Reaction tube
Latest KOKUSAI ELECTRIC CORPORATION Patents:
- PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PROCESSING APPARATUS, AND RECORDING MEDIUM
- Substrate processing apparatus and method of manufacturing semiconductor device
- Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
- Method of manufacturing semiconductor device
- Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
The dashed-dot-dashed lines represent the boundary lines of the claimed design.
The broken lines shown in the drawings represent portions of the reaction tube that form no part of the claimed design.
Claims
The ornamental design for a reaction tube, as shown and described.
D610559 | February 23, 2010 | Okada |
D618638 | June 29, 2010 | Nakashima |
D711843 | August 26, 2014 | Yamazaki |
D719114 | December 9, 2014 | Yamazaki |
D720707 | January 6, 2015 | Yamazaki |
D725055 | March 24, 2015 | Yamazaki |
D739832 | September 29, 2015 | Yamazaki |
D770993 | November 8, 2016 | Yoshida |
D772824 | November 29, 2016 | Yoshida |
D790490 | June 27, 2017 | Osaka |
D791090 | July 4, 2017 | Yoshida |
D800080 | October 17, 2017 | Nagata |
20070098605 | May 3, 2007 | Johns |
20080083372 | April 10, 2008 | Inoue |
20090194521 | August 6, 2009 | Kobayashi |
20090250005 | October 8, 2009 | Kaneko |
Type: Grant
Filed: Jan 30, 2018
Date of Patent: Mar 26, 2019
Assignee: KOKUSAI ELECTRIC CORPORATION (Tokyo)
Inventors: Yusaku Okajima (Toyama), Hidenari Yoshida (Toyama), Shuhei Saido (Toyama), Takafumi Sasaki (Toyama), Hidetoshi Mimura (Toyama)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/635,275