Patents by Inventor Hidetoshi Mimura
Hidetoshi Mimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240084448Abstract: Described herein is a technique capable of improving a film thickness uniformity on a surface of a wafer whereon a film is formed. According to one aspect of the technique of the present disclosure, there is provided a substrate processing apparatus including: a process chamber in which a substrate is processed; a process gas nozzle configured to supply a process gas into the process chamber; an inert gas nozzle configured to supply an inert gas into the process chamber while a concentration of the process gas at the center of the substrate is higher than a concentration required for processing the substrate; and an exhaust pipe configured to exhaust an inner atmosphere of the process chamber; wherein the process gas nozzle and the inert gas nozzle are disposed beside the edge of substrate with a predetermined distance therebetween corresponding to an angle of circumference of 90 to 180 degrees.Type: ApplicationFiled: November 20, 2023Publication date: March 14, 2024Inventors: Hidetoshi MIMURA, Takafumi SASAKI, Hidenari YOSHIDA, Yusaku OKAJIMA
-
Patent number: 11859280Abstract: Described herein is a technique capable of improving a film thickness uniformity on a surface of a wafer whereon a film is formed. According to one aspect of the technique of the present disclosure, there is provided a substrate processing apparatus including: a process chamber in which a substrate is processed; a process gas nozzle configured to supply a process gas into the process chamber; an inert gas nozzle configured to supply an inert gas into the process chamber while a concentration of the process gas at the center of the substrate is higher than a concentration required for processing the substrate; and an exhaust pipe configured to exhaust an inner atmosphere of the process chamber; wherein the process gas nozzle and the inert gas nozzle are disposed beside the edge of substrate with a predetermined distance therebetween corresponding to an angle of circumference of 90 to 180 degrees.Type: GrantFiled: August 22, 2022Date of Patent: January 2, 2024Assignee: KOKUSAI ELECTRIC CORPORATIONInventors: Hidetoshi Mimura, Takafumi Sasaki, Hidenari Yoshida, Yusaku Okajima
-
Patent number: 11685992Abstract: According to one aspect thereof, there is provided a substrate processing apparatus including: a reaction tube including an outer tube and an inner tube; a manifold connected to an open end of the reaction tube; a lid configured to close one end of the manifold; a first gas supply pipe configured to supply a cleaning gas; and a second gas supply pipe configured to supply a purge gas of purging a space inside the manifold. The reaction tube includes: an exhaust space; an exhaust outlet communicating with the exhaust space; a first exhaust port provided in the inner tube so as to face a substrate accommodated in the inner tube; and second exhaust ports through which the exhaust space communicates with the space inside the manifold. At least one of the second exhaust ports promotes gas exhaust in the exhaust space distanced away from the first exhaust port.Type: GrantFiled: January 9, 2020Date of Patent: June 27, 2023Assignee: KOKUSAI ELECTRIC CORPORATIONInventors: Yusaku Okajima, Takafumi Sasaki, Hidenari Yoshida, Shuhei Saido, Mitsunori Ishisaka, Hidetoshi Mimura
-
Publication number: 20220403510Abstract: Described herein is a technique capable of improving a film thickness uniformity on a surface of a wafer whereon a film is formed. According to one aspect of the technique of the present disclosure, there is provided a substrate processing apparatus including: a process chamber in which a substrate is processed; a process gas nozzle configured to supply a process gas into the process chamber; an inert gas nozzle configured to supply an inert gas into the process chamber while a concentration of the process gas at the center of the substrate is higher than a concentration required for processing the substrate; and an exhaust pipe configured to exhaust an inner atmosphere of the process chamber; wherein the process gas nozzle and the inert gas nozzle are disposed beside the edge of substrate with a predetermined distance therebetween corresponding to an angle of circumference of 90 to 180 degrees.Type: ApplicationFiled: August 22, 2022Publication date: December 22, 2022Inventors: Hidetoshi MIMURA, Takafumi SASAKI, Hidenari YOSHIDA, Yusaku OKAJIMA
-
Patent number: 11453942Abstract: Described herein is a technique capable of improving a film thickness uniformity on a surface of a wafer whereon a film is formed. According to one aspect of the technique of the present disclosure, there is provided a substrate processing apparatus including: a process chamber in which a substrate is processed; a process gas nozzle configured to supply a process gas into the process chamber; an inert gas nozzle configured to supply an inert gas into the process chamber while a concentration of the process gas at the center of the substrate is higher than a concentration required for processing the substrate; and an exhaust pipe configured to exhaust an inner atmosphere of the process chamber; wherein the process gas nozzle and the inert gas nozzle are disposed beside the edge of substrate with a predetermined distance therebetween corresponding to an angle of circumference of 90 to 180 degrees.Type: GrantFiled: July 22, 2019Date of Patent: September 27, 2022Assignee: Kokusai Electric CorporationInventors: Hidetoshi Mimura, Takafumi Sasaki, Hidenari Yoshida, Yusaku Okajima
-
Publication number: 20200149159Abstract: According to one aspect thereof, there is provided a substrate processing apparatus including: a reaction tube including an outer tube and an inner tube; a manifold connected to an open end of the reaction tube; a lid configured to close one end of the manifold; a first gas supply pipe configured to supply a cleaning gas; and a second gas supply pipe configured to supply a purge gas of purging a space inside the manifold. The reaction tube includes: an exhaust space; an exhaust outlet communicating with the exhaust space; a first exhaust port provided in the inner tube so as to face a substrate accommodated in the inner tube; and second exhaust ports through which the exhaust space communicates with the space inside the manifold. At least one of the second exhaust ports promotes gas exhaust in the exhaust space distanced away from the first exhaust port.Type: ApplicationFiled: January 9, 2020Publication date: May 14, 2020Applicant: KOKUSAI ELECTRIC CORPORATIONInventors: Yusaku OKAJIMA, Takafumi SASAKI, Hidenari YOSHIDA, Shuhei SAIDO, Mitsunori ISHISAKA, Hidetoshi MIMURA
-
Publication number: 20190345605Abstract: Described herein is a technique capable of improving a film thickness uniformity on a surface of a wafer whereon a film is formed. According to one aspect of the technique of the present disclosure, there is provided a substrate processing apparatus including: a process chamber in which a substrate is processed; a process gas nozzle configured to supply a process gas into the process chamber; an inert gas nozzle configured to supply an inert gas into the process chamber while a concentration of the process gas at the center of the substrate is higher than a concentration required for processing the substrate; and an exhaust pipe configured to exhaust an inner atmosphere of the process chamber; wherein the process gas nozzle and the inert gas nozzle are disposed beside the edge of substrate with a predetermined distance therebetween corresponding to an angle of circumference of 90 to 180 degrees.Type: ApplicationFiled: July 22, 2019Publication date: November 14, 2019Inventors: Hidetoshi Mimura, Takafumi Sasaki, Hidenari Yoshida, Yusaku Okajima
-
Publication number: 20190071777Abstract: Described herein is a technique capable of improving uniformity between substrates. According to the technique, there is provided a substrate processing apparatus including: a substrate retainer including a product wafer support region for supporting product wafers with patterns in a stacked state, an upper dummy wafer support region for supporting dummy wafers above the product wafer support region, and a lower dummy wafer support region for supporting dummy wafers below the product wafer support region; a process chamber accommodating the substrate retainer; a gas supply system for supplying a gas to the substrate retainer, including a tubular nozzle vertically extending along the substrate retainer, and a gas supply port provided at the nozzle; and an exhaust system for exhausting an atmosphere of the process chamber. An upper end of the gas supply port is located lower than an uppermost dummy wafer supported in the upper dummy wafer support region.Type: ApplicationFiled: August 29, 2018Publication date: March 7, 2019Applicant: KOKUSAI ELECTRIC CORPORATIONInventors: Hidenari YOSHIDA, Takafumi SASAKI, Hidetoshi MIMURA, Yusaku OKAJIMA
-
Publication number: 20110226142Abstract: In a screen printer, printing frame for the screen printer and a preparation method therefor, the screen printer comprises a screen mesh, which is provided on a predetermined frame body so as to be stretched at a predetermined tensile strength, and a plate-making screen master, which is arranged on one of faces of the screen mesh, wherein the tensile strength at time of stretching the screen mesh is higher than that at time of arranging the screen master in the screen mesh.Type: ApplicationFiled: March 14, 2011Publication date: September 22, 2011Applicant: RISO KAGAKU CORPORATIONInventors: Hidetoshi MIMURA, Shigeki TANAKA, Yasuyuki MIKATSURA
-
Publication number: 20100236063Abstract: A vehicle-mounted camera (1) comprises a lower case (2) constituting a part of a case, an upper case (3) provided with lenses (3a, 3b) constituting the case integrally with the lower case (2), an imaging element (4) for converting light passing through the lenses (3a, 3b) into an electrical signal, an MID-mounting substrate (6) with the imaging element (4) mounted, substrate mounting bosses (3c, 3d) for mounting the MID-mounting substrate (6) to the upper case (3), and spacers (7a, 7b) interposed between the MID-mounting substrate (6) and the substrate mounting bosses (3c, 3d) for adjusting the clearance between the lenses (3a, 3b) and the light receiving plane of the imaging element (4), structured to fix the lower case (2) to the upper case (3) while the MID-mounting substrate (6) mounted with the imaging element (4) is being fixed to the upper case (3) by the substrate mounting bosses (3c, 3d).Type: ApplicationFiled: February 5, 2009Publication date: September 23, 2010Applicant: PANASONIC CORPORATIONInventors: Tatsuhiko Inagaki, Makoto Imai, HIdetoshi Mimura
-
Patent number: 7656423Abstract: An imaging device stores and photoelectric-converts incoming light from an object of which an image is to be captured with a CCD, and controls an output level of a picture signal obtained by signal processing an image signal output from the CCD. An output adjustment value of the picture signal in the output control is set to become 50 to 70 IRE according to a peak value of the picture signal when a test pattern is captured under standard conditions. Accordingly, it is possible to have a typical imaging device display a captured image darker, and thus enable imaging suitable for nighttime imaging and the like.Type: GrantFiled: August 12, 2003Date of Patent: February 2, 2010Assignees: Toyota Jidosha Kabushiki Kaisha, Matsushita Electric Industrial Co., Ltd.Inventors: Yasuo Hagisato, Shinya Kawamata, Ryuji Yamaguchi, Hidetoshi Mimura, Tsuyoshi Kumasaka
-
Patent number: 6970184Abstract: An image display method for a rearview camera for displaying an image shot by a rearview camera mounted on a vehicle on a screen that can be viewed from a driver's seat, the method includes the step of displaying an auxiliary line image indicating the straight rear direction of the vehicle superimposed on the image shot by the vehicle on the screen. When the vehicle has approached the trailer within a predetermined range, an image from the rearview camera is converted to an image from a virtual overhead viewpoint then displayed on the screen. The driver easily back the vehicle to bring the hitch in the blind spot at the rear of the vehicle to coincide with a coupling member on the trailer while watching the screen display.Type: GrantFiled: March 28, 2002Date of Patent: November 29, 2005Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Yuichi Hirama, Satoru Masuda, Hidetoshi Mimura, Kazuki Miyama, Masahiro Takata
-
Publication number: 20040042683Abstract: An imaging device stores and photoelectric-converts incoming light from an object of which an image is to be captured with a CCD, and controls an output level of a picture signal obtained by signal processing an image signal output from the CCD. An output adjustment value of the picture signal in the output control is set to become 50 to 70 IRE according to a peak value of the picture signal when a test pattern is captured under standard conditions. Accordingly, it is possible to have a typical imaging device display a captured image darker, and thus enable imaging suitable for nighttime imaging and the like.Type: ApplicationFiled: August 12, 2003Publication date: March 4, 2004Applicants: TOYOTA JIDOSHA KABUSHIKI KAISHA, MATSUSHITA ELECTRIC INDUSTRIALInventors: Yasuo Hagisato, Shinya Kawamata, Ryuji Yamaguchi, Hidetoshi Mimura, Tsuyoshi Kumasaka
-
Publication number: 20020175999Abstract: When an image shot by a rear-view camera mounted on a vehicle (1a) is changed into an image viewed from the location of a virtual viewpoint, and the obtained image is displayed on a screen, warning lines (51) and (52), for conveying a warning to a driver of the presence of an object within range of the rear of a vehicle, are displayed by being superimposed on the image obtained by the viewpoint conversion. Thus, when an image obtained by the viewpoint conversion of an image shot by a rear-view camera is displayed on a screen, a driver can be apprised not only of the presence of an obstacle within range of a local vehicle but also of the erroneous image interpretation provided by the image obtained by the viewpoint conversion.Type: ApplicationFiled: April 23, 2002Publication date: November 28, 2002Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Etsumi Mutobe, Satoru Masuda, Hidetoshi Mimura, Kazuki Miyama
-
Publication number: 20020149673Abstract: An image display method for a rearview camera for displaying an image shot by a rearview camera mounted on a vehicle on a screen that can be viewed from a driver's seat, the method includes the step of displaying an auxiliary line image indicating the straight rear direction of the vehicle superimposed on the image shot by the vehicle on the screen. When the vehicle has approached the trailer within a predetermined range, an image from the rearview camera is converted to an image from a virtual overhead viewpoint then displayed on the screen. The driver easily back the vehicle to bring the hitch in the blind spot at the rear of the vehicle to coincide with a coupling member on the trailer while watching the screen display.Type: ApplicationFiled: March 28, 2002Publication date: October 17, 2002Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Yuichi Hirama, Satoru Masuda, Hidetoshi Mimura, Kazuki Miyama, Masahiro Takata
-
Patent number: 5448293Abstract: A television camera equipped with a continuously-variable-speed electronic shutter function which can control the charge-storing time of a solid-state image sensor and an amplifier so that a video signal follows the optimum light amount for a subject at high speed and with high accuracy. A shutter-equipped image sensor which is controlled by a shutter pulse generating unit, converts light incident on an optical lens into an electric signal. The electric signal, after being passed through an amplifier and a signal processing unit, is detected by a video level detecting unit as a video level. A shutter control unit holds the shutter amount corresponding to the video level for each field to immediately calculate an estimated shutter amount by using a predetermined equation, and supplies the calculated shutter amount to the shutter pulse generating unit for each field. A control mode decision unit exclusively controls a gain control unit serving as an AGC and the shutter control unit.Type: GrantFiled: July 1, 1994Date of Patent: September 5, 1995Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Haruo Kogane, Hidetoshi Mimura
-
Patent number: 5280359Abstract: A video camera specifies as a photometric area any block of a field of image to be picked up and picks up a subject to be seen by optimizing the amount of light regardless of the position where a television camera is located. The video camera comprises a solid-state image pick-up element (CCD), a display device and devices for controlling the diaphragm of a lens. In operation, the image picked up by the solid-state image pick-up element is divided into plural blocks to be displayed. Any block of these plural blocks can be specified as a photometric area. The amount of light for the photometric area is calculated and the diaphragm of the lens is controlled so that the subject can be seen by optimizing amount of light.Type: GrantFiled: March 24, 1992Date of Patent: January 18, 1994Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Hidetoshi Mimura, Haruo Kogane, Makoto Sube
-
Patent number: D842823Type: GrantFiled: January 30, 2018Date of Patent: March 12, 2019Assignee: KOKUSAI ELECTRIC CORPORATIONInventors: Yusaku Okajima, Hidenari Yoshida, Shuhei Saido, Takafumi Sasaki, Hidetoshi Mimura
-
Patent number: D843958Type: GrantFiled: January 30, 2018Date of Patent: March 26, 2019Assignee: KOKUSAI ELECTRIC CORPORATIONInventors: Yusaku Okajima, Hidenari Yoshida, Shuhei Saido, Takafumi Sasaki, Hidetoshi Mimura