Abstract: A contact includes a solder bonding portion, an elastic contact portion, and a suction portion. An undersurface of the solder bonding portion is a solder bonding face which is to be solder bonded to the conductor pattern. The elastic contact portion is connected to one end of the solder bonding portion and bent over the solder bonding portion. When in contact with a conductive member, the elastic contact portion is pressed against the conductive member while being elastically deformed. The suction portion is connected to the solder bonding portion independently of the elastic contact portion. The suction portion is made a suction face for a suction nozzle of an automatic mounter, with its top end being arranged in parallel to the undersurface of the solder bonding portion on the conductive member side of the elastic contact portion.

Abstract: A conductive component includes a tubular body having at least one of at least one through-hole which penetrates the tubular body from outside to inside thereof; and at least one notch which is cut in from an edge of the tubular body, which are formed at least one predetermined portion on the tubular body. The tubular body includes a first portion, which includes a solder joint portion, and a second portion, which includes a contact portion. The first portion and the second portion are located on the opposite sides from one another with the at least one predetermined portion sandwiched therebetween. The tubular body further includes at least one spring portion which includes the at least one predetermined portion.

Abstract: A surface mount contact interposes between a mounted conductor and a pressing conductive member to make the mounted conductor conductive to the pressing conductive member when the mounted conductor and the pressing conductive member are proximate to each other. The surface mount contact includes: a base portion solderable to the mounted conductor; a movable portion elastically deformable according to a distance between the mounted conductor and the pressing conductive member, at least a part of the movable portion being closer to the base portion when the movable portion elastically deforms; and an insulating coating film provided in a region where the movable portion is closer to the base portion and inhibiting electric contact between the movable portion and the base portion.

Abstract: A surface mount contact member includes a metal base and a conductive coil spring. The metal base is provided with a nozzle suction surface to be sucked by a suction nozzle and a soldering surface that can be soldered. The soldering surface is faced downward when the nozzle suction surface is faced upward. The conductive coil spring is attached to the metal base in an electrically conductive manner with the nozzle suction surface being exposed to an inner peripheral side of the coil spring.

Abstract: A surface mount contact member includes a metal base and a conductive coil spring. The metal base is provided with a nozzle suction surface to be sucked by a suction nozzle and a soldering surface that can be soldered. The soldering surface is faced downward when the nozzle suction surface is faced upward. The conductive coil spring is attached to the metal base in an electrically conductive manner with the nozzle suction surface being exposed to an inner peripheral side of the coil spring.

Abstract: Proper grounding of a printed circuit board to a grounding conductor by solving the problems in soldering a grounding terminal to a printed circuit board by reflow soldering, relating to a mounting structure of a grounding terminal on a printed circuit board formed by soldering a grounding terminal to the printed circuit board. Two joint surfaces having different surface areas are formed within the joint part of the grounding terminal, and the grounding terminal is soldered to the conductive pattern on the printed circuit board corresponding to the joint surfaces by using the solder having an amount corresponding to the surface area of each joint surface. Also the bending area as the center of elastic deformation of the contact part of the grounding terminal is formed at a predetermined distance away from the relatively small joint surface of the joint part.

Abstract: A conductive element having good solderability and the manufacturing method thereof. A metal wire having a circular section and tin-plated along its whole circumference is prepared and pressed by a pressing machine from the side directions until the metal wire becomes almost flat. By this, a strip of thin plate-like member is formed. Then, a conductive silicone base adhesive is applied to one surface (one pressed surface) of the plate-like member and dried. Thus, the conductive element comprising the plate-like member and the conductive elastomer joined to the pressed surface thereof is obtained.

Abstract: The present invention realizes proper grounding of a printed circuit board to a grounding conductor by solving the problems in soldering a grounding terminal to a printed circuit board by reflow soldering, relating to a mounting structure of a grounding terminal on a printed circuit board formed by soldering a grounding terminal to the printed circuit board. Two joint surfaces having different surface areas are formed within the joint part of the grounding terminal, and the grounding terminal is soldered to the conductive pattern on the printed circuit board corresponding to the joint surfaces by using the solder having an amount corresponding to the surface area of each joint surface. Also, the bending area as the center of elastic deformation of the contact part of the grounding terminal is formed at a predetermined distance away from the relatively small joint surface of the joint part.

Abstract: The present invention realizes proper grounding of a printed circuit board to a grounding conductor by solving the problems in soldering a grounding terminal to a printed circuit board by reflow soldering, relating to a mounting structure of a grounding terminal on a printed circuit board formed by soldering a grounding terminal to the printed circuit board. Two joint surfaces having different surface areas are formed within the joint part of the grounding terminal, and the grounding terminal is soldered to the conductive pattern on the printed circuit board corresponding to the joint surfaces by using the solder having an amount corresponding to the surface area of each joint surface. Also, the bending area as the center of elastic deformation of the contact part of the grounding terminal is formed at a predetermined distance away from the relatively small joint surface of the joint part.

Abstract: The present invention realizes proper grounding of a printed circuit board to a grounding conductor by solving the problems in soldering a grounding terminal to a printed circuit board by reflow soldering, relating to a mounting structure of a grounding terminal on a printed circuit board formed by soldering a grounding terminal to the printed circuit board. Two joint surfaces having different surface areas are formed within the joint part of the grounding terminal, and the grounding terminal is soldered to the conductive pattern on the printed circuit board corresponding to the joint surfaces by using the solder having an amount corresponding to the surface area of each joint surface. Also, the bending area as the center of elastic deformation of the contact part of the grounding terminal is formed at a predetermined distance away from the relatively small joint surface of the joint part.

Abstract: The present invention provides a conductive element having good solderability and the manufacturing method thereof. A metal wire having a circular section and tin-plated along its whole circumference is prepared and pressed by a pressing machine from the side directions until the metal wire becomes almost flat. By this, a strip of thin plate-like member is formed. Then, a conductive silicone base adhesive is applied to one surface (one pressed surface) of the plate-like member and dried. Thus, the conductive element comprising the plate-like member and the conductive elastomer joined to the pressed surface thereof is obtained.

Abstract: The present invention realizes proper grounding of a printed circuit board to a grounding conductor by solving the problems in soldering a grounding terminal to a printed circuit board by reflow soldering, relating to a mounting structure of a grounding terminal on a printed circuit board formed by soldering a grounding terminal to the printed circuit board. Two joint surfaces having different surface areas are formed within the joint part of the grounding terminal, and the grounding terminal is soldered to the conductive pattern on the printed circuit board corresponding to the joint surfaces by using the solder having an amount corresponding to the surface area of each joint surface. Also, the bending area as the center of elastic deformation of the contact part of the grounding terminal is formed at a predetermined distance away from the relatively small joint surface of the joint part.

Abstract: A sewn material for shielding against electromagnetic waves is provided without increasing the number of stitch perforations created when sewing electrically conductive threads to a base material. Two electrically conductive threads are sewn on at least one edge of a strip of elastomeric base material in an over-edge chain stitch that extends across the edge surface of the base material. Portions of the threads are partly exposed on the edge surface and other portions of the threads are sewn through the base material, thereby providing dual shield layers for shielding against electromagnetic waves entering from the side of the base material.

Abstract: An electromagnetic-shielding gasket of the present invention shields electronic components from electromagnetic waves by covering a surface of a resilient core with metal mesh and inserting the core into a joint of a conductive housing which contains electronic components. The core comprises an installing portion which is fixed to the joint of the conductive housing. A segregating portion or area separates the metal mesh from the surface of the core in the corner portions so that when the core elastically deforms greatly during insertion or use of the gasket, the metal mesh does not break as the core presses and pulls the metal mesh.