Abstract: The present invention relates to an epoxy group-containing novel fluorene compound having a methallyl group at the end thereof represented by the following general formula (1): wherein R represents a hydrogen atom or a methyl group, which compound gives a compound excellent in regioselectivity at the time of hydrosilylation with a Si—H containing organosilicon compound, with a less formed amount of an internally added ? adduct, as compared with the conventionally known fluorene compound having an allyl group, so that heat resistance of the resulting organosilicon compound is expected to be improved whereby it is a useful compound.

Abstract: A novel organosilicon compound is provided as an organosilicon compound containing a ?-ketoester structure that has minimal volatile components and generates a minimal amount of alcohol when used as a component within all manner of treatment agents. The organopolysiloxane is represented by an average composition formula shown below: YaR1bR2cSi(OR3)d(OH)eO(4-a-b-c-d-e)/2??(1) (wherein Y represents an organic group containing a ?-ketoester group that may be at least partially enolized, R1 represents a monovalent hydrocarbon group that may optionally include a functional group such as a mercapto group, an epoxy group or a (meth)acryloyloxy group, R2 represents a monovalent hydrocarbon group that contains no functional groups, R3 represents a monovalent hydrocarbon group, and a, b, c, d and e are numbers that satisfy 0.01?a?1, 0?b<1, 0?c?2, 0?d?2, and 0?e?1 respectively, provided that 2?a+b+c+d+e?3).

Abstract: An organopolysiloxane is prepared by hydrolysis and polycondensation of an organosilicon compound in the presence of a liquid hydrolytic condensation catalyst which is separable. The organopolysiloxane contains a high proportion of cyclic polysiloxanes and has a sharp molecular weight distribution due to minimized monomer and polymer contents.

Abstract: A micro-structure is manufactured by patterning a sacrificial film, forming an inorganic material film on the pattern, and etching away the sacrificial film pattern through an aperture to define a space having the contour of the pattern. The patterning stage includes the steps of (A) coating a substrate with a composition comprising a cresol novolac resin, a crosslinker, and a photoacid generator, (B) heating to form a sacrificial film, (C) patternwise exposure, (D) development to form a sacrificial film pattern, and (E) forming crosslinks within the cresol novolac resin.

Abstract: A novel organosilicon compound having a ?-ketoester structure and a pressure-sensitive adhesive composition for a liquid crystal element that includes the organosilicon compound are provided. The organosilicon compound is obtained by reacting, in the presence of a transition metal catalyst, a compound represented by a formula (1): [wherein, R1 represents H or Me, R2 to R4 represent divalent hydrocarbon groups, A represents a group of a formula (i): (wherein, R6 represents an alkyl group or a phenyl group), R5 represents a group of a formula (ii): (wherein, B represents OH or a group represented by the formula (i)), and p, q and r represent integers of 0 to 6] with an alkoxysilane represented by a formula (2): (R7O)m(R8)(3-m)Si—H ??(2) [wherein, R7 and R8 represent monovalent hydrocarbon groups of 1 to 4 carbon atoms, and m represents 1, 2 or 3].

Abstract: An organopolysiloxane is prepared by hydrolysis and polycondensation of an organosilicon compound in the presence of a liquid hydrolytic condensation catalyst which is separable. The organopolysiloxane contains a high proportion of cyclic polysiloxanes and has a sharp molecular weight distribution due to minimized monomer and polymer contents.

Abstract: A wire or cable comprising a conductor or wire core and a coating layer on the exterior of the conductor or wire core which is formed from a rubber or plastic composition containing a rubber or plastic and an inorganic filler having high moisture resistance is provided. The inorganic filler is the one which has been surface treated with an alkoxy group-containing organopolysiloxane having an unsaturated aliphatic group-containing group and a monovalent hydrocarbon group of 3 to 10 carbon atoms containing no aliphatic unsaturated bond obtained by partially cohydrolytic condensation of an organic functional group-containing silane and/or its (partially) hydrolytic condensate, and an organic functional group-containing silane and/or its (partially) hydrolytic condensate.

Abstract: A novel organosilicon compound is provided as an organosilicon compound containing a ?-ketoester structure that has minimal volatile components and generates a minimal amount of alcohol when used as a component within all manner of treatment agents. The organopolysiloxane is represented by an average composition formula shown below: YaR1bR2cSi(OR3)d(OH)eO(4-a-b-c-d-e)/2??(1) (wherein Y represents an organic group containing a ?-ketoester group that may be at least partially enolized, R1 represents a monovalent hydrocarbon group that may optionally include a functional group such as a mercapto group, an epoxy group or a (meth)acryloyloxy group, R2 represents a monovalent hydrocarbon group that contains no functional groups, R3 represents a monovalent hydrocarbon group, and a, b, c, d and e are numbers that satisfy 0.01?a?1, 0?b<1, 0?c?2, 0?d?2, and 0?e?1 respectively, provided that 2?a+b+c+d+e?3).

Abstract: Provided is a room temperature curable organopolysiloxane composition, including (A) 100 parts by mass of a diorganopolysiloxane with both terminals blocked with silanol groups, or a diorganopolysiloxane with each terminal blocked, independently, with a trialkoxysilyl group or a dialkoxyorganosilyl group, or a mixture thereof, (B) 0.1 to 30 parts by mass of a silane compound and/or a partial hydrolysis-condensation product thereof containing an average of at least two hydrolysable groups bonded to silicon atoms within each molecule, and in which the remaining groups bonded to silicon atoms are methyl groups, ethyl groups, propyl groups, vinyl groups, or phenyl groups, and (C) 0.1 to 10 parts by mass of either one, or two or more organosilicon compounds containing amino groups, and also containing four or more hydrolysable groups. Also provided are a sealing material and an adhesive including the above composition.

Abstract: Provided is a room temperature curable organopolysiloxane composition, including (A) 100 parts by mass of a diorganopolysiloxane with both terminals blocked with silanol groups, or a diorganopolysiloxane with each terminal blocked, independently, with a trialkoxysilyl group or a dialkoxyorganosilyl group, or a mixture thereof, (B) 0.1 to 30 parts by mass of a silane compound and/or a partial hydrolysis-condensation product thereof containing an average of at least two hydrolysable groups bonded to silicon atoms within each molecule, and in which the remaining groups bonded to silicon atoms are methyl groups, ethyl groups, propyl groups, vinyl groups, or phenyl groups, and (C) 0.1 to 10 parts by mass of either one, or two or more organosilicon compounds containing amino groups, and also containing four or more hydrolysable groups. Also provided are a sealing material and an adhesive including the above composition.

Abstract: A novel organosilicon compound having a ?-ketoester structure and a pressure-sensitive adhesive composition for a liquid crystal element that includes the organosilicon compound are provided. The organosilicon compound is obtained by reacting, in the presence of a transition metal catalyst, a compound represented by a formula (1): [wherein, R1 represents H or Me, R2 to R4 represent divalent hydrocarbon groups, A represents a group of a formula (i): (wherein, R6 represents an alkyl group or a phenyl group), R5 represents a group of a formula (ii): (wherein, B represents OH or a group represented by the formula (i)), and p, q and r represent integers of 0 to 6] with an alkoxysilane represented by a formula (2): (R7O)m(R8)(3-m)Si—H ??(2) [wherein, R7 and R8 represent monovalent hydrocarbon groups of 1 to 4 carbon atoms, and m represents 1, 2 or 3].

Abstract: Methods of sealing a semiconductor element are provided. The methods includes the steps of coating a semiconductor element mounted on a gold-plated printed circuit board with a curable silicone resin, and then curing the curable silicone resin. In a method, the gold-plated printed circuit board is subjected to preliminary treatment with a treatment agent including an acid anhydride group-containing alkoxysilane and/or a partial hydrolysis-condensation product thereof In another method, the curable silicone resin includes the treatment agent. The methods yield favorable adhesion upon sealing.

Abstract: By reacting a mixture of a halogenoalkyl group-bearing organosilicon compound and sulfur with an aqueous solution or water dispersion of an ammonium or alkali metal sulfide or a hydrate thereof in the presence of a phase transfer catalyst, a sulfide chain-bearing organosilicon compound having the average compositional formula (2): (R1O)(3-p)(R2)pSi—R3—Sm—R3—Si(OR1)(3-p)(R2)p??(2) wherein m has an average value of 2?m?6 is obtained in high yields and at a low cost with minimized formation of a monosulfide-bearing organosilicon compound.

Abstract: A sulfide chain-bearing organosilicon compound having the average compositional formula: (R1O)(3-p)(R2)pSi—R3—S—(R4—Sm)q—R4—S—R3—Si(OR1)(3-p)(R2)p is prepared at low costs and in high yields by reacting a halogen-terminated organosilicon compound having the formula: (R1O)(3-p)(R2)pSi—R3—S—R4—X, and optionally a halide having the formula: X—R4—X and/or sulfur with an aqueous solution or dispersion of a polysulfide M2Sn or hydrate thereof in the presence of a phase transfer catalyst. R1 and R2 are monovalent C1-4 hydrocarbon groups, R3 and R4 are divalent C1-10 hydrocarbon groups, m has an average value of 2-6, n has an average value of 2-6, p is 0, 1 or 2, q is 1, 2 or 3, X is halogen, and M is ammonium or alkali metal.

Abstract: By reacting a halogenoalkyl group-bearing organosilicon compound and optionally sulfur with an aqueous solution or water dispersion of an ammonium or alkali metal polysulfide or a hydrate thereof in the presence of a phase transfer catalyst, a sulfide chain-bearing organosilicon compound having the average compositional formula (2): (R1O)(3-p)(R2)pSi—R3—Sm—R3—Si(OR1)(3-p)(R2)p??(2) wherein m has an average value of 2?m?6 is obtained in high yields and at a low cost with minimized formation of a monosulfide-bearing organosilicon compound.

Abstract: A sulfide chain-bearing organosilicon compound having the average compositional formula: (R1O)(3-p)(R2)pSi—R3—S—(R4—Sm)q—R4—S—R3—Si(OR1)(3-p)(R2)p is prepared at low costs and in high yields by reacting a halogen-terminated organosilicon compound having the formula: (R1O)(3-p)(R2)pSi—R3—S—R4—X, sulfur, and optionally a halide having the formula: X—R4—X with an aqueous solution or dispersion of a sulfide M2S or hydrate thereof in the presence of a phase transfer catalyst. R1 and R2 are monovalent C1-4 hydrocarbon groups, R3 and R4 are divalent C1-10 hydrocarbon groups, m has an average value of 2-6, p is 0, 1 or 2, q is 1, 2 or 3, X is halogen, and M is ammonium or alkali metal.

Abstract: Methods of sealing a semiconductor element are provided. The methods includes the steps of coating a semiconductor element mounted on a gold-plated printed circuit board with a curable silicone resin, and then curing the curable silicone resin. In a method, the gold-plated printed circuit board is subjected to preliminary treatment with a treatment agent including an acid anhydride group-containing alkoxysilane and/or a partial hydrolysis-condensation product thereof In another method, the curable silicone resin includes the treatment agent. The methods yield favorable adhesion upon sealing.

Abstract: A sulfide chain-bearing organosilicon compound having the average compositional formula: (R1O)(3?p)(R2)pSi—R3—S—(R4—Sm)q—R4—S—R3—Si(OR1)(3?p)(R2)p is prepared at low costs and in high yields by reacting a halogen-terminated organosilicon compound having the formula: (R1O)(3?p)(R2)pSi—R3—S—R4—X, sulfur, and optionally a halide having the formula: X—R4—X with an aqueous solution or dispersion of a sulfide M2S or hydrate thereof in the presence of a phase transfer catalyst. R1 and R2 are monovalent C1-4 hydrocarbon groups, R3 and R4 are divalent C1-10 hydrocarbon groups, m has an average value of 2-6, p is 0, 1 or 2, q is 1, 2 or 3, X is halogen, and M is ammonium or alkali metal.

Abstract: A sulfide chain-bearing organosilicon compound having the average compositional formula: (R1O)(3-p)(R2)pSi—R3—S(R4—Sm)q—R4—S—R3—Si(OR1)(3-p)(R2)p is prepared at low costs and in high yields by reacting a halogen-terminated organosilicon compound having the formula: (R1O)(3-p)(R2)pSi—R3—S—R4—X, and optionally a halide having the formula: X—R4—X and/or sulfur with an aqueous solution or dispersion of a polysulfide M2Sn or hydrate thereof in the presence of a phase transfer catalyst. R1 and R2 are monovalent C1-4 hydrocarbon groups, R3 and R4 are divalent C1-10 hydrocarbon groups, m has an average value of 2-6, n has an average value of 2-6, p is 0, 1 or 2, q is 1, 2 or 3, X is halogen, and M is ammonium or alkali metal.

Abstract: Organosilicon compounds having organooxysilyl groups at ends and a polysulfide group at an intermediate of the molecule, which are linked through a divalent hydrocarbon group containing a monosulfide or polysulfide group are novel. These organosilicon compounds are effective as a rubber compounding agent.