Abstract: [Object] To provide a solid-state imaging device and an electronic apparatus with further improved performance. [Solution] A solid-state imaging device including: a first substrate on which a pixel unit is formed, and a first semiconductor substrate and a first multi-layered wiring layer are stacked; a second substrate on which a circuit having a predetermined function is formed, and a second semiconductor substrate and a second multi-layered wiring layer are stacked; and a third substrate on which a circuit having a predetermined function is formed, and a third semiconductor substrate and a third multi-layered wiring layer are stacked. The first substrate, the second substrate, and the third substrate are stacked in this order. The pixel unit has pixels arranged thereon. The first substrate and the second substrate are bonded together with the first multi-layered wiring layer and the second semiconductor substrate opposed to each other.

Abstract: A solid-state imaging device including: a first substrate having a pixel unit, and a first semiconductor substrate and a first wiring layer; a second substrate with a circuit, and a second semiconductor substrate and a second wiring layer; and a third substrate with a circuit, and a third semiconductor substrate and a third wiring layer. The first and second substrates are bonded together such that the first wiring layer and the second semiconductor substrate are opposed to each other. The device includes a first coupling structure for electrically coupling a circuit of the first substrate and the circuit of the second substrate. The first coupling structure includes a via in which electrically-conductive materials are embedded in a first through hole that exposes a wiring line in the first wiring layer and in a second through hole that exposes a wiring line in the second wiring layer or a film-formed structure.

Abstract: A solid-state imaging device including: a first substrate having a pixel unit, and a first semiconductor substrate and a first wiring layer; a second substrate with a circuit, and a second semiconductor substrate and a second wiring layer; and a third substrate with a circuit, and a third semiconductor substrate and a third wiring layer. The first and second substrates are bonded together such that the first wiring layer and the second semiconductor substrate are opposed to each other. The device includes a first coupling structure for electrically coupling a circuit of the first substrate and the circuit of the second substrate. The first coupling structure includes a via in which electrically-conductive materials are embedded in a first through hole that exposes a wiring line in the first wiring layer and in a second through hole that exposes a wiring line in the second wiring layer or a film-formed structure.

Abstract: There is provided a solid-state imaging device including first, second, and third substrates stacked in this order. The first substrate includes a first semiconductor substrate and a first wiring layer. A pixel unit is formed on the first semiconductor substrate. The second substrate includes a second semiconductor substrate and a second wiring layer. The third substrate includes a third semiconductor substrate and a third wiring layer. A first coupling structure couples two of the first, second, and third substrates to each other includes a via. The via has a structure in which electrically-conductive materials are embedded in one through hole and another through hole, or a structure in which films including electrically-conductive materials are formed on inner walls of the through holes. The one through hole exposes a first wiring line in one of the wiring layers. The other through hole exposes a second wiring line in another wiring layer.

Abstract: [Object] To provide a solid-state imaging device and an electronic apparatus with further improved performance.

Abstract: There is provided a solid-state imaging device including: a first substrate including a first semiconductor substrate and a first wiring layer, the first semiconductor substrate having a pixel unit with pixels; a second substrate including a second semiconductor substrate and a second wiring layer, the second semiconductor substrate having a circuit with a predetermined function; and a third substrate including a third semiconductor substrate and a third wiring layer, the third semiconductor substrate having a circuit with a predetermined function, the first, second, and third substrates being stacked in this order, the first substrate and the second substrate being bonded together with the first wiring layer and the second wiring layer opposed to each other, a first coupling structure on bonding surfaces of the first substrate and the second substrate, and including an electrode junction structure with electrodes formed on the respective bonding surfaces in direct contact with each other.

Abstract: [Object] To further improve performance of a solid-state imaging device. [Solution] There is provided a solid-state imaging device including: a first substrate; a second substrate; and a third substrate that are stacked in this order. The first substrate includes a first semiconductor substrate and a first multi-layered wiring layer stacked on the first semiconductor substrate. The first semiconductor substrate has a pixel unit formed thereon. The pixel unit has pixels arranged thereon. The second substrate includes a second semiconductor substrate and a second multi-layered wiring layer stacked on the second semiconductor substrate. The second semiconductor substrate has a circuit formed thereon. The circuit has a predetermined function. The third substrate includes a third semiconductor substrate and a third multi-layered wiring layer stacked on the third semiconductor substrate. The third semiconductor substrate has a circuit formed thereon. The circuit has a predetermined function.

Abstract: A solid-state imaging device including: a first substrate having a pixel unit, and a first semiconductor substrate and a first wiring layer; a second substrate with a circuit, and a second semiconductor substrate and a second wiring layer; and a third substrate with a circuit, and a third semiconductor substrate and a third wiring layer. The first and second substrates are bonded together such that the first wiring layer and the second semiconductor substrate are opposed to each other. The device includes a first coupling structure for electrically coupling a circuit of the first substrate and the circuit of the second substrate. The first coupling structure includes a via in which electrically-conductive materials are embedded in a first through hole that exposes a wiring line in the first wiring layer and in a second through hole that exposes a wiring line in the second wiring layer or a film-formed structure.

Abstract: [Object] To provide a solid-state imaging device and an electronic apparatus with further improved performance. [Solution] A solid-state imaging device including: a first substrate on which a pixel unit is formed, and a first semiconductor substrate and a first multi-layered wiring layer are stacked; a second substrate on which a circuit having a predetermined function is formed, and a second semiconductor substrate and a second multi-layered wiring layer are stacked; and a third substrate on which a circuit having a predetermined function is formed, and a third semiconductor substrate and a third multi-layered wiring layer are stacked. The first substrate, the second substrate, and the third substrate are stacked in this order. The pixel unit has pixels arranged thereon. The first substrate and the second substrate are bonded together in a manner that the first multi-layered wiring layer and the second semiconductor substrate are opposed to each other.

Abstract: [Object] To further improve performance of a solid-state imaging device.

Abstract: [Object] To provide a solid-state imaging device and an electronic apparatus with further improved performance. [Solution] A solid-state imaging device including: a first substrate on which a pixel unit is formed, and a first semiconductor substrate and a first multi-layered wiring layer are stacked; a second substrate on which a circuit having a predetermined function is formed, and a second semiconductor substrate and a second multi-layered wiring layer are stacked; and a third substrate on which a circuit having a predetermined function is formed, and a third semiconductor substrate and a third multi-layered wiring layer are stacked. The first substrate, the second substrate, and the third substrate are stacked in this order. The pixel unit has pixels arranged thereon. The first substrate and the second substrate are bonded together with the first multi-layered wiring layer and the second semiconductor substrate opposed to each other.

Abstract: To provide a gland packing capable of suppressing a fluid from permeating into a packing body or leaking from the packing body through a contact surface between a laminating member and a protrusion of the packing body. The gland packing includes an annular packing body (21) which is formed by winding an expanded graphite tape material in a spiral shape and a laminating member (22) that is bonded to an axial end surface of the packing body (21) and is formed of an annular expanded graphite sheet material, the axial end surface of the packing body (21) being provided with a protrusion (24) facing and contacting an inner peripheral portion or an outer peripheral portion of the laminating member (22) in the radial direction, in which a contact surface (27) between the protrusion (24) and the laminating member (22) is formed so that a radius changes in at least a part in the axial direction.

Abstract: A gland packing includes an annular packing body which is formed by winding an expanded graphite tape material in a spiral shape and a laminating member that is bonded to an axial end surface of the packing body and is formed of an annular expanded graphite sheet material, the axial end surface of the packing body being provided with a protrusion facing and contacting an inner peripheral portion or an outer peripheral portion of the laminating member in the radial direction, in which a contact surface between the protrusion and the laminating member is formed so that a radius changes in at least a part in the axial direction.

Abstract: The present invention relates to a filler material (1) for a spiral wound gasket, and to a spiral wound gasket (W) using the fillermaterial (1). The fillermaterial (1) and the spiral wound gasket (W) according to the invention can be applied to various pipe joints and a joint portions of fluid equipments for sealing fluid such as liquid and gaseous body. The filler material (1) of the invention is obtained by removing, by blast treatment, a high density portion on a front surface (2A) or a back surface (2B) of a tape-like expansive graphite tape (2) formed by integrally pressurizing expanded graphite particles. The spiral wound gasket (W) is obtained by overlapping the filler material (1) and a hoop material (5) made of metal band plate with each other and winding them in the form of a spiral. The spiral wound gasket (W) is superior in productivity, and in flexibility, bending property and pliability, and exhibit excellent sealing property even at a low surface pressure.

Abstract: A shaft seal apparatus that exhibits a good and reliable sealing performance, even when a rotating shaft undergoes axial vibration, eccentric revolution, or the like. This shaft seal apparatus has gland packings (2) stuffed in a sealed space (10) formed between a rotating shaft (9) and a stuffing box (1), with gland packings (2) pressed between a first packing gland (3) on a sealed liquid region side (7) and a second packing gland (4) on an atmospheric region side (8). The first packing gland (3) is fixed to a rotary equipment body (6) and the second packing gland (4) is to the stuffing box (1). A screw bolt (15) extending in the axial direction of the rotating shaft (9) is anchored to the first packing gland (3). The stuffing box (1) is provided with a through hole (16) larger than the screw bolt (15) in the flange (1a). The screw bolt (15) running through the through hole (16) has a tightening nut (17) thereon at a place which is out of and backward of the hole (16).

Abstract: A method of producing a spiral wound gasket for sealing fluid such as a liquid including water and oil, and a gaseous body including vapor and gas and a device for producing the spiral wound gasket. The tip portion of a hoop material is cut and raised thereby forming a checking stepped-portion. The checking stepped-portion is caught by a checking pawl, so as to wind the hoop material around a core drum. After winding the hoop material around the outer periphery of the core drum, at least once, the checking pawl is retracted from the outer periphery of the core drum, thereby separating the checking pawl from the checking stepped-portion. The spiral wound gasket produced by the present invention exhibits an excellent sealing property. Moreover, it also has an excellent durability.