Patents by Inventor Hideyasu Matsumura

Hideyasu Matsumura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060058406
    Abstract: According to the present invention, there is provided expandable beads of a styrene-modified linear low-density polyethylene-based resin comprising a volatile blowing agent and a base resin, the base resin containing more than 300 parts by weight and less than 1000 parts by weight of a polystyrene-based resin component relative to 100 parts by weight of a non-crosslinked linear low-density polyethylene-based resin component, wherein the base resin contains 2 to 40 wt % of a gel component comprising a graft copolymer of the polystyrene-based resin component and the low-density polyethylene-based resin component.
    Type: Application
    Filed: March 22, 2004
    Publication date: March 16, 2006
    Applicant: SEKISUI PLASTICKS CO., LTD
    Inventors: Hideyasu Matsumura, Yasutaka Tsutsui
  • Patent number: 6527993
    Abstract: The present invention provides a process for producing a molded foam article of a crystalline aromatic polyester resin. The process is characterized by heating the surface temperature of a mold for cavity-molding to the temperature within a range of from (td+35) to (Tg+57)°C. (Tg is a glass transition temperature of the crystalline aromatic polyester resin prepuffs), thereby to mold prepuffs, and cooling the surface of the mold to a temperature not lowered than Tg for at least 20 seconds.
    Type: Grant
    Filed: June 7, 2001
    Date of Patent: March 4, 2003
    Assignee: Sekisui Plastics Co., Ltd.
    Inventors: Takaaki Hirai, Minoru Fujishima, Hiroyuki Ueno, Hideyasu Matsumura, Ikuo Morioka, Yukio Aramomi, Hiroyuki Yamagata