Abstract: A module is composed of a terminal that is attached to a cable and an insulator that accommodates the terminal. The insulator includes two spring pieces and two protrusions that are formed on the two respective spring pieces. A housing has through holes on mutually opposed positions on respective side walls surrounding an accommodation space. The module is accommodated in the accommodation space in a manner such that the two protrusions thereof are fitted from an inside into the respective through holes. A hood is composed of two split bodies. The hood can be fixed on the housing in a manner such that projecting portions of the split bodies are fitted from an outside into the respective through holes and the two split bodies are coupled to each other with a coupling means.

Abstract: A first connector and a second connector of this connector assembly can mutually connect along the vertical direction. The first connector comprises a first housing provided with a sliding surface, a locking surface, and a receiving surface. The locking surface intersects, at an angle of 90° or less, with a line segment extending straight upward from the locking surface. The second connector comprises a second housing provided with a spring section and a locked section. The locked section can move forward and backward as the spring section elastically deforms. The locked section has a locked surface. When the second connector is in a separated state of being separated from the first connector, the locked surface intersects, at an angle of 90° or less, with a line segment extending straight upward from the locked surface. In a fitting step, the locked section moves downward while being pressed against the sliding surface.

Abstract: A first connector and a second connector of this connector assembly can mutually connect along the vertical direction. The first connector comprises a first housing provided with a sliding surface, a locking surface, and a receiving surface. The locking surface intersects, at an angle of 90° or less, with a line segment extending straight upward from the locking surface. The second connector comprises a second housing provided with a spring section and a locked section. The locked section can move forward and backward as the spring section elastically deforms. The locked section has a locked surface. When the second connector is in a separated state of being separated from the first connector, the locked surface intersects, at an angle of 90° or less, with a line segment extending straight upward from the locked surface. In a fitting step, the locked section moves downward while being pressed against the sliding surface.

Abstract: A ceramic body for dental prosthesis can suppress a variation in quality in the sole ceramic body for dental prosthesis due to expansion of its diameter. The ceramic body for dental prosthesis is made of a ceramic material, is shaped to have a circular planar shape and a disk-like external shape, and has a diameter of 50 mm or more. The method for manufacturing this ceramic body for dental prosthesis includes: preparing a ceramic material; shaping the ceramic material by press shaping or by a machine tool; temporarily sintering the ceramic material at a temperature from a sintering temperature that provides theoretical density ?700° C. or more to the sintering temperature ?100° C. or less; and shaping the ceramic material to have a circular planar shape and a disk-like external shape so as to prepare the ceramic body for dental prosthesis having a diameter of 50 mm or more.

Abstract: A ceramic body for dental prosthesis can suppress a variation in quality in the sole ceramic body for dental prosthesis due to expansion of its diameter. The ceramic body for dental prosthesis is made of a ceramic material, is shaped to have a circular planar shape and a disk-like external shape, and has a diameter of 50 mm or more. The method for manufacturing this ceramic body for dental prosthesis includes: preparing a ceramic material; shaping the ceramic material by press shaping or by a machine tool; temporarily sintering the ceramic material at a temperature from a sintering temperature that provides theoretical density ?700° C. or more to the sintering temperature ?100° C. or less; and shaping the ceramic material to have a circular planar shape and a disk-like external shape so as to prepare the ceramic body for dental prosthesis having a diameter of 50 mm or more.

Abstract: A lane display device acquires traffic information indicating a certain section for each of lanes and displays the certain section in the lane in which a vehicle travels and a transition region indicating transition with respect to the certain section near at least one of a start point or an end point of the certain section.

Abstract: An oscillator includes a resonator element; and a semiconductor device including an oscillation circuit which outputs an oscillation signal by oscillating the resonator element, a temperature compensation circuit which compensates for temperature characteristics of a frequency of the oscillation signal, and a first surface in which a terminal that is electrically connected to the resonator element is disposed. The semiconductor device overlaps the resonator element in a planar view. Frequency deviation of the oscillation signal, which is compensated for by the temperature compensation circuit, is greater than or equal to ?150 ppb and smaller than or equal to +150 ppb in a temperature range from ?5° C. to +85° C.

Abstract: A lane display device acquires traffic information indicating a certain section for each of lanes and displays the certain section in the lane in which a vehicle travels and a transition region indicating transition with respect to the certain section near at least one of a start point or an end point of the certain section.

Abstract: A external apparatus includes an image formation data generator to generate image formation data based on which a image formation apparatus is to form an image, a job generator to generate an image formation job by adding an address of the external apparatus to the image formation data generated by the image formation data generator, an image formation job output unit to send the image formation job generated by the job generator to the image formation apparatus, and a first receiver to receive notification information from the image formation apparatus. The image formation apparatus includes a second receiver to receive the image formation job from the external apparatus, and a notification information transmitter to generate the notification information concerning the image formation job received by the second receiver and to transmit the generated notification information to the address contained in the image formation job received by the second receiver.

Abstract: An oscillator includes a resonator element; and a semiconductor device including an oscillation circuit which outputs an oscillation signal by oscillating the resonator element, a temperature compensation circuit which compensates for temperature characteristics of a frequency of the oscillation signal, and a first surface in which a terminal that is electrically connected to the resonator element is disposed. The semiconductor device overlaps the resonator element in a planar view. Frequency deviation of the oscillation signal, which is compensated for by the temperature compensation circuit, is greater than or equal to ?150 ppb and smaller than or equal to +150 ppb in a temperature range from ?5° C. to +85° C.

Abstract: A temperature-compensated piezoelectric oscillator as an oscillator includes a piezoelectric resonator incorporating a resonator element, an electronic component (IC) as a circuit element having a function of driving the resonator element and a thermosensor, and a wiring board provided with a conductor film, and the piezoelectric resonator element and the electronic component (IC) are disposed side by side in an area where the conductor film is disposed.

Abstract: The LED device (27) has a LED bare chip (25) mounted directly on a metal contact (28), and supplies power to the bare chip and conducts heat from the bare chip via the metal contact.

Abstract: A temperature-compensated piezoelectric oscillator as an oscillator includes a piezoelectric resonator incorporating a resonator element, an electronic component (IC) as a circuit element having a function of driving the resonator element and a thermosensor, and a wiring board provided with a conductor film, and the piezoelectric resonator element and the electronic component (IC) are disposed side by side in an area where the conductor film is disposed.

Abstract: An apparatus has a plurality of types of plugs used for different purposes and a plurality of circuit board assemblies. Each of the plurality of the circuit board assemblies includes a circuit board having a plurality of wiring portions formed thereon, an electrical and electronic part mounted on the circuit board, and a plurality of sockets attached to the circuit board and connected to the electrical and electronic part via the plurality of wiring portions. The sockets included in all of the plurality of circuit board assemblies have the same shape and are configured to receive any of the plurality of types of plugs.

Abstract: A temperature-compensated piezoelectric oscillator as an oscillator includes a piezoelectric resonator incorporating a resonator element, an electronic component (IC) as a circuit element having a function of driving the resonator element and a thermosensor, and a wiring board provided with a conductor film, and the piezoelectric resonator element and the electronic component (IC) are disposed side by side in an area where the conductor film is disposed.

Abstract: An optical semiconductor unit of the present invention has an LED device provided with an LED (Light Emitting Diode) and a socket to which the LED device is mounted, the LED device has a main body to which the LED is mounted, the main body has a first surface to which block-shaped electrode portions are connected.