Patents by Inventor Hidetoshi Abe

Hidetoshi Abe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220194053
    Abstract: A laminate comprising a substrate layer; a contact adhesive layer comprising a contact adhesive agent having at least one of chloroprene rubber or acrylic copolymers, as well as microspheres having an average particle size of 0.5 ?m or greater in the contact adhesive layer, wherein the contact adhesive layer contains from 5 parts by mass to 500 parts by mass of the microspheres per 100 parts by mass of the contact adhesive agent, and the contact adhesive layer has a plurality of protruding portions because of the the microspheres.
    Type: Application
    Filed: March 10, 2022
    Publication date: June 23, 2022
    Inventors: Hidetoshi Abe, Yuji Kashiwazaki, Mamoru Kanno
  • Publication number: 20220148949
    Abstract: A semiconductor device includes a substrate including a main surface, a semiconductor element mounted on the main surface, a drive pad, and drive wires. The semiconductor element includes a front surface that faces in a same direction as the main surface and a drive electrode formed on the front surface and containing SiC. The drive wires are spaced apart from each other and connect the drive electrode to the drive pad. The drive wires include a first drive wire and a second drive wire configured to be a combination of furthermost ones of the drive wires. The first drive wire and the second drive wire are separated from each other by a greater distance at the drive pad than at the drive electrode as viewed in a first direction that is perpendicular to the main surface of the substrate.
    Type: Application
    Filed: May 13, 2020
    Publication date: May 12, 2022
    Inventors: Kenji HAYASHI, Takumi KANDA, Hidetoshi ABE
  • Publication number: 20220064493
    Abstract: Adhesive sheets that can adhere to both a smooth surface and a rough surface with sufficient adhesive force and that exhibits smooth visual appearance after adhesion regardless of a surface to be applied are described. In particular, adhesive sheets including a rigid sheet having a thickness of 80 ?m or greater and 2 mm or less; and a first pressure-sensitive adhesive layer disposed on one surface of the rigid sheet, the first pressure-sensitive adhesive layer having a thickness of 40 ?m or greater and 1.2 mm or less and including a microstructured surface including irregularities are described.
    Type: Application
    Filed: December 19, 2019
    Publication date: March 3, 2022
    Inventors: Hidetoshi Abe, Katsuya Ono
  • Publication number: 20210395965
    Abstract: Object: To provide a decorative sheet for a road surface having enhanced surface strength with respect to a large vehicle weight of a vehicle and having enhanced stationary steering resistance against a steering operation performed while a vehicle is stopped. Solution: A decorative sheet for a road surface according to an embodiment of the present invention includes: a graphic construct including an adhesive layer, and a design layer provided on the adhesive layer; and a surface coating layer covering the graphic construct and containing a urethane resin.
    Type: Application
    Filed: February 5, 2019
    Publication date: December 23, 2021
    Inventors: Yoshinori Araki, Hidetoshi Abe, Takeshi Dobashi, Junichi Saito, Ken Okura, Masaaki Furusawa
  • Publication number: 20210395475
    Abstract: A graphic sheet including: a transparent rigid film substrate; and a receptor layer disposed on the transparent rigid film substrate, the receptor layer containing an acrylic polymer and a white pigment filler; wherein the receptor layer contains not less than 5 parts by mass and not more than 50 parts by mass of the white pigment filler per 100 parts by mass of the acrylic polymer; and a total visible light transmittance of the sheet is not less than 8% and not greater than 50% is described.
    Type: Application
    Filed: September 26, 2019
    Publication date: December 23, 2021
    Inventors: Hidetoshi Abe, Koji Saito
  • Publication number: 20210370641
    Abstract: A construction member of one embodiment of the present disclosure includes a decorative film and a pre-mask: that is laminated to the decorative film and removed alter application of the decorative film is described. The decorative film includes: a transparent resin film having, an embossed first surface and a second surface opposite the first surface; a printed layer disposed on the second surface of the transparent resin: film; and a colored adhesive layer disposed on or above the printed layer. The pre-mask includes: a support film having a first surface and a second, surface opposite: the first surface; and a pressure-sensitive adhesive layer that has an uneven surface and: is disposed on the first, surface of the support film. The first surface of the transparent resin film of the decorative film and the uneven surface of the pressure-sensitive adhesive layer of the pre-mask face each other.
    Type: Application
    Filed: August 1, 2019
    Publication date: December 2, 2021
    Inventors: Hidetoshi Abe, Koji Saito
  • Publication number: 20210305175
    Abstract: A semiconductor device includes a semiconductor element, a lead frame, a conductive member, a resin composition and a sealing resin. The semiconductor element has an element front surface and an element back surface facing away in a first direction. The semiconductor element is mounted on the lead frame. The conductive member is bonded to the lead frame, electrically connecting the semiconductor element and the lead frame. The resin composition covers a bonded region where the conductive member and lead frame are bonded while exposing part of the element front surface. The sealing resin covers part of the lead frame, the semiconductor element, and the resin composition. The resin composition has a greater bonding strength with the lead frame than a bonding strength between the sealing resin and lead frame and a greater bonding strength with the conductive member than a bonding strength between the sealing resin and conductive member.
    Type: Application
    Filed: July 18, 2019
    Publication date: September 30, 2021
    Inventors: Hidetoshi ABE, Makoto IKENAGA, Kensei TAKAMOTO
  • Publication number: 20210129577
    Abstract: A decorative sheet including a base material, a three-dimensional shape printed portion provided on the base material by ultraviolet light curing inkjet printing, and an over-laminate film laminated on the base material and the printed portion, the over-laminate film including a film layer and an adhesive layer and having a three-dimensional shape following the three-dimensional shape of the printed portion.
    Type: Application
    Filed: December 27, 2017
    Publication date: May 6, 2021
    Inventors: Koji Saito, Hidetoshi Abe
  • Publication number: 20210070975
    Abstract: A film is described comprising a (meth)acrylic polymer and a polyvinyl acetal (e.g. butyral) resin. In some embodiments, the film has a glass transition temperature (i.e. Tg) ranging from 30° C. to 60° C. In some embodiments, the film has a gel content of at least 20% or greater. In some embodiments, the film has an elongation at break of at least 175%. The film typically comprises photoinitiator as a result of the method by which the film was made. The film may be a monolithic film or a layer of a multilayer film.
    Type: Application
    Filed: November 19, 2020
    Publication date: March 11, 2021
    Inventors: Jonathan E. Janoski, Anthony F. Schultz, Keith R. Lyon, Ronald S. Steelman, Kevin M. Lewandowski, Corinne E. Lipscomb, Terry R. Hobbs, Arlin L. Weikel, Jayshree Seth, Duane D. Fansler, Hidetoshi Abe
  • Publication number: 20210009863
    Abstract: An adhesive sheet of an embodiment of the present disclosure is an adhesive sheet including: a rigid resin film having a thickness of 80 micrometers to 500 micrometers, and a first pressure sensitive adhesive layer being disposed on or above a surface of the rigid resin film, wherein the first pressure sensitive adhesive layer includes elastic resin microspheres having a volume average particle diameter of 110 micrometers or greater and a tacky binder, and the first pressure sensitive adhesive layer has an uneven surface due to the presence of the microspheres.
    Type: Application
    Filed: April 4, 2018
    Publication date: January 14, 2021
    Inventors: Hidetoshi Abe, Kengo Imamura, Katsuya Ono, Yoshihiko Takeda, Takeo Yamamoto
  • Patent number: 10893188
    Abstract: An imaging apparatus includes an imaging device that photoelectrically converts an optical image obtained through a focus lens. The focus lens is moved to a focus position set by focus detection performed based on image signals from the imaging device with a first aperture value. A first correction amount of the set focus position is acquired according to a difference between the first aperture value and a second aperture value to be used at a time of photographing. Photographing is executed at a determined focus position at the time of photographing, by a user's operation. If the first correction amount is larger than a predetermined amount, a focus position corrected according to the first correction amount is determined as the focus position at the time of photographing, and if not, the set focus position is determined as the focus position at the time of photographing.
    Type: Grant
    Filed: January 25, 2019
    Date of Patent: January 12, 2021
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Masaki Tokioka, Hiromi Kotoku, Hidetoshi Abe, Takeshi Omata, Kenya Fukabori, Naoki Iwasaki, Hiroaki Kurisu
  • Patent number: 10870750
    Abstract: A film is described comprising a (meth)acrylic polymer and a polyvinyl acetal (e.g. butyral) resin. In some embodiments, the film has a glass transition temperature (i.e. Tg) ranging from 30° C. to 60° C. In some embodiments, the film has a gel content of at least 20% or greater. In some embodiments, the film has an elongation at break of at least 175%. The film typically comprises photoinitiator as a result of the method by which the film was made. The film may be a monolithic film or a layer of a multilayer film.
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: December 22, 2020
    Assignee: 3M Innovative Properties Company
    Inventors: Jonathan E. Janoski, Anthony F. Schultz, Keith R. Lyon, Ronald S. Steelman, Kevin M. Lewandowski, Corinne E. Lipscomb, Terry R. Hobbs, Arlin L. Weikel, Jayshree Seth, Duane D. Fansler, Hidetoshi Abe
  • Publication number: 20200321451
    Abstract: A method for producing a semiconductor power device, includes forming a gate trench from a surface of a semiconductor layer toward an inside thereof. A first insulation film is formed on an inner surface of the gate trench. The method also includes removing a part on a bottom surface of the gate trench in the first insulation film. A second insulation film having a dielectric constant higher than SiO2 is formed in such a way as to cover the bottom surface of the gate trench exposed by removing the first insulation film.
    Type: Application
    Filed: June 18, 2020
    Publication date: October 8, 2020
    Inventors: Keiji OKUMURA, Mineo MIURA, Yuki NAKANO, Noriaki KAWAMOTO, Hidetoshi ABE
  • Publication number: 20200279923
    Abstract: According to the present invention, a semiconductor device includes a first conductivity type SiC layer, an electrode that is selectively formed upon the SiC layer, and an insulator that is formed upon the SiC layer and that extends to a timing region that is set at an end part of the SiC layer. The insulator includes an electrode lower insulating film that is arranged below the electrode, and an organic insulating layer that is arranged so as to cover the electrode lower insulating film. The length (A) of the interval wherein the organic insulating layer contacts the SiC layer is 40 ?m or more, and the lateral direction distance (B) along the electrode lower insulating layer between the electrode and SiC layer is 40 ?m or more.
    Type: Application
    Filed: May 19, 2020
    Publication date: September 3, 2020
    Inventors: Katsuhisa NAGAO, Hidetoshi ABE
  • Patent number: 10727318
    Abstract: A method for producing a semiconductor power device, includes forming a gate trench from a surface of a semiconductor layer toward an inside thereof. A first insulation film is formed on an inner surface of the gate trench. The method also includes removing a part on a bottom surface of the gate trench in the first insulation film. A second insulation film having a dielectric constant higher than SiO2 is formed in such a way as to cover the bottom surface of the gate trench exposed by removing the first insulation film.
    Type: Grant
    Filed: September 9, 2016
    Date of Patent: July 28, 2020
    Assignee: ROHM CO., LTD.
    Inventors: Keiji Okumura, Mineo Miura, Yuki Nakano, Noriaki Kawamoto, Hidetoshi Abe
  • Publication number: 20200201126
    Abstract: A liquid crystal display capable of reducing the occurrence of defective display due to variations in the initial alignment direction of a liquid crystal alignment control film in a liquid crystal display of an IPS scheme, realizing the stable liquid crystal alignment, providing excellent mass productivity, and having high image quality with a higher contrast ratio. The liquid crystal display has a liquid crystal layer disposed between a pair of substrates, at least one of the substrates being transparent, and an alignment control film formed between the liquid crystal layer and the substrate. At least one of the alignment control films 109 comprises photoreactive polyimide and/or polyamic acid provided with an alignment control ability by irradiation of substantially linearly polarized light.
    Type: Application
    Filed: March 4, 2020
    Publication date: June 25, 2020
    Inventors: Yasushi TOMIOKA, Hidetoshi ABE, Katsumi KONDO
  • Patent number: 10692978
    Abstract: According to the present invention, a semiconductor device includes a first conductivity type SiC layer, an electrode that is selectively formed upon the SiC layer, and an insulator that is formed upon the SiC layer and that extends to a timing region that is set at an end part of the SiC layer. The insulator includes an electrode lower insulating film that is arranged below the electrode, and an organic insulating layer that is arranged so as to cover the electrode lower insulating film. The length (A) of the interval wherein the organic insulating layer contacts the SiC layer is 40 ?m or more, and the lateral direction distance (B) along the electrode lower insulating layer between the electrode and SiC layer is 40 ?m or more.
    Type: Grant
    Filed: May 15, 2015
    Date of Patent: June 23, 2020
    Assignee: ROHM CO., LTD.
    Inventors: Katsuhisa Nagao, Hidetoshi Abe
  • Publication number: 20190238756
    Abstract: An imaging apparatus includes an imaging device that photoelectrically converts an optical image obtained through a focus lens. The focus lens is moved to a focus position set by focus detection performed based on image signals from the imaging device with a first aperture value. A first correction amount of the set focus position is acquired according to a difference between the first aperture value and a second aperture value to be used at a time of photographing. Photographing is executed at a determined focus position at the time of photographing, by a user's operation. If the first correction amount is larger than a predetermined amount, a focus position corrected according to the first correction amount is determined as the focus position at the time of photographing, and if not, the set focus position is determined as the focus position at the time of photographing.
    Type: Application
    Filed: January 25, 2019
    Publication date: August 1, 2019
    Inventors: Masaki Tokioka, Hiromi Kotoku, Hidetoshi Abe, Takeshi Omata, Kenya Fukabori, Naoki Iwasaki, Hiroaki Kurisu
  • Patent number: 10358582
    Abstract: The present application is directed to an acrylic polymer. Specifically, a marking film comprising a film layer which comprises a polymer blend of a first (meth)acrylic polymer having a glass transition temperature of 30 degrees C. to 180 degrees C. and a second (meth)acrylic polymer having a glass transition temperature of over ?80 degrees C. less than 30 degrees C. One from the first and second (meth)acrylic polymers comprises a carboxylic group and another comprises an amide group. The marking film additionally comprises an adhesive layer.
    Type: Grant
    Filed: January 12, 2011
    Date of Patent: July 23, 2019
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Hidetoshi Abe, Yorinobu Takamatsu, Ronald S. Steelman, Naoyuki Toriumi, Michael P. Daniels
  • Publication number: 20190092936
    Abstract: A film is described comprising a (meth)acrylic polymer and a polyvinyl acetal (e.g. butyral) resin. In some embodiments, the film has a glass transition temperature (i.e. Tg) ranging from 30° C. to 60° C. In some embodiments, the film has a gel content of at least 20% or greater. In some embodiments, the film has an elongation at break of at least 175%. The film typically comprises photoinitiator as a result of the method by which the film was made. The film may be a monolithic film or a layer of a multilayer film.
    Type: Application
    Filed: November 28, 2018
    Publication date: March 28, 2019
    Inventors: Jonathan E. Janoski, Anthony F. Schultz, Keith R. Lyon, Ronald S. Steelman, Kevin M. Lewandowski, Corinne E. Lipscomb, Terry R. Hobbs, Arlin L. Weikel, Jayshree Seth, Duane D. Fansler, Hidetoshi Abe