Patents by Inventor Hideyoshi Yanagisawa

Hideyoshi Yanagisawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10538630
    Abstract: A silicone-modified polybenzoxazole resin comprising repeating units of formulae (1a) and (1b) is prepared by addition polymerization. R1 to R4 are a C1-C8 monovalent hydrocarbon group, m and n are integers of 0-300, R5 is C1-C8 alkylene or phenylene, a and b are positive numbers of less than 1, a+b=1, and X1 is a divalent linker of formula (2). The resin is flexible, soluble in organic solvents, and easy to use.
    Type: Grant
    Filed: February 1, 2018
    Date of Patent: January 21, 2020
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Hitoshi Maruyama, Ryuto Hayashi, Kazunori Kondo, Hideyoshi Yanagisawa
  • Patent number: 10534262
    Abstract: A chemically amplified positive resist composition is provided comprising a specific alkali-soluble polymer adapted to turn soluble in alkaline aqueous solution under the action of acid as base resin, an alkali-soluble polymer, and a photoacid generator in an organic solvent. The composition forms a resist film which can be briefly developed to form a pattern at a high sensitivity without generating dimples in pattern sidewalls.
    Type: Grant
    Filed: October 26, 2016
    Date of Patent: January 14, 2020
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoshinori Hirano, Hideyoshi Yanagisawa
  • Patent number: 10501710
    Abstract: A cleaner composition consisting essentially of (A) 90.0-99.9 wt % of an organic solvent and (B) 0.1-10.0 wt % of a C3-C6 alcohol, and containing (C) 20-300 ppm of sodium and/or potassium is effective for cleaning a surface of a silicon semiconductor substrate. A satisfactory degree of cleanness is achieved within a short time and at a high efficiency without causing corrosion to the substrate.
    Type: Grant
    Filed: April 18, 2017
    Date of Patent: December 10, 2019
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Masaya Ueno, Hideyoshi Yanagisawa
  • Patent number: 10503067
    Abstract: A photosensitive resin composition comprising (A) a silicone-modified polybenzoxazole resin and (B) a photoacid generator which is decomposed to generate an acid upon exposure to radiation of 190-500 nm is coated onto a substrate to form a thick coating, which is exposed to radiation, baked, and developed to form a pattern. The resin coating is capable of forming a fine pattern and has improved crack resistance and other film properties, and reliability.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: December 10, 2019
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Hitoshi Maruyama, Kazunori Kondo, Hideyoshi Yanagisawa
  • Patent number: 10370623
    Abstract: A cleaner composition consisting essentially of (A) 92.0 wt % to less than 99.9 wt % of an organic solvent, (B) 0.1 wt % to less than 8.0 wt % of a C3-C6 alcohol, and (C) 0.001-3.0 wt % of a quaternary ammonium salt is effective for removing any silicone adhesive residues on a silicon semiconductor substrate. A satisfactory degree of cleanness is achieved within a short time and at a high efficiency without causing corrosion to the substrate.
    Type: Grant
    Filed: April 17, 2017
    Date of Patent: August 6, 2019
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Masaya Ueno, Hideyoshi Yanagisawa
  • Patent number: 10260027
    Abstract: The invention provides a substrate detergent composition used for cleaning a surface of a substrate, comprising: (A) A quaternary ammonium salt: 0.1 to 2.0% by mass; (B) Water: 0.1 to 4.0% by mass; and (C) An organic solvent: 94.0 to 99.8% by mass. There can be provided a substrate detergent composition used for cleaning a surface of a substrate contaminated with a silicone component whose water contact angle is 100° or more.
    Type: Grant
    Filed: January 25, 2017
    Date of Patent: April 16, 2019
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Masaya Ueno, Hideyoshi Yanagisawa
  • Publication number: 20180239255
    Abstract: A pattern is formed by (i) applying a chemically amplified positive resist composition comprising (A) a base resin, (B) a photoacid generator, (C) an organic solvent, and (D) a polyvinyl alcohol or polyvinyl alkyl ether onto a substrate to form a resist film thereon, (ii) exposing the resist film to radiation, and (iii) dry etching the resist film with an oxygen-containing gas for development. Using the chemically amplified positive resist composition, a positive pattern is formed via dry development without a need for silylation.
    Type: Application
    Filed: February 21, 2018
    Publication date: August 23, 2018
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Yoshinori Hirano, Hideyoshi Yanagisawa
  • Publication number: 20180224743
    Abstract: A photosensitive resin composition comprising (A) a silicone-modified polybenzoxazole resin and (B) a photoacid generator which is decomposed to generate an acid upon exposure to radiation of 190-500 nm is coated onto a substrate to form a thick coating, which is exposed to radiation, baked, and developed to form a pattern. The resin coating is capable of forming a fine pattern and has improved crack resistance and other film properties, and reliability.
    Type: Application
    Filed: January 30, 2018
    Publication date: August 9, 2018
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Hitoshi Maruyama, Kazunori Kondo, Hideyoshi Yanagisawa
  • Publication number: 20180223049
    Abstract: A silicone-modified polybenzoxazole resin comprising repeating units of formulae (1a) and (1b) is prepared by addition polymerization. R1 to R4 are a C1-C8 monovalent hydrocarbon group, m and n are integers of 0-300, R5 is C1-C8 alkylene or phenylene, a and b are positive numbers of less than 1, a+b=1, and X1 is a divalent linker of formula (2). The resin is flexible, soluble in organic solvents, and easy to use.
    Type: Application
    Filed: February 1, 2018
    Publication date: August 9, 2018
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Hitoshi Maruyama, Ryuto Hayashi, Kazunori Kondo, Hideyoshi Yanagisawa
  • Patent number: 10007181
    Abstract: A chemically amplified positive resist dry film to be formed on a support film contains 5-40 wt % of a component having a boiling point of 55-250° C. under atmospheric pressure. The resist dry film having flexibility and dimensional stability can be prepared through simple steps. The resist dry film can be efficiently and briefly laid on an article and processed to form a pattern.
    Type: Grant
    Filed: September 1, 2015
    Date of Patent: June 26, 2018
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoshinori Hirano, Satoshi Asai, Hideyoshi Yanagisawa
  • Patent number: 9896550
    Abstract: An epoxy-modified silicone resin obtained using a compound having 3 or 4 glycidyl groups and 3 or 4 (meth)allyl groups in the molecule is novel. A curable composition comprising the epoxy-modified silicone resin cures into a film having improved heat resistance and adhesion.
    Type: Grant
    Filed: January 4, 2017
    Date of Patent: February 20, 2018
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Kazuhide Yanaizumi, Hideyoshi Yanagisawa
  • Patent number: 9840484
    Abstract: An aryl compound terminated with at least three glycidyl groups and at least three (meth)allyl groups, having formula (1) wherein R1 is a C3-C20 hydrocarbon, R2 is hydrogen or methyl, and n is 3 or 4 is novel. It is prepared by reacting an aryl compound having at least three (meth)allyl-containing phenol groups with a 2-halomethyloxirane.
    Type: Grant
    Filed: January 5, 2017
    Date of Patent: December 12, 2017
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Kazuhide Yanaizumi, Hideyoshi Yanagisawa
  • Publication number: 20170306272
    Abstract: A cleaner composition consisting essentially of (A) 92.0 wt % to less than 99.9 wt % of an organic solvent, (B) 0.1 wt % to less than 8.0 wt % of a C3-C6 alcohol, and (C) 0.001-3.0 wt % of a quaternary ammonium salt is effective for removing any silicone adhesive residues on a silicon semiconductor substrate. A satisfactory degree of cleanness is achieved within a short time and at a high efficiency without causing corrosion to the substrate.
    Type: Application
    Filed: April 17, 2017
    Publication date: October 26, 2017
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Masaya Ueno, Hideyoshi Yanagisawa
  • Publication number: 20170306273
    Abstract: A cleaner composition consisting essentially of (A) 90.0-99.9 wt % of an organic solvent and (B) 0.1-10.0 wt % of a C3-C6 alcohol, and containing (C) 20-300 ppm of sodium and/or potassium is effective for cleaning a surface of a silicon semiconductor substrate. A satisfactory degree of cleanness is achieved within a short time and at a high efficiency without causing corrosion to the substrate.
    Type: Application
    Filed: April 18, 2017
    Publication date: October 26, 2017
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Masaya Ueno, Hideyoshi Yanagisawa
  • Patent number: 9777102
    Abstract: A modified novolak phenolic resin is obtained by reacting a novolak phenolic resin containing at least 50 wt % of p-cresol with a crosslinker. This method increases the molecular weight of the existing novolak phenolic resin containing at least 50 wt % of p-cresol to such a level that the resulting modified novolak phenolic resin has heat resistance enough for the photoresist application.
    Type: Grant
    Filed: December 4, 2014
    Date of Patent: October 3, 2017
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoshinori Hirano, Hideyoshi Yanagisawa
  • Publication number: 20170198102
    Abstract: An epoxy-modified silicone resin obtained using a compound having 3 or 4 glycidyl groups and 3 or 4 (meth)allyl groups in the molecule is novel. A curable composition comprising the epoxy-modified silicone resin cures into a film having improved heat resistance and adhesion.
    Type: Application
    Filed: January 4, 2017
    Publication date: July 13, 2017
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Kazuhide Yanaizumi, Hideyoshi Yanagisawa
  • Publication number: 20170197928
    Abstract: An aryl compound terminated with at least three glycidyl groups and at least three (meth)allyl groups, having formula (1) wherein R1 is a C3-C20 hydrocarbon, R2 is hydrogen or methyl, and n is 3 or 4 is novel. It is prepared by reacting an aryl compound having at least three (meth)allyl-containing phenol groups with a 2-halomethyloxirane.
    Type: Application
    Filed: January 5, 2017
    Publication date: July 13, 2017
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kazuhide Yanaizumi, Hideyoshi Yanagisawa
  • Publication number: 20170130174
    Abstract: The invention provides a substrate detergent composition used for cleaning a surface of a substrate, comprising: (A) A quaternary ammonium salt: 0.1 to 2.0% by mass; (B) Water: 0.1 to 4.0% by mass; and (C) An organic solvent: 94.0 to 99.8% by mass. There can be provided a substrate detergent composition used for cleaning a surface of a substrate contaminated with a silicone component whose water contact angle is 100° or more.
    Type: Application
    Filed: January 25, 2017
    Publication date: May 11, 2017
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Masaya UENO, Hideyoshi YANAGISAWA
  • Publication number: 20170115567
    Abstract: A chemically amplified positive resist composition is provided comprising a specific alkali-soluble polymer adapted to turn soluble in alkaline aqueous solution under the action of acid as base resin, an alkali-soluble polymer, and a photoacid generator in an organic solvent. The composition forms a resist film which can be briefly developed to form a pattern at a high sensitivity without generating dimples in pattern sidewalls.
    Type: Application
    Filed: October 26, 2016
    Publication date: April 27, 2017
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoshinori Hirano, Hideyoshi Yanagisawa
  • Patent number: 9606435
    Abstract: A micro-structure is manufactured by patterning a sacrificial film, forming an inorganic material film on the pattern, and etching away the sacrificial film pattern through an aperture to define a space having the contour of the pattern. The patterning stage includes the steps of (A) coating a substrate with a composition comprising a cresol novolac resin, a crosslinker, and a photoacid generator, (B) heating to form a sacrificial film, (C) patternwise exposure, (D) development to form a sacrificial film pattern, and (E) forming crosslinks within the cresol novolac resin.
    Type: Grant
    Filed: August 13, 2014
    Date of Patent: March 28, 2017
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Yoshinori Hirano, Hideyoshi Yanagisawa