Patents by Inventor Hideyuki Okamoto

Hideyuki Okamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210280843
    Abstract: Provided is an installation for manufacturing an all-solid secondary battery provided with a powder laminate including stacked powder films. The manufacturing installation includes a mixer for mixing multiple kinds of powder materials and a conveying device for conveying a powder material mixed by the mixer. The manufacturing installation also includes an electrostatic film-forming device for forming the powder films from the powder material conveyed by the conveying device, by using at least an electrostatic force. In the manufacturing installation, a process of forming the powder laminate from the multiple kinds of powder materials is a dry process.
    Type: Application
    Filed: July 11, 2019
    Publication date: September 9, 2021
    Inventors: Takeshi SUGIYO, Kenji OKAMOTO, Hideyuki FUKUI
  • Patent number: 11101497
    Abstract: A method for manufacturing an all-solid state secondary battery including a plurality of provisional battery bodies, the method including: forming each of the plurality of provisional battery bodies by pressing a positive-electrode mixture, a solid electrolyte, and a negative-electrode mixture that are stacked between a pair of electrode current collectors and pressure-molding the stacked provisional battery bodies with the electrode current collectors facing each other. The electrode current collectors facing each other have rough surfaces.
    Type: Grant
    Filed: February 24, 2017
    Date of Patent: August 24, 2021
    Assignee: HITACHI ZOSEN CORPORATION
    Inventors: Kenji Okamoto, Hideyuki Fukui, Yasushi Takano, Hirokazu Kawase
  • Publication number: 20210157232
    Abstract: A metal plate used for manufacturing a deposition mask has a thickness of equal to or less than 30 ?m. An average cross-sectional area of the crystals grains on a cross section of the metal plate is from 0.5 ?m2 to 50 ?m2. The average cross-sectional area of crystal grains is calculated by analyzing measurement results obtained by an EBSD method, the measuring results being analyzed by an area method under conditions where a portion with a difference in crystal orientation of 5 degrees or more is recognized as a crystal grain boundary.
    Type: Application
    Filed: February 5, 2021
    Publication date: May 27, 2021
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Chikao IKENAGA, Chiaki HATSUTA, Hiroki OKA, Sachiyo MATSUURA, Hideyuki OKAMOTO, Masato USHIKUSA
  • Publication number: 20210060700
    Abstract: A method of manufacturing a vapor deposition mask device includes: a preparing step of preparing a vapor deposition mask that includes a plurality of through-holes extending from a first surface to a second surface; and a welding step of welding the vapor deposition mask to a front surface of a frame that includes the front surface and a back surface opposite to the front surface.
    Type: Application
    Filed: August 8, 2018
    Publication date: March 4, 2021
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventor: Hideyuki OKAMOTO
  • Publication number: 20200335699
    Abstract: A method for producing a frame-equipped vapor deposition mask sequentially includes preparing a vapor deposition mask including a metal mask having a slit and a resin mask having an opening corresponding to a pattern to be produced by vapor deposition at a position overlapping the slit, the metal mask and the resin mask being stacked, retaining a part of the vapor deposition mask by a retainer and stretching the vapor deposition mask retained by the retainer outward, and fixing the vapor deposition mask in a state of being stretched to a frame having a through hole. During stretching, any one or both adjustments of a rotating adjustment and a moving adjustment of the vapor deposition mask are performed with respect to the vapor deposition mask in the state of being stretched or with the vapor deposition mask being stretched.
    Type: Application
    Filed: July 8, 2020
    Publication date: October 22, 2020
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Katsunari OBATA, Toshihiko TAKEDA, Yoshiyuki HONMA, Hideyuki OKAMOTO
  • Publication number: 20200291509
    Abstract: A deposition mask includes an effective part in which a plurality of openings are provided, and an outer frame part surrounding the effective part. The effective part includes an outer peripheral area that is adjacent to the outer frame part, and a central area which is surrounded by the outer peripheral area and has a thickness larger than a thickness of the outer peripheral area.
    Type: Application
    Filed: April 22, 2020
    Publication date: September 17, 2020
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Isao MIYATANI, Daigo AOKI, Masato USHIKUSA, Yoshinori MURATA, Hideyuki OKAMOTO
  • Publication number: 20200291510
    Abstract: A deposition mask apparatus includes: a deposition mask having a plurality of mask through-holes extending from a first surface which is positioned closer to the substrate, to reach a second surface which is positioned opposite to the first surface; and a frame provided with an opening which is overlapped with a part of the deposition mask, the frame supporting the deposition mask.
    Type: Application
    Filed: April 23, 2020
    Publication date: September 17, 2020
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventor: Hideyuki OKAMOTO
  • Patent number: 10741764
    Abstract: A method for producing a frame-equipped vapor deposition mask sequentially includes preparing a vapor deposition mask including a metal mask having a slit and a resin mask having an opening corresponding to a pattern to be produced by vapor deposition at a position overlapping the slit, the metal mask and the resin mask being stacked, retaining a part of the vapor deposition mask by a retainer and stretching the vapor deposition mask retained by the retainer outward, and fixing the vapor deposition mask in a state of being stretched to a frame having a through hole. During stretching, any one or both adjustments of a rotating adjustment and a moving adjustment of the vapor deposition mask are performed with respect to the vapor deposition mask in the state of being stretched or with the vapor deposition mask being stretched.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: August 11, 2020
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Katsunari Obata, Toshihiko Takeda, Yoshiyuki Honma, Hideyuki Okamoto
  • Publication number: 20200152463
    Abstract: A deposition mask includes: a first mask having an opening formed therein; and a second mask superposed on the first mask and having a plurality of through-holes formed therein, the through-hole having a planar dimension smaller than a planar dimension of the opening; wherein: the deposition mask has a plurality of joints that join the second mask and the first mask to each other; the plurality of joints are arranged along an outer edge of the second mask; and a notch is formed at a position in the outer edge of the second mask, the position corresponding to a space between the adjacent two joints.
    Type: Application
    Filed: December 24, 2019
    Publication date: May 14, 2020
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Masato USHIKUSA, Yusuke Nakamura, Hideyuki Okamoto, Yoshinori Murata
  • Publication number: 20200149139
    Abstract: A metal plate used for manufacturing a deposition mask has a thickness of equal to or less than 30 ?m. An average cross-sectional area of the crystals grains on a cross section of the metal plate is from 0.5 ?m2 to 50 ?m2. The average cross-sectional area of crystal grains is calculated by analyzing measurement results obtained by an EBSD method, the measuring results being analyzed by an area method under conditions where a portion with a difference in crystal orientation of 5 degrees or more is recognized as a crystal grain boundary.
    Type: Application
    Filed: November 12, 2019
    Publication date: May 14, 2020
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Hiroki Oka, Sachiyo Matsuura, Chiaki Hatsuta, Chikao Ikenaga, Hideyuki Okamoto, Masato Ushikusa
  • Publication number: 20200019056
    Abstract: A metal plate includes a surface including a longitudinal direction of the metal plate and a width direction orthogonal to the longitudinal direction. A surface reflectance by regular reflection of a light is 8% or more and 25% or less. The surface reflectance is measured when the light is incident on the surface at an angle of 45°±0.2°. The light is in at least one plane orthogonal to the surface.
    Type: Application
    Filed: September 24, 2019
    Publication date: January 16, 2020
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Chikao IKENAGA, Hideyuki Okamoto, Masato Ushikusa, Chiaki Hatsuta, Hiroki Oka, Sachiyo Matsuura
  • Publication number: 20200017951
    Abstract: A metal plate used for manufacturing a deposition mask has a thickness of equal to or less than 30 ?m. An average cross-sectional area of the crystals grains on a cross section of the metal plate is from 0.5 ?m2 to 50 ?m2. The average cross-sectional area of crystal grains is calculated by analyzing measurement results obtained by an EBSD method, the measuring results being analyzed by an area method under conditions where a portion with a difference in crystal orientation of 5 degrees or more is recognized as a crystal grain boundary.
    Type: Application
    Filed: September 24, 2019
    Publication date: January 16, 2020
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Chikao IKENAGA, Chiaki Hatsuta, Hiroki Oka, Sachiyo Matsuura, Hideyuki Okamoto, Masato Ushikusa
  • Publication number: 20200017950
    Abstract: The metal plate includes a plurality of pits located on the surface of the metal plate. The manufacturing method for a metal plate for use in manufacturing of a deposition mask includes an inspection step of determining a quality of the metal plate based on a sum of volumes of a plurality of pits located at a portion of the surface of the metal plate.
    Type: Application
    Filed: September 21, 2019
    Publication date: January 16, 2020
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Hiroki OKA, Sachiyo Matsuura, Chiaki Hatsuta, Chikao Ikenaga, Hideyuki Okamoto, Masato Ushikusa
  • Publication number: 20190378984
    Abstract: A vapor deposition mask device includes a vapor deposition mask having an effective region in which a plurality of first through holes is disposed, and a frame attached to the vapor deposition mask. The vapor deposition mask device includes a plurality of joint portions that joins the vapor deposition mask and the frame to each other. The plurality of joint portions is arranged along the outer edge of the vapor deposition mask. A notch is formed at a position corresponding to between two adjacent joint portions in the outer edge of the vapor deposition mask.
    Type: Application
    Filed: June 12, 2019
    Publication date: December 12, 2019
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Yusuke NAKAMURA, Hideyuki OKAMOTO, Masato USHIKUSA
  • Publication number: 20180309059
    Abstract: A method for producing a frame-equipped vapor deposition mask sequentially includes preparing a vapor deposition mask including a metal mask having a slit and a resin mask having an opening corresponding to a pattern to be produced by vapor deposition at a position overlapping the slit, the metal mask and the resin mask being stacked, retaining a part of the vapor deposition mask by a retainer and stretching the vapor deposition mask retained by the retainer outward, and fixing the vapor deposition mask in a state of being stretched to a frame having a through hole. During stretching, any one or both adjustments of a rotating adjustment and a moving adjustment of the vapor deposition mask are performed with respect to the vapor deposition mask in the state of being stretched or with the vapor deposition mask being stretched.
    Type: Application
    Filed: June 28, 2018
    Publication date: October 25, 2018
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Katsunari OBATA, Toshihiko Takeda, Yoshiyuki Honma, Hideyuki Okamoto
  • Patent number: 10084134
    Abstract: In a method for stretching a vapor deposition mask including a metal mask in which a slit is formed and a resin mask in which an opening corresponding to a pattern to be produced by vapor deposition is formed at a position overlapping with the slit, a stretching assistance member is overlapped on one surface of the vapor deposition mask, the stretching assistance member is fixed to the vapor deposition mask in at least part of a portion in which the one surface of the vapor deposition mask and the stretching assistance member overlap with each other, and the vapor deposition mask fixed to the stretching assistance member is stretched by pulling the stretching assistance member fixed to the vapor deposition mask.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: September 25, 2018
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Katsunari Obata, Hideyuki Okamoto, Yoshiyuki Honma, Toshihiko Takeda
  • Patent number: 10043974
    Abstract: A method for producing a frame-equipped vapor deposition mask sequentially includes preparing a vapor deposition mask including a metal mask having a slit and a resin mask having an opening corresponding to a pattern to be produced by vapor deposition at a position overlapping the slit, the metal mask and the resin mask being stacked, retaining a part of the vapor deposition mask by a retainer and stretching the vapor deposition mask retained by the retainer outward, and fixing the vapor deposition mask in a state of being stretched to a frame having a through hole. During stretching, any one or both adjustments of a rotating adjustment and a moving adjustment of the vapor deposition mask are performed with respect to the vapor deposition mask in the state of being stretched or with the vapor deposition mask being stretched.
    Type: Grant
    Filed: June 21, 2016
    Date of Patent: August 7, 2018
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Katsunari Obata, Toshihiko Takeda, Yoshiyuki Honma, Hideyuki Okamoto
  • Publication number: 20170256713
    Abstract: In a method for stretching a vapor deposition mask including a metal mask in which a slit is formed and a resin mask in which an opening corresponding to a pattern to be produced by vapor deposition is formed at a position overlapping with the slit, a stretching assistance member is overlapped on one surface of the vapor deposition mask, the stretching assistance member is fixed to the vapor deposition mask in at least part of a portion in which the one surface of the vapor deposition mask and the stretching assistance member overlap with each other, and the vapor deposition mask fixed to the stretching assistance member is stretched by pulling the stretching assistance member fixed to the vapor deposition mask.
    Type: Application
    Filed: May 18, 2017
    Publication date: September 7, 2017
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Katsunari OBATA, Hideyuki OKAMOTO, Yoshiyuki HONMA, Toshihiko TAKEDA
  • Patent number: 9705083
    Abstract: In a method for stretching a vapor deposition mask including a metal mask in which a slit is formed and a resin mask in which an opening corresponding to a pattern to be produced by vapor deposition is formed at a position overlapping with the slit, a stretching assistance member is overlapped on one surface of the vapor deposition mask, the stretching assistance member is fixed to the vapor deposition mask in at least part of a portion in which the one surface of the vapor deposition mask and the stretching assistance member overlap with each other, and the vapor deposition mask fixed to the stretching assistance member is stretched by pulling the stretching assistance member fixed to the vapor deposition mask.
    Type: Grant
    Filed: March 30, 2015
    Date of Patent: July 11, 2017
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Katsunari Obata, Hideyuki Okamoto, Yoshiyuki Honma, Toshihiko Takeda
  • Patent number: 9663397
    Abstract: A broadband emission material according to the present invention includes: a fluoride glass containing 20 to 45 mol % of AlF3, 25 to 63 mol % of alkaline-earth fluorides in total and 3 to 25 mol % of at least one fluoride of element selected from the group consisting of Y, La, Gd and Lu; and ytterbium ions incorporated in the fluoride glass as divalent rare-earth ions so as to serve as a luminescent center, wherein the fluoride glass includes 1 to 15 mol % of at least one halide of element selected from the group consisting of Al, Ba, Sr, Ca and Mg and element selected from the group consisting of Cl, Br and I; and wherein the alkaline-earth fluorides includes 0 to 15 mol % of MgF2, 7 to 25 mol % of CaF2, 0 to 22 mol % of SrF2 and 0 to 5 mol % of BaF2.
    Type: Grant
    Filed: April 25, 2014
    Date of Patent: May 30, 2017
    Assignee: Central Glass Company, Limited
    Inventors: Hideyuki Okamoto, Ken Kasuga