Abstract: A semiconductor device includes a semiconductor element, a lead frame, a conductive member, a resin composition and a sealing resin. The semiconductor element has an element front surface and an element back surface facing away in a first direction. The semiconductor element is mounted on the lead frame. The conductive member is bonded to the lead frame, electrically connecting the semiconductor element and the lead frame. The resin composition covers a bonded region where the conductive member and lead frame are bonded while exposing part of the element front surface. The sealing resin covers part of the lead frame, the semiconductor element, and the resin composition. The resin composition has a greater bonding strength with the lead frame than a bonding strength between the sealing resin and lead frame and a greater bonding strength with the conductive member than a bonding strength between the sealing resin and conductive member.

Abstract: A construction member of one embodiment of the present disclosure includes a decorative film and a pre-mask: that is laminated to the decorative film and removed alter application of the decorative film is described. The decorative film includes: a transparent resin film having, an embossed first surface and a second surface opposite the first surface; a printed layer disposed on the second surface of the transparent resin: film; and a colored adhesive layer disposed on or above the printed layer. The pre-mask includes: a support film having a first surface and a second, surface opposite: the first surface; and a pressure-sensitive adhesive layer that has an uneven surface and: is disposed on the first, surface of the support film. The first surface of the transparent resin film of the decorative film and the uneven surface of the pressure-sensitive adhesive layer of the pre-mask face each other.

Abstract: A semiconductor device includes a semiconductor element, a lead frame, a conductive member, a resin composition and a sealing resin. The semiconductor element has an element front surface and an element back surface facing away in a first direction. The semiconductor element is mounted on the lead frame. The conductive member is bonded to the lead frame, electrically connecting the semiconductor element and the lead frame. The resin composition covers a bonded region where the conductive member and lead frame are bonded while exposing part of the element front surface. The sealing resin covers part of the leadframe, the semiconductor element, and the resin composition. The resin composition has a greater bonding strength with the lead frame than a bonding strength between the sealing resin and lead frame and a greater bonding strength with the conductive member than a bonding strength between the sealing resin and conductive member.

Abstract: To provide a water sealing adhesive film for decoration that can reduce or prevent the infiltration of water into an interface between an adhesive layer and an adherend even in an environment where the adhesive film can be contacted with water. A water sealing adhesive film for decoration according to an embodiment of the present disclosure includes: a substrate; and an adhesive layer having a structured surface and being disposed on the substrate, the adhesive layer containing a tacky binder having a crosslinked structure derived from a crosslinking agent, and a water absorbing resin.

Abstract: A film is described comprises a (meth)acrylic polymer and a polyvinyl acetal (e.g. butyral) resin. In some embodiments, the film has a glass transition temperature (i.e. Tg) ranging from 30° C. to 60° C. In some embodiments, the film has a gel content of at least 20% or greater. In some embodiments, the film has an elongation at break of at least 175%. The film typically comprises photoinitiator as a result of the method by which the film was made. The film may be a monolithic film or a layer of a multilayer film.

Abstract: A film is described comprising a (meth)acrylic polymer and a polyvinyl acetal (e.g. butyral) resin. In some embodiments, the film has a glass transition temperature (i.e. Tg) ranging from 30° C. to 60° C. In some embodiments, the film has a gel content of at least 20% or greater. In some embodiments, the film has an elongation at break of at least 175%. The film typically comprises photoinitiator as a result of the method by which the film was made. The film may be a monolithic film or a layer of a multilayer film.

Abstract: A semiconductor device includes a semiconductor element, a lead frame, a conductive member, a resin composition and a sealing resin. The semiconductor element has an element front surface and an element back surface facing away in a first direction. The semiconductor element is mounted on the lead frame. The conductive member is bonded to the lead frame, electrically connecting the semiconductor element and the lead frame. The resin composition covers a bonded region where the conductive member and lead frame are bonded while exposing part of the element front surface. The sealing resin covers part of the leadframe, the semiconductor element, and the resin composition. The resin composition has a greater bonding strength with the lead frame than a bonding strength between the sealing resin and lead frame and a greater bonding strength with the conductive member than a bonding strength between the sealing resin and conductive member.

Abstract: A semiconductor device includes a semiconductor element, a lead frame, a conductive member, a resin composition and a sealing resin. The semiconductor element has an element front surface and an element back surface facing away in a first direction. The semiconductor element is mounted on the lead frame. The conductive member is bonded to the lead frame, electrically connecting the semiconductor element and the lead frame. The resin composition covers a bonded region where the conductive member and lead frame are bonded while exposing part of the element front surface. The sealing resin covers part of the lead frame, the semiconductor element, and the resin composition. The resin composition has a greater bonding strength with the lead frame than a bonding strength between the sealing resin and lead frame and a greater bonding strength with the conductive member than a bonding strength between the sealing resin and conductive member.

Abstract: A liquid crystal display capable of reducing the occurrence of defective display due to variations in the initial alignment direction of a liquid crystal alignment control film in a liquid crystal display of an IPS scheme, realizing the stable liquid crystal alignment, providing excellent mass productivity, and having high image quality with a higher contrast ratio. The liquid crystal display has a liquid crystal layer disposed between a pair of substrates, at least one of the substrates being transparent, and an alignment control film formed between the liquid crystal layer and the substrate. At least one of the alignment control films 109 comprises photoreactive polyimide and/or polyamic acid provided with an alignment control ability by irradiation of substantially linearly polarized light.

Abstract: A transparent solvent-based acrylic pressure-sensitive adhesive agent is described. Such agent contains: an adhesive (meth)acrylic polymer having a weight average molecular weight of 350000 or less; a high Tg (meth)acrylic polymer having a glass transition temperature of 40° C. or higher; a covalent bonding crosslinking agent that can form a covalent bond with the adhesive (meth)acrylic polymer; and at least one type of non-covalent bonding crosslinking agent selected from the group consisting of a benzotriazole compound, a piperidyl compound having at least two piperidyl groups, and an aluminum chelate compounds. Such solvent-based adhesive agent may exhibit a high constant load shear peeling force and maintain good appearance for an adhesive article to which it has been applied.

Abstract: An image capturing apparatus comprises an image capture device configured to capture an object image, a rotation device capable of rotating the image capture device, a first calculation unit configured to calculate a first rotation amount of the rotation unit for correcting image blur based on shaking of the image capturing apparatus, a second calculation unit configured to calculate a second rotation amount for searching for an object from an image captured by the image capture unit, and a stopping unit configured to stop the rotation unit in a case where the first rotation amount and the second rotation amount are both less than threshold values respectively set for the first rotation amount and the second rotation amount.

Abstract: An adhesive sheet of an embodiment of the present disclosure is an adhesive sheet including: a rigid resin film having a thickness of 80 micrometers to 500 micrometers, and a first pressure sensitive adhesive layer being disposed on or above a surface of the rigid resin film, wherein the first pressure sensitive adhesive layer includes elastic resin microspheres having a volume average particle diameter of 110 micrometers or greater and a tacky binder, and the first pressure sensitive adhesive layer has an uneven surface due to the presence of the microspheres.

Abstract: A laminate comprising a substrate layer; a contact adhesive layer comprising a contact adhesive agent having at least one of chloroprene rubber or acrylic copolymers, as well as microspheres having an average particle size of 0.5 ?m or greater in the contact adhesive layer, wherein the contact adhesive layer contains from 5 parts by mass to 500 parts by mass of the microspheres per 100 parts by mass of the contact adhesive agent, and the contact adhesive layer has a plurality of protruding portions because of the the microspheres.

Abstract: A semiconductor device includes a substrate including a main surface, a semiconductor element mounted on the main surface, a drive pad, and drive wires. The semiconductor element includes a front surface that faces in a same direction as the main surface and a drive electrode formed on the front surface and containing SiC. The drive wires are spaced apart from each other and connect the drive electrode to the drive pad. The drive wires include a first drive wire and a second drive wire configured to be a combination of furthermost ones of the drive wires. The first drive wire and the second drive wire are separated from each other by a greater distance at the drive pad than at the drive electrode as viewed in a first direction that is perpendicular to the main surface of the substrate.

Abstract: Adhesive sheets that can adhere to both a smooth surface and a rough surface with sufficient adhesive force and that exhibits smooth visual appearance after adhesion regardless of a surface to be applied are described. In particular, adhesive sheets including a rigid sheet having a thickness of 80 ?m or greater and 2 mm or less; and a first pressure-sensitive adhesive layer disposed on one surface of the rigid sheet, the first pressure-sensitive adhesive layer having a thickness of 40 ?m or greater and 1.2 mm or less and including a microstructured surface including irregularities are described.

Abstract: A graphic sheet including: a transparent rigid film substrate; and a receptor layer disposed on the transparent rigid film substrate, the receptor layer containing an acrylic polymer and a white pigment filler; wherein the receptor layer contains not less than 5 parts by mass and not more than 50 parts by mass of the white pigment filler per 100 parts by mass of the acrylic polymer; and a total visible light transmittance of the sheet is not less than 8% and not greater than 50% is described.

Abstract: Object: To provide a decorative sheet for a road surface having enhanced surface strength with respect to a large vehicle weight of a vehicle and having enhanced stationary steering resistance against a steering operation performed while a vehicle is stopped. Solution: A decorative sheet for a road surface according to an embodiment of the present invention includes: a graphic construct including an adhesive layer, and a design layer provided on the adhesive layer; and a surface coating layer covering the graphic construct and containing a urethane resin.

Abstract: A construction member of one embodiment of the present disclosure includes a decorative film and a pre-mask: that is laminated to the decorative film and removed alter application of the decorative film is described. The decorative film includes: a transparent resin film having, an embossed first surface and a second surface opposite the first surface; a printed layer disposed on the second surface of the transparent resin: film; and a colored adhesive layer disposed on or above the printed layer. The pre-mask includes: a support film having a first surface and a second, surface opposite: the first surface; and a pressure-sensitive adhesive layer that has an uneven surface and: is disposed on the first, surface of the support film. The first surface of the transparent resin film of the decorative film and the uneven surface of the pressure-sensitive adhesive layer of the pre-mask face each other.

Abstract: A semiconductor device includes a semiconductor element, a lead frame, a conductive member, a resin composition and a sealing resin. The semiconductor element has an element front surface and an element back surface facing away in a first direction. The semiconductor element is mounted on the lead frame. The conductive member is bonded to the lead frame, electrically connecting the semiconductor element and the lead frame. The resin composition covers a bonded region where the conductive member and lead frame are bonded while exposing part of the element front surface. The sealing resin covers part of the lead frame, the semiconductor element, and the resin composition. The resin composition has a greater bonding strength with the lead frame than a bonding strength between the sealing resin and lead frame and a greater bonding strength with the conductive member than a bonding strength between the sealing resin and conductive member.

Abstract: A decorative sheet including a base material, a three-dimensional shape printed portion provided on the base material by ultraviolet light curing inkjet printing, and an over-laminate film laminated on the base material and the printed portion, the over-laminate film including a film layer and an adhesive layer and having a three-dimensional shape following the three-dimensional shape of the printed portion.