Patents by Inventor Hidetoshi Abe

Hidetoshi Abe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260121063
    Abstract: One embodiment of the present application provides a lithium-sulfur battery positive electrode including a positive electrode current collector and a sulfur layer deposited on a surface of the positive electrode current collector, wherein the sulfur layer contains sulfur and/or a sulfur compound which is a main positive electrode active material, a lithium-containing oxide, and a nitrogen-containing organic compound, and the nitrogen-containing organic compound is a nitrogen-containing heterocyclic compound.
    Type: Application
    Filed: December 26, 2024
    Publication date: April 30, 2026
    Applicant: ABRI Co., Ltd.
    Inventors: Koshin Takemoto, Jungo Wakasugi, Masaaki Kubota, Hidetoshi Abe
  • Publication number: 20260101750
    Abstract: A semiconductor device includes a semiconductor element, and a first terminal that is positioned on a first side in a first direction from the semiconductor element and electrically connected to the semiconductor element. In the first direction, a first channel is provided between the semiconductor element and the first terminal. The semiconductor element is in contact with the first channel. In one example, the semiconductor device additionally includes a first conductive member that is electrically connected to the semiconductor element and the first terminal. The first conductive member is contained in the first channel.
    Type: Application
    Filed: December 2, 2025
    Publication date: April 9, 2026
    Inventors: Masashi HAYASHIGUCHI, Hidetoshi ABE, Yoshihisa TSUKAMOTO
  • Publication number: 20260090384
    Abstract: A semiconductor device includes: a first semiconductor element; a first terminal positioned on a first side in a first direction relative to the first semiconductor element; a protective layer of an insulator partially covering the first semiconductor element; and a first conductive member electrically connected to the first semiconductor element and the first terminal. The protective layer is spaced apart from the first terminal. The first conductive member is positioned between the first semiconductor element and the first terminal in the first direction. The first conductive member includes a first portion overlapping with the protective layer as viewed in a direction perpendicular to the first direction, and a second portion connected to the first portion and positioned on a side opposite the first semiconductor element with respect to the first portion. The second portion protrudes from the protective layer as viewed in a direction perpendicular to the first direction.
    Type: Application
    Filed: December 1, 2025
    Publication date: March 26, 2026
    Inventors: Masashi HAYASHIGUCHI, Hidetoshi ABE, Yoshihisa TSUKAMOTO
  • Publication number: 20260032939
    Abstract: A method for producing a semiconductor power device, includes forming a gate trench from a surface of a semiconductor layer toward an inside thereof. A first insulation film is formed on an inner surface of the gate trench. The method also includes removing a part on a bottom surface of the gate trench in the first insulation film. A second insulation film having a dielectric constant higher than SiO2 is formed in such a way as to cover the bottom surface of the gate trench exposed by removing the first insulation film.
    Type: Application
    Filed: September 29, 2025
    Publication date: January 29, 2026
    Applicant: ROHM CO., LTD.
    Inventors: Keiji OKUMURA, Mineo MIURA, Yuki NAKANO, Noriaki KAWAMOTO, Hidetoshi ABE
  • Publication number: 20250372511
    Abstract: A semiconductor device includes a conductive layer, a first semiconductor element having a first gate electrode, a second semiconductor element having a second gate electrode, and a first signal terminal electrically connected to the first gate electrode and the second gate electrode. The first signal terminal has a first contact point. Let L1 denote a length of a straight line connecting a first center of the first gate electrode and the first contact point. Let L2 denote a length of a straight line connecting a second center of the second gate electrode and the first contact point. Let R1 denote a first conductive-path length from the first center to the first contact point. Let R2 denote a second conductive-path length from the second center to the first contact point. Then, R2/R1 is closer to 1 than L2/L1 is.
    Type: Application
    Filed: August 13, 2025
    Publication date: December 4, 2025
    Inventor: Hidetoshi ABE
  • Publication number: 20250374649
    Abstract: A semiconductor device includes: a conductive layer including a mounting surface; a first semiconductor element bonded to the mounting surface; a first terminal electrically connected to the first semiconductor element; and a first bonding layer electrically bonding the conductive layer and the first terminal. The conductive layer includes a first end surface, and a first peripheral surface located inward of the conductive layer from the first end surface as viewed in a first direction. The conductive layer includes a first engagement portion defined by the first peripheral surface. The first terminal includes a first bonding portion electrically bonded to the first engagement portion via the first bonding layer. As viewed in the first direction, the first bonding portion overlaps with the first engagement portion.
    Type: Application
    Filed: August 13, 2025
    Publication date: December 4, 2025
    Inventor: Hidetoshi ABE
  • Patent number: 12473412
    Abstract: A graphic sheet including: a transparent rigid film substrate; and a receptor layer disposed on the transparent rigid film substrate, the receptor layer containing an acrylic polymer and a white pigment filler; wherein the receptor layer contains not less than 5 parts by mass and not more than 50 parts by mass of the white pigment filler per 100 parts by mass of the acrylic polymer; and a total visible light transmittance of the sheet is not less than 8% and not greater than 50% is described.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: November 18, 2025
    Assignee: 3M Innovative Properties Company
    Inventors: Hidetoshi Abe, Koji Saito
  • Publication number: 20250329782
    Abstract: An electrolyte, the electrolyte including: a first component; a second component; and a solvent, where the first component includes lithium polysulfide, the second component includes lithium bis(fluorosulfonyl)imide, and a concentration A of the lithium bis(fluorosulfonyl)imide satisfies 0.001 mol/dm3?A?0.15 mol/dm3.
    Type: Application
    Filed: January 16, 2024
    Publication date: October 23, 2025
    Applicant: ABRI Co., Ltd.
    Inventors: Koshin TAKEMOTO, Jungo WAKASUGI, Masaaki KUBOTA, Hidetoshi ABE
  • Publication number: 20250304834
    Abstract: Provided is a decorative film that can be used for interior and exterior uses, such as uses for vehicles or buildings, and that can conceal an underlying layer surface to a high degree even when the decorative film has a color with high chroma. The decorative film of an embodiment includes a transparent film layer, a first acrylic pressure sensitive adhesive layer containing a colorant, and a second acrylic pressure sensitive adhesive layer containing a white colorant in this order.
    Type: Application
    Filed: June 9, 2023
    Publication date: October 2, 2025
    Inventors: Hidetoshi Abe, Ken Okura, Michael Jost
  • Patent number: 12403672
    Abstract: A laminate comprising a substrate layer; a contact adhesive layer comprising a contact adhesive agent having at least one of chloroprene rubber or acrylic copolymers, as well as microspheres having an average particle size of 0.5 ?m or greater in the contact adhesive layer, wherein the contact adhesive layer contains from 5 parts by mass to 500 parts by mass of the microspheres per 100 parts by mass of the contact adhesive agent, and the contact adhesive layer has a plurality of protruding portions because of the the microspheres.
    Type: Grant
    Filed: March 10, 2022
    Date of Patent: September 2, 2025
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Hidetoshi Abe, Yuji Kashiwazaki, Mamoru Kanno
  • Publication number: 20250257247
    Abstract: Provided is a polyurethane-based decorative film that combines multiple functions such as coloring and paint protection in a single product. Solution Means A decorative film according to an embodiment includes: a transparent top layer containing a transparent thermoplastic polyurethane elastomer film; and a colored acrylic pressure-sensitive adhesive layer. The decorative film has a tensile strength at 2% strain of 20 N/25 mm or less and an elongation of 150% or greater.
    Type: Application
    Filed: August 3, 2023
    Publication date: August 14, 2025
    Inventor: Hidetoshi Abe
  • Publication number: 20250206002
    Abstract: A decorative film including a transparent surface layer, a colored polyurethane layer, and an adhesive layer, wherein the colored polyurethane layer includes a water-based polyether-based polyurethane and a pigment, and the transparent surface layer and the colored polyurethane layer are disposed adjacent to each other. The polyurethane-based decorative film is excellent in strength, shape followability, weather resistance, and dimensional stability and can be colored in various colors.
    Type: Application
    Filed: May 23, 2023
    Publication date: June 26, 2025
    Inventor: Hidetoshi Abe
  • Publication number: 20250179334
    Abstract: The decorative film for exteriors of an embodiment includes a fluororesin-based film layer and a colored adhesive layer, wherein the colored adhesive layer contains a carboxy group-containing (meth)acrylic polymer, an amino group-containing (meth)acrylic polymer, and from 5 mass % to 50 mass % of titanium oxide based on mass of the colored adhesive layer; the fluororesin-based film layer includes a first layer containing a vinylidene fluoride-based resin and a second layer containing a methacrylate-based resin; the second layer of the fluororesin-based film layer is in contact with the colored adhesive layer; and the decorative film for exteriors has a thickness of 250 ?m or less, and a total heat release for 20 minutes after start of heating is 8 MJ/m2 or lower as measured in accordance with the ISO 5660-1 cone calorimeter heat release test.
    Type: Application
    Filed: March 15, 2023
    Publication date: June 5, 2025
    Inventor: Hidetoshi Abe
  • Publication number: 20250128535
    Abstract: A decorative film of an embodiment includes a transparent surface layer including polycarbonate-based polyurethane, a transparent ink-receiving layer including polyether-based polyurethane, a printed layer disposed on the transparent ink-receiving layer, and a pressure-sensitive adhesive layer in this order.
    Type: Application
    Filed: February 24, 2023
    Publication date: April 24, 2025
    Inventors: Hidetoshi Abe, Koji Saito, Shinya Ohtomo
  • Publication number: 20250070051
    Abstract: A semiconductor device includes a semiconductor element, a lead frame, a conductive member, a resin composition and a sealing resin. The semiconductor element has an element front surface and an element back surface facing away in a first direction. The semiconductor element is mounted on the lead frame. The conductive member is bonded to the lead frame, electrically connecting the semiconductor element and the lead frame. The resin composition covers a bonded region where the conductive member and lead frame are bonded while exposing part of the element front surface. The sealing resin covers part of the lead frame, the semiconductor element, and the resin composition. The resin composition has a greater bonding strength with the lead frame than a bonding strength between the sealing resin and lead frame and a greater bonding strength with the conductive member than a bonding strength between the sealing resin and conductive member.
    Type: Application
    Filed: November 11, 2024
    Publication date: February 27, 2025
    Inventors: Hidetoshi ABE, Makoto IKENAGA, Kensei TAKAMOTO
  • Patent number: 12203010
    Abstract: A transparent solvent-based acrylic pressure-sensitive adhesive agent is described. Such agent contains: an adhesive (meth)acrylic polymer having a weight average molecular weight of 350000 or less; a high Tg (meth)acrylic polymer having a glass transition temperature of 40° C. or higher; a covalent bonding crosslinking agent that can form a covalent bond with the adhesive (meth)acrylic polymer; and at least one type of non-covalent bonding crosslinking agent selected from the group consisting of a benzotriazole compound, a piperidyl compound having at least two piperidyl groups, and an aluminum chelate compounds. Such solvent-based adhesive agent may exhibit a high constant load shear peeling force and maintain good appearance for an adhesive article to which it has been applied.
    Type: Grant
    Filed: October 14, 2020
    Date of Patent: January 21, 2025
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventor: Hidetoshi Abe
  • Patent number: 12176302
    Abstract: A semiconductor device includes a semiconductor element, a lead frame, a conductive member, a resin composition and a sealing resin. The semiconductor element has an element front surface and an element back surface facing away in a first direction. The semiconductor element is mounted on the lead frame. The conductive member is bonded to the lead frame, electrically connecting the semiconductor element and the lead frame. The resin composition covers a bonded region where the conductive member and lead frame are bonded while exposing part of the element front surface. The sealing resin covers part of the lead frame, the semiconductor element, and the resin composition. The resin composition has a greater bonding strength with the lead frame than a bonding strength between the sealing resin and lead frame and a greater bonding strength with the conductive member than a bonding strength between the sealing resin and conductive member.
    Type: Grant
    Filed: September 27, 2023
    Date of Patent: December 24, 2024
    Assignee: ROHM CO., LTD.
    Inventors: Hidetoshi Abe, Makoto Ikenaga, Kensei Takamoto
  • Patent number: 12173205
    Abstract: Adhesive sheets that can adhere to both a smooth surface and a rough surface with sufficient adhesive force and that exhibits smooth visual appearance after adhesion regardless of a surface to be applied are described. In particular, adhesive sheets including a rigid sheet having a thickness of 80 ?m or greater and 2 mm or less; and a first pressure-sensitive adhesive layer disposed on one surface of the rigid sheet, the first pressure-sensitive adhesive layer having a thickness of 40 ?m or greater and 1.2 mm or less and including a microstructured surface including irregularities are described.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: December 24, 2024
    Assignee: 3M Innovative Properties Company
    Inventors: Hidetoshi Abe, Katsuya Ono
  • Publication number: 20240384136
    Abstract: A decorative film for a vehicle interior of one embodiment includes a biaxially stretched polyethylene terephthalate film layer and a colored adhesive layer, in which the colored adhesive layer contains a carboxy group-containing (meth)acrylic polymer, an amino group-containing (meth)acrylic polymer, and a colorant, a pencil hardness on a side of the biaxially stretched polyethylene terephthalate film layer of the decorative film is B or greater, a tensile strength at 2% elongation of the decorative film is 50 N/25 mm or more, an elongation of the decorative film is 60% or greater, and a total calorific value for 20 minutes after the start of heating measured in accordance with an ISO 5660-1 cone calorie meter heat resistance test is 8 MJ/m2 or less.
    Type: Application
    Filed: October 10, 2022
    Publication date: November 21, 2024
    Inventors: Hidetoshi Abe, Ken Okura, Michael Jost
  • Publication number: 20240332367
    Abstract: According to the present invention, a semiconductor device includes a first conductivity type SiC layer, an electrode that is selectively formed upon the SiC layer, and an insulator that is formed upon the SiC layer and that extends to a timing region that is set at an end part of the SiC layer. The insulator includes an electrode lower insulating film that is arranged below the electrode, and an organic insulating layer that is arranged so as to cover the electrode lower insulating film. The length (A) of the interval wherein the organic insulating layer contacts the SiC layer is 40 ?m or more, and the lateral direction distance (B) along the electrode lower insulating layer between the electrode and SiC layer is 40 ?m or more.
    Type: Application
    Filed: June 13, 2024
    Publication date: October 3, 2024
    Applicant: ROHM CO., LTD.
    Inventors: Katsuhisa NAGAO, Hidetoshi ABE