Patents by Inventor Hidetoshi Mimura

Hidetoshi Mimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240084448
    Abstract: Described herein is a technique capable of improving a film thickness uniformity on a surface of a wafer whereon a film is formed. According to one aspect of the technique of the present disclosure, there is provided a substrate processing apparatus including: a process chamber in which a substrate is processed; a process gas nozzle configured to supply a process gas into the process chamber; an inert gas nozzle configured to supply an inert gas into the process chamber while a concentration of the process gas at the center of the substrate is higher than a concentration required for processing the substrate; and an exhaust pipe configured to exhaust an inner atmosphere of the process chamber; wherein the process gas nozzle and the inert gas nozzle are disposed beside the edge of substrate with a predetermined distance therebetween corresponding to an angle of circumference of 90 to 180 degrees.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Inventors: Hidetoshi MIMURA, Takafumi SASAKI, Hidenari YOSHIDA, Yusaku OKAJIMA
  • Patent number: 11859280
    Abstract: Described herein is a technique capable of improving a film thickness uniformity on a surface of a wafer whereon a film is formed. According to one aspect of the technique of the present disclosure, there is provided a substrate processing apparatus including: a process chamber in which a substrate is processed; a process gas nozzle configured to supply a process gas into the process chamber; an inert gas nozzle configured to supply an inert gas into the process chamber while a concentration of the process gas at the center of the substrate is higher than a concentration required for processing the substrate; and an exhaust pipe configured to exhaust an inner atmosphere of the process chamber; wherein the process gas nozzle and the inert gas nozzle are disposed beside the edge of substrate with a predetermined distance therebetween corresponding to an angle of circumference of 90 to 180 degrees.
    Type: Grant
    Filed: August 22, 2022
    Date of Patent: January 2, 2024
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Hidetoshi Mimura, Takafumi Sasaki, Hidenari Yoshida, Yusaku Okajima
  • Patent number: 11685992
    Abstract: According to one aspect thereof, there is provided a substrate processing apparatus including: a reaction tube including an outer tube and an inner tube; a manifold connected to an open end of the reaction tube; a lid configured to close one end of the manifold; a first gas supply pipe configured to supply a cleaning gas; and a second gas supply pipe configured to supply a purge gas of purging a space inside the manifold. The reaction tube includes: an exhaust space; an exhaust outlet communicating with the exhaust space; a first exhaust port provided in the inner tube so as to face a substrate accommodated in the inner tube; and second exhaust ports through which the exhaust space communicates with the space inside the manifold. At least one of the second exhaust ports promotes gas exhaust in the exhaust space distanced away from the first exhaust port.
    Type: Grant
    Filed: January 9, 2020
    Date of Patent: June 27, 2023
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Yusaku Okajima, Takafumi Sasaki, Hidenari Yoshida, Shuhei Saido, Mitsunori Ishisaka, Hidetoshi Mimura
  • Publication number: 20220403510
    Abstract: Described herein is a technique capable of improving a film thickness uniformity on a surface of a wafer whereon a film is formed. According to one aspect of the technique of the present disclosure, there is provided a substrate processing apparatus including: a process chamber in which a substrate is processed; a process gas nozzle configured to supply a process gas into the process chamber; an inert gas nozzle configured to supply an inert gas into the process chamber while a concentration of the process gas at the center of the substrate is higher than a concentration required for processing the substrate; and an exhaust pipe configured to exhaust an inner atmosphere of the process chamber; wherein the process gas nozzle and the inert gas nozzle are disposed beside the edge of substrate with a predetermined distance therebetween corresponding to an angle of circumference of 90 to 180 degrees.
    Type: Application
    Filed: August 22, 2022
    Publication date: December 22, 2022
    Inventors: Hidetoshi MIMURA, Takafumi SASAKI, Hidenari YOSHIDA, Yusaku OKAJIMA
  • Patent number: 11453942
    Abstract: Described herein is a technique capable of improving a film thickness uniformity on a surface of a wafer whereon a film is formed. According to one aspect of the technique of the present disclosure, there is provided a substrate processing apparatus including: a process chamber in which a substrate is processed; a process gas nozzle configured to supply a process gas into the process chamber; an inert gas nozzle configured to supply an inert gas into the process chamber while a concentration of the process gas at the center of the substrate is higher than a concentration required for processing the substrate; and an exhaust pipe configured to exhaust an inner atmosphere of the process chamber; wherein the process gas nozzle and the inert gas nozzle are disposed beside the edge of substrate with a predetermined distance therebetween corresponding to an angle of circumference of 90 to 180 degrees.
    Type: Grant
    Filed: July 22, 2019
    Date of Patent: September 27, 2022
    Assignee: Kokusai Electric Corporation
    Inventors: Hidetoshi Mimura, Takafumi Sasaki, Hidenari Yoshida, Yusaku Okajima
  • Publication number: 20200149159
    Abstract: According to one aspect thereof, there is provided a substrate processing apparatus including: a reaction tube including an outer tube and an inner tube; a manifold connected to an open end of the reaction tube; a lid configured to close one end of the manifold; a first gas supply pipe configured to supply a cleaning gas; and a second gas supply pipe configured to supply a purge gas of purging a space inside the manifold. The reaction tube includes: an exhaust space; an exhaust outlet communicating with the exhaust space; a first exhaust port provided in the inner tube so as to face a substrate accommodated in the inner tube; and second exhaust ports through which the exhaust space communicates with the space inside the manifold. At least one of the second exhaust ports promotes gas exhaust in the exhaust space distanced away from the first exhaust port.
    Type: Application
    Filed: January 9, 2020
    Publication date: May 14, 2020
    Applicant: KOKUSAI ELECTRIC CORPORATION
    Inventors: Yusaku OKAJIMA, Takafumi SASAKI, Hidenari YOSHIDA, Shuhei SAIDO, Mitsunori ISHISAKA, Hidetoshi MIMURA
  • Publication number: 20190345605
    Abstract: Described herein is a technique capable of improving a film thickness uniformity on a surface of a wafer whereon a film is formed. According to one aspect of the technique of the present disclosure, there is provided a substrate processing apparatus including: a process chamber in which a substrate is processed; a process gas nozzle configured to supply a process gas into the process chamber; an inert gas nozzle configured to supply an inert gas into the process chamber while a concentration of the process gas at the center of the substrate is higher than a concentration required for processing the substrate; and an exhaust pipe configured to exhaust an inner atmosphere of the process chamber; wherein the process gas nozzle and the inert gas nozzle are disposed beside the edge of substrate with a predetermined distance therebetween corresponding to an angle of circumference of 90 to 180 degrees.
    Type: Application
    Filed: July 22, 2019
    Publication date: November 14, 2019
    Inventors: Hidetoshi Mimura, Takafumi Sasaki, Hidenari Yoshida, Yusaku Okajima
  • Publication number: 20190071777
    Abstract: Described herein is a technique capable of improving uniformity between substrates. According to the technique, there is provided a substrate processing apparatus including: a substrate retainer including a product wafer support region for supporting product wafers with patterns in a stacked state, an upper dummy wafer support region for supporting dummy wafers above the product wafer support region, and a lower dummy wafer support region for supporting dummy wafers below the product wafer support region; a process chamber accommodating the substrate retainer; a gas supply system for supplying a gas to the substrate retainer, including a tubular nozzle vertically extending along the substrate retainer, and a gas supply port provided at the nozzle; and an exhaust system for exhausting an atmosphere of the process chamber. An upper end of the gas supply port is located lower than an uppermost dummy wafer supported in the upper dummy wafer support region.
    Type: Application
    Filed: August 29, 2018
    Publication date: March 7, 2019
    Applicant: KOKUSAI ELECTRIC CORPORATION
    Inventors: Hidenari YOSHIDA, Takafumi SASAKI, Hidetoshi MIMURA, Yusaku OKAJIMA
  • Publication number: 20110226142
    Abstract: In a screen printer, printing frame for the screen printer and a preparation method therefor, the screen printer comprises a screen mesh, which is provided on a predetermined frame body so as to be stretched at a predetermined tensile strength, and a plate-making screen master, which is arranged on one of faces of the screen mesh, wherein the tensile strength at time of stretching the screen mesh is higher than that at time of arranging the screen master in the screen mesh.
    Type: Application
    Filed: March 14, 2011
    Publication date: September 22, 2011
    Applicant: RISO KAGAKU CORPORATION
    Inventors: Hidetoshi MIMURA, Shigeki TANAKA, Yasuyuki MIKATSURA
  • Publication number: 20100236063
    Abstract: A vehicle-mounted camera (1) comprises a lower case (2) constituting a part of a case, an upper case (3) provided with lenses (3a, 3b) constituting the case integrally with the lower case (2), an imaging element (4) for converting light passing through the lenses (3a, 3b) into an electrical signal, an MID-mounting substrate (6) with the imaging element (4) mounted, substrate mounting bosses (3c, 3d) for mounting the MID-mounting substrate (6) to the upper case (3), and spacers (7a, 7b) interposed between the MID-mounting substrate (6) and the substrate mounting bosses (3c, 3d) for adjusting the clearance between the lenses (3a, 3b) and the light receiving plane of the imaging element (4), structured to fix the lower case (2) to the upper case (3) while the MID-mounting substrate (6) mounted with the imaging element (4) is being fixed to the upper case (3) by the substrate mounting bosses (3c, 3d).
    Type: Application
    Filed: February 5, 2009
    Publication date: September 23, 2010
    Applicant: PANASONIC CORPORATION
    Inventors: Tatsuhiko Inagaki, Makoto Imai, HIdetoshi Mimura
  • Patent number: 7656423
    Abstract: An imaging device stores and photoelectric-converts incoming light from an object of which an image is to be captured with a CCD, and controls an output level of a picture signal obtained by signal processing an image signal output from the CCD. An output adjustment value of the picture signal in the output control is set to become 50 to 70 IRE according to a peak value of the picture signal when a test pattern is captured under standard conditions. Accordingly, it is possible to have a typical imaging device display a captured image darker, and thus enable imaging suitable for nighttime imaging and the like.
    Type: Grant
    Filed: August 12, 2003
    Date of Patent: February 2, 2010
    Assignees: Toyota Jidosha Kabushiki Kaisha, Matsushita Electric Industrial Co., Ltd.
    Inventors: Yasuo Hagisato, Shinya Kawamata, Ryuji Yamaguchi, Hidetoshi Mimura, Tsuyoshi Kumasaka
  • Patent number: 6970184
    Abstract: An image display method for a rearview camera for displaying an image shot by a rearview camera mounted on a vehicle on a screen that can be viewed from a driver's seat, the method includes the step of displaying an auxiliary line image indicating the straight rear direction of the vehicle superimposed on the image shot by the vehicle on the screen. When the vehicle has approached the trailer within a predetermined range, an image from the rearview camera is converted to an image from a virtual overhead viewpoint then displayed on the screen. The driver easily back the vehicle to bring the hitch in the blind spot at the rear of the vehicle to coincide with a coupling member on the trailer while watching the screen display.
    Type: Grant
    Filed: March 28, 2002
    Date of Patent: November 29, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yuichi Hirama, Satoru Masuda, Hidetoshi Mimura, Kazuki Miyama, Masahiro Takata
  • Publication number: 20040042683
    Abstract: An imaging device stores and photoelectric-converts incoming light from an object of which an image is to be captured with a CCD, and controls an output level of a picture signal obtained by signal processing an image signal output from the CCD. An output adjustment value of the picture signal in the output control is set to become 50 to 70 IRE according to a peak value of the picture signal when a test pattern is captured under standard conditions. Accordingly, it is possible to have a typical imaging device display a captured image darker, and thus enable imaging suitable for nighttime imaging and the like.
    Type: Application
    Filed: August 12, 2003
    Publication date: March 4, 2004
    Applicants: TOYOTA JIDOSHA KABUSHIKI KAISHA, MATSUSHITA ELECTRIC INDUSTRIAL
    Inventors: Yasuo Hagisato, Shinya Kawamata, Ryuji Yamaguchi, Hidetoshi Mimura, Tsuyoshi Kumasaka
  • Publication number: 20020175999
    Abstract: When an image shot by a rear-view camera mounted on a vehicle (1a) is changed into an image viewed from the location of a virtual viewpoint, and the obtained image is displayed on a screen, warning lines (51) and (52), for conveying a warning to a driver of the presence of an object within range of the rear of a vehicle, are displayed by being superimposed on the image obtained by the viewpoint conversion. Thus, when an image obtained by the viewpoint conversion of an image shot by a rear-view camera is displayed on a screen, a driver can be apprised not only of the presence of an obstacle within range of a local vehicle but also of the erroneous image interpretation provided by the image obtained by the viewpoint conversion.
    Type: Application
    Filed: April 23, 2002
    Publication date: November 28, 2002
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Etsumi Mutobe, Satoru Masuda, Hidetoshi Mimura, Kazuki Miyama
  • Publication number: 20020149673
    Abstract: An image display method for a rearview camera for displaying an image shot by a rearview camera mounted on a vehicle on a screen that can be viewed from a driver's seat, the method includes the step of displaying an auxiliary line image indicating the straight rear direction of the vehicle superimposed on the image shot by the vehicle on the screen. When the vehicle has approached the trailer within a predetermined range, an image from the rearview camera is converted to an image from a virtual overhead viewpoint then displayed on the screen. The driver easily back the vehicle to bring the hitch in the blind spot at the rear of the vehicle to coincide with a coupling member on the trailer while watching the screen display.
    Type: Application
    Filed: March 28, 2002
    Publication date: October 17, 2002
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yuichi Hirama, Satoru Masuda, Hidetoshi Mimura, Kazuki Miyama, Masahiro Takata
  • Patent number: 5448293
    Abstract: A television camera equipped with a continuously-variable-speed electronic shutter function which can control the charge-storing time of a solid-state image sensor and an amplifier so that a video signal follows the optimum light amount for a subject at high speed and with high accuracy. A shutter-equipped image sensor which is controlled by a shutter pulse generating unit, converts light incident on an optical lens into an electric signal. The electric signal, after being passed through an amplifier and a signal processing unit, is detected by a video level detecting unit as a video level. A shutter control unit holds the shutter amount corresponding to the video level for each field to immediately calculate an estimated shutter amount by using a predetermined equation, and supplies the calculated shutter amount to the shutter pulse generating unit for each field. A control mode decision unit exclusively controls a gain control unit serving as an AGC and the shutter control unit.
    Type: Grant
    Filed: July 1, 1994
    Date of Patent: September 5, 1995
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Haruo Kogane, Hidetoshi Mimura
  • Patent number: 5280359
    Abstract: A video camera specifies as a photometric area any block of a field of image to be picked up and picks up a subject to be seen by optimizing the amount of light regardless of the position where a television camera is located. The video camera comprises a solid-state image pick-up element (CCD), a display device and devices for controlling the diaphragm of a lens. In operation, the image picked up by the solid-state image pick-up element is divided into plural blocks to be displayed. Any block of these plural blocks can be specified as a photometric area. The amount of light for the photometric area is calculated and the diaphragm of the lens is controlled so that the subject can be seen by optimizing amount of light.
    Type: Grant
    Filed: March 24, 1992
    Date of Patent: January 18, 1994
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hidetoshi Mimura, Haruo Kogane, Makoto Sube
  • Patent number: D842823
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: March 12, 2019
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Yusaku Okajima, Hidenari Yoshida, Shuhei Saido, Takafumi Sasaki, Hidetoshi Mimura
  • Patent number: D843958
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: March 26, 2019
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Yusaku Okajima, Hidenari Yoshida, Shuhei Saido, Takafumi Sasaki, Hidetoshi Mimura