2015
    Publication date: May 5, 2016
    Applicant: KITAGAWA INDUSTRIES CO., LTD.
    Inventors: TOMOHISA KURITA, HIDEO YUMI
  • Patent number: 9167698
    Abstract: A surface mount clip including: a solder joint part in which a lower surface thereof is to be a solder joint surface to be soldered and connected to a conductor pattern on a printed circuit board. A pair of support parts are connected to the solder joint part and, when the solder joint part is soldered and connected to the printed circuit board, are supported in a position above the printed circuit board at an interval between the pair of support parts. The interval allows a conductive member, other than the printed circuit board, to be inserted therein. A resilient contact part, that is connected at least to one of the pair of support parts, is resiliently deformed and pressed by the conductive member, when the conductive member is inserted between the pair of support parts, and electrically connects the conductor pattern and the conductive member.
    Type: Grant
    Filed: June 30, 2011
    Date of Patent: October 20, 2015
    Assignee: Kitagawa Industries Co., Ltd.
    Inventors: Kenji Konda, Tomohisa Kurita, Hiroki Kitano, Tatsuya Nakamura, Hideo Yumi
  • Publication number: 20150282394
    Abstract: An electromagnetic shielding member comprises: a shielding portion, including a metal material, for sealing an electronic component on an electronic circuit board, between the shielding portion itself and the electronic circuit board; a dielectric portion between a conductive portion of the electronic component, and the shielding portion, the dielectric portion including a dielectric material having a relative permittivity of 6 or more; and a laminated portion around the electronic component, the laminated portion being a laminate of the shielding portion and the dielectric portion.
    Type: Application
    Filed: March 25, 2015
    Publication date: October 1, 2015
    Applicant: KITAGAWA INDUSTRIES CO., LTD.
    Inventor: HIDEO YUMI
  • Patent number: 8974165
    Abstract: A screw has an outer diameter in a range of 0.3 mm to 1.4 mm. The screw includes resin and carbon fiber which is dispersed in the resin and has a fiber diameter in a range of 0.01 ?m to 0.20 ?m.
    Type: Grant
    Filed: November 8, 2013
    Date of Patent: March 10, 2015
    Assignee: Kitagawa Industries Co., Ltd.
    Inventors: Hideo Yumi, Yasuo Kondo, Makoto Kato
  • Publication number: 20140261605
    Abstract: A thermoelectric conversion module according to one aspect of embodiments of the present invention as disclosed herein includes a plurality of layered planar bodies. Each of the plurality of layered planar bodies includes a base material having a planar shape, a plurality of p-type granular bodies made of a p-type thermoelectric material, and a plurality of n-type granular bodies made of an n-type thermoelectric material. The plurality of p-type granular bodies and the plurality of n-type granular bodies are held by the base material in such a manner as to be spaced apart from each other in a direction along a face of the base material crossing a layered direction of the plurality of layered planar bodies.
    Type: Application
    Filed: March 12, 2014
    Publication date: September 18, 2014
    Applicants: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY, KITAGAWA INDUSTRIES CO., LTD.
    Inventors: HIROKI KITANO, HIDEO YUMI, YASUHIRO KAWAGUCHI, KENTA TAKAGI, KIMIHIRO OZAKI
  • Patent number: 8808011
    Abstract: A contact capable of electrically connecting an electrically conductive portion provided on a plate-like member with an electrically conductive member different from the plate-like member. The contact includes a main body; a movable portion held by the main body so as to be reciprocal in directions of increasing and decreasing of a projecting amount thereof outwardly of the main body; and a biasing mechanism that biases the movable portion in such a direction that the projecting amount of the movable portion increases. The main body includes a tubular portion, a solder inflow suppressing portion, and a soldering portion.
    Type: Grant
    Filed: November 4, 2011
    Date of Patent: August 19, 2014
    Assignee: Kitagawa Industries Co., Ltd.
    Inventors: Hiroki Kitano, Hideo Yumi, Tatsuya Nakamura
  • Publication number: 20140133936
    Abstract: A screw has an outer diameter in a range of 0.3 mm to 1.4 mm. The screw includes resin and carbon fiber which is dispersed in the resin and has a fiber diameter in a range of 0.01 ?m to 0.20 ?m.
    Type: Application
    Filed: November 8, 2013
    Publication date: May 15, 2014
    Applicant: KITAGAWA INDUSTRIES CO., LTD.
    Inventors: Hideo YUMI, Yasuo KONDO, Makoto KATO
  • Patent number: 8569626
    Abstract: A contact includes a solder bonding portion, an elastic contact portion, and a suction portion. An undersurface of the solder bonding portion is a solder bonding face which is to be solder bonded to the conductor pattern. The elastic contact portion is connected to one end of the solder bonding portion and bent over the solder bonding portion. When in contact with a conductive member, the elastic contact portion is pressed against the conductive member while being elastically deformed. The suction portion is connected to the solder bonding portion independently of the elastic contact portion. The suction portion is made a suction face for a suction nozzle of an automatic mounter, with its top end being arranged in parallel to the undersurface of the solder bonding portion on the conductive member side of the elastic contact portion.
    Type: Grant
    Filed: November 16, 2010
    Date of Patent: October 29, 2013
    Assignee: Kitagawa Industries Co., Ltd.
    Inventors: Tomohisa Kurita, Hideo Yumi, Tatsuya Nakamura, Kenji Konda, Hiroki Kitano
  • Publication number: 20130264098
    Abstract: A contact capable of electrically connecting an electrically conductive portion provided on a plate-like member with an electrically conductive member different from the plate-like member. The contact includes a main body; a movable portion held by the main body so as to be reciprocal in directions of increasing and decreasing of a projecting amount thereof outwardly of the main body; and a biasing mechanism that biases the movable portion in such a direction that the projecting amount of the movable portion increases. The main body includes a tubular portion, a solder inflow suppressing portion, and a soldering portion.
    Type: Application
    Filed: November 4, 2011
    Publication date: October 10, 2013
    Applicant: KITAGAWA INDUSTRIES CO., LTD.
    Inventors: Hiroki Kitano, Hideo Yumi, Tatsuya Nakamura
  • Publication number: 20130206457
    Abstract: A surface mount clip including: a solder joint part in which a lower surface thereof is to be a solder joint surface to be soldered and connected to a conductor pattern on a printed circuit board; a pair of support parts connected to the solder joint part, and, when the solder joint part is soldered and connected to the printed circuit board, supported in a position above the printed circuit board at an interval between the pair of support parts, the interval allowing a conductive member other than the printed circuit board to be inserted therein; and a resilient contact part that is connected at least to one of the pair of support parts, is resiliently deformed and pressed by the conductive member, when the conductive member is inserted between the pair of support parts, and electrically connects the conductor pattern and the conductive member.
    Type: Application
    Filed: June 30, 2011
    Publication date: August 15, 2013
    Applicant: KITAGAWA INDUSTRIES CO., LTD.
    Inventors: Kenji Konda, Tomohisa Kurita, Hiroki Kitano, Tatsuya Nakamura, Hideo Yumi
  • Patent number: 8475180
    Abstract: A conductive component includes a tubular body having at least one of at least one through-hole which penetrates the tubular body from outside to inside thereof; and at least one notch which is cut in from an edge of the tubular body, which are formed at least one predetermined portion on the tubular body. The tubular body includes a first portion, which includes a solder joint portion, and a second portion, which includes a contact portion. The first portion and the second portion are located on the opposite sides from one another with the at least one predetermined portion sandwiched therebetween. The tubular body further includes at least one spring portion which includes the at least one predetermined portion.
    Type: Grant
    Filed: November 4, 2010
    Date of Patent: July 2, 2013
    Assignee: Kitagawa Industries Co., Ltd
    Inventor: Hideo Yumi
  • Publication number: 20130125948
    Abstract: In a thermoelectric conversion module, each of a p-type element and an n-type element is configured by aligning a plurality of particles in series and connecting the particles to each other. Around a connection part in which the particles are connected to each other, a protrusion is protruded. The protrusion has a shape of continuously extending around the entire periphery of the connection part. The protrusion may be partly interrupted, but in such a case, a circumferential length of one interrupted portion is less than one half of the periphery of the connection part.
    Type: Application
    Filed: November 16, 2012
    Publication date: May 23, 2013
    Applicants: National Institute of Advanced Industrial Science and Technology
    Inventors: Yasuhiro KAWAGUCHI, Hideo YUMI, Hiroki KITANO, Kenta TAKAGI, Kimihiro OZAKI