Abstract: A signal transmission cable includes a signal line, an insulation layer configured to cover the signal line, and a plating layer configured to cover the insulation layer. An arithmetic average roughness Ra of an outer peripheral surface of the insulation layer is between 0.6 ?m and 10 ?m inclusive. A method of manufacturing the signal transmission cable includes covering the signal line with the insulation layer, followed by conducting a dry-ice-blasting on the outer peripheral surface of the insulation layer, followed by conducting a corona discharge exposure process on the outer peripheral surface, and forming the plating layer on the outer peripheral surface.

Abstract: A soft dilute copper alloy material includes 2 mass ppm to 12 mass ppm of sulfur, more than 2 mass ppm and not more than 30 mass ppm of oxygen, 4 mass ppm to 55 mass ppm of Ti, and a balance including copper. An average crystal grain size is not more than 20 ?m in a surface layer up to a depth of 50 ?m from a surface. The average crystal grain size in the surface layer is less than the average crystal grain size in an inner portion located more interiorly than the surface layer.

Abstract: A copper foil includes a copper-based metal sheet including mainly a copper, and a surface-treated layer that is provided on the copper-based metal sheet and includes an amorphous layer including oxygen and a metal with a higher oxygen affinity than a copper. A total thickness of the copper-based metal sheet and the surface-treated layer is less than 0.55 mm.

Abstract: A solder joint material includes a copper-based metal material including mainly a copper, a surface-treated layer that is provided on the copper-based metal material and includes an amorphous layer including oxygen and a metal with a higher oxygen affinity than a copper, and a Sn-based solder plating layer provided on the surface-treated layer.

Abstract: A copper-based material includes a base comprising copper and a surface treatment layer disposed on a surface of the base, the surface treatment layer including an amorphous layer containing a metal element that has a greater affinity for oxygen than for copper, oxygen, and, optionally, copper diffused from the base.

Abstract: A dilute copper alloy material used in an environment with presence of hydrogen includes pure copper including an inevitable impurity, more than 2 mass ppm of oxygen, and an additive element selected from the group consisting of Mg, Zr, Nb, Ca, V, Fe, Al, Si, Ni, Mn, Ti and Cr, the additive element being capable of forming an oxide in combination with the oxygen. A method of manufacturing a dilute copper alloy member excellent in characteristics of resistance to hydrogen embrittlement includes melting the dilute copper alloy material by SCR continuous casting and rolling at a copper melting temperature of not less than 1100° C. and not more than 1320° C. to make molten metal, forming a cast bar from the molten metal, and forming the dilute copper alloy member by hot-rolling the cast bar.

Abstract: A printed circuit board includes a substrate, and a wiring provided on the substrate. The wiring includes a copper-based metal wire provided on the substrate and a surface-treated layer provided on the copper-based metal wire. The copper-based metal wire includes mainly a copper. The surface-treated layer includes an amorphous layer including oxygen and a metal with a higher oxygen affinity than the copper.

Abstract: Provided are a soft dilute-copper alloy wire and soft dilute-copper alloy twisted wire which have high electrical conductivity and high bending life and can limit disconnection during use compared with oxygen-free copper wire, and also provided are an insulated wire, coaxial cable, and composite cable using the soft dilute-copper alloy wire and soft dilute-copper alloy twisted wire. The soft dilute-copper alloy wire is subjected to annealing treatment by elongation processing of soft dilute-copper alloy material comprising copper and an additive element selected from the group consisting of Ti, Mg, Zr, Nb, Ca, V, Ni, Hf, Fe, Mn and Cr, with inevitable impurities as the balance, wherein the soft dilute-copper alloy wire has an average grain size that is 20 ?m or less in a surface layer having a depth of 50 ?m from the surface, and an elongation value that is at least 1% higher than the average elongation value of oxygen-free copper wire that has been subjected to the aforementioned annealing treatment.

Abstract: A high-speed transmission cable conductor includes a core material includes mainly copper, and a surface treated layer formed around a surface of the core material. The surface treated layer includes an amorphous layer including a metal element having a higher affinity for oxygen than the copper, and oxygen.

Abstract: A solder joint material includes a Zn-based metal material including mainly of Zn, an Al-based metal material including mainly of Al and provided on the Zn-based metal material, a Cu-based metal material including mainly of Cu and provided on the Al-based metal material, and a surface-treated layer provided on the Cu-based metal material and including an amorphous layer including oxygen and a metal with a higher oxygen affinity than a copper.

Abstract: A weldment includes metal materials that are welded to each other. At least one of the metal materials includes pure copper including an inevitable impurity, more than 2 mass ppm of oxygen, and an additive element selected from the group consisting of Mg, Zr, Nb, Fe, Si, Al, Ca, V, Ni, Mn, Ti and Cr. A method of manufacturing a weldment includes melting a dilute copper alloy material by SCR continuous casting and rolling at a molten copper temperature of not less than 1100° C. and not more than 1320° C. to make a molten metal, forming a cast bar from the molten metal, forming a dilute copper alloy member by hot-rolling the cast bar, and welding the dilute copper alloy member to a metal material.

Abstract: A composite conductor is composed of a core including a titanium or a titanium alloy, a cladding layer including a copper and being provided to clad an outer periphery of the core, and an intermetallic compound layer being formed by diffusions of the titanium or titanium alloy included in the core and the copper included in the cladding layer, and being provided between the core and the cladding layer.

Abstract: A conductor includes a copper alloy including crystal grains. The crystal grains include a first crystal grain group having a grain size larger than a predetermined standard grain size and a second crystal grain group having a grain size smaller than the predetermined standard grain size. The crystal grains have a local maximum value of grain size distribution in each of the first crystal grain group and the second crystal grain group.

Abstract: A copper foil includes a copper-based metal sheet including mainly a copper, and a surface-treated layer that is provided on the copper-based metal sheet and includes an amorphous layer including oxygen and a metal with a higher oxygen affinity than a copper. A total thickness of the copper-based metal sheet and the surface-treated layer is less than 0.55 mm.

Abstract: A solder joint material includes a Zn-based metal material including mainly of Zn, an Al-based metal material including mainly of Al and provided on the Zn-based metal material, a Cu-based metal material including mainly of Cu and provided on the Al-based metal material, and a surface-treated layer provided on the Cu-based metal material and including an amorphous layer including oxygen and a metal with a higher oxygen affinity than a copper.

Abstract: A solder joint material includes a copper-based metal material including mainly a copper, a surface-treated layer that is provided on the copper-based metal material and includes an amorphous layer including oxygen and a metal with a higher oxygen affinity than a copper, and a Sn-based solder plating layer provided on the surface-treated layer.

Abstract: A printed circuit board includes a substrate, and a wiring provided on the substrate. The wiring includes a copper-based metal wire provided on the substrate and a surface-treated layer provided on the copper-based metal wire. The copper-based metal wire includes mainly a copper. The surface-treated layer includes an amorphous layer including oxygen and a metal with a higher oxygen affinity than the copper.

Abstract: A copper wire includes a copper wire rod including 5 to 55 mass ppm of Ti, 3 to 12 mass ppm of sulfur, and 2 to 30 mass ppm of oxygen with the balance copper and inevitable impurities, a first crystal including a [111] crystal orientation and at least one twin crystal therein, and a second crystal that includes one or more crystals adjacent to the first crystal, a [111] crystal orientation with a different rotation angle on an atomic plane from the first crystal, and at least one twin crystal therein.

Abstract: A heat pipe includes a metal cylindrical body including a sealed storage space for storing water, a heat absorbing portion at one end portion of the cylindrical body to absorb heat by means of evaporation of the water, and a heat radiating portion at another end portion of the cylindrical body to radiate heat by means of condensation of steam generated by the evaporation. The cylindrical body includes a base material mainly including a stainless steel, a first metal layer mainly including a nickel and a second metal layer mainly including a copper, the first metal layer being formed on an inner surface of the base material and the second metal layer being formed on an inner surface of the first metal layer. The second metal layer is exposed to the storage space.

Abstract: A high-speed transmission cable conductor includes a core material includes mainly copper, and a surface treated layer formed around a surface of the core material. The surface treated layer includes an amorphous layer including a metal element having a higher affinity for oxygen than the copper, and oxygen.