Patents by Inventor Hideyuki Sagawa

Hideyuki Sagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140205491
    Abstract: A copper alloy material includes an additional element M including Ti, and a balance having copper and an inevitable impurity. An atomic ratio of the additional element M to oxygen is in a range of 0.33?M/O?1.5.
    Type: Application
    Filed: December 26, 2013
    Publication date: July 24, 2014
    Applicant: HITACHI METALS, LTD.
    Inventors: Keisuke FUJITO, Seigi AOYAMA, Toru SUMI, Hideyuki SAGAWA, Yuju ENDO
  • Publication number: 20140202730
    Abstract: A soft dilute-copper alloy insulated twisted wire includes a plurality of insulated wires twisted together and each including a conductor and an insulating cover layer thereon. The conductor includes a soft dilute-copper alloy wire including a soft dilute-copper alloy material including an additional element selected from the group consisting of Ti, Mg, Zr, Nb, Ca, V, Ni, Mn and Cr with a balance consisting a copper and an inevitable impurity. An average crystal grain size in a region from a surface of the soft dilute-copper alloy wire to a depth of at least 20% of a wire diameter is not more than 20 ?m.
    Type: Application
    Filed: November 8, 2013
    Publication date: July 24, 2014
    Applicant: Hitachi Metals, Ltd.
    Inventors: Keisuke Fujito, Seigi Aoyama, Toru Sumi, Hideyuki Sagawa
  • Patent number: 8779294
    Abstract: The present invention provides a flexible flat cable having high conductivity and high bending durability, and a method for manufacturing the same. The present invention is a flexible flat cable comprising conductors and insulating films applied over the conductors, wherein the conductor is comprised of at least one additive element selected from the group consisting of magnesium (Mg), zirconium (Zr), niobium (Nb), calcium (Ca), vanadium (V), nickel (Ni), manganese (Mn), titanium (Ti), and chromium (Cr); 2 mass-ppm or more of oxygen; and the balance being inevitable impurity and copper, wherein the conductor has such a recrystallized texture that the size of crystal grains in the inner area of the conductor is large and that of in the surface area thereof is smaller than that of the inner area, wherein both sides of the conductor are sandwiched between insulating films.
    Type: Grant
    Filed: October 19, 2011
    Date of Patent: July 15, 2014
    Assignee: Hitachi Metals, Ltd.
    Inventors: Toru Sumi, Seigi Aoyama, Hiromitsu Kuroda, Hideyuki Sagawa
  • Patent number: 8691395
    Abstract: A composite material for brazing having features of: forming a homogenous distribution of components in the brazing filler material even after brazing; having an excellent workability; offering low manufacturing costs; and having satisfactory corrosion resistivity as desired. The composite material for brazing has a lamination of a brazing filler material layer thereon, wherein the brazing filler material layer is a layer of alloy that includes copper, aluminum, and nickel.
    Type: Grant
    Filed: January 21, 2009
    Date of Patent: April 8, 2014
    Assignee: Hitachi Cable, Ltd.
    Inventors: Hideyuki Sagawa, Kazuma Kuroki, Hiromitsu Kuroda
  • Publication number: 20140000932
    Abstract: Provided are a soft dilute-copper alloy wire and soft dilute-copper alloy twisted wire which have high electrical conductivity and high bending life and can limit disconnection during use compared with oxygen-free copper wire, and also provided are an insulated wire, coaxial cable, and composite cable using the soft dilute-copper alloy wire and soft dilute-copper alloy twisted wire. The soft dilute-copper alloy wire is subjected to annealing treatment by elongation processing of soft dilute-copper alloy material comprising copper and an additive element selected from the group consisting of Ti, Mg, Zr, Nb, Ca, V, Ni, Hf, Fe, Mn and Cr, with inevitable impurities as the balance, wherein the soft dilute-copper alloy wire has an average grain size that is 20 ?m or less in a surface layer having a depth of 50 ?m from the surface, and an elongation value that is at least 1% higher than the average elongation value of oxygen-free copper wire that has been subjected to the aforementioned annealing treatment.
    Type: Application
    Filed: March 16, 2012
    Publication date: January 2, 2014
    Applicant: HITACHI CABLE, LTD.
    Inventors: Seigi Aoyama, Toru Sumi, Hiromitsu Kuroda, Hideyuki Sagawa
  • Patent number: 8609988
    Abstract: An electric wire with a terminal includes a conductor, and the terminal is connected to an end portion of the conductor. The terminal includes a first connecting portion connected to an electrical equipment and a second connecting portion connected to the conductor. The second connecting portion includes a first connection surface and a second connection surface opposite to the first connection surface. The conductor includes a first conductor and a second conductor that are connected to the first connection surface and the second connection surface, respectively, by ultrasonic bonding. The connecting portion of the first connection surface overlaps the connecting portion of the second connection surface in a perpendicular direction to an axial direction of the conductor.
    Type: Grant
    Filed: February 9, 2011
    Date of Patent: December 17, 2013
    Assignee: Hitachi Cable, Ltd.
    Inventors: Hideyuki Sagawa, Tosiyuki Horikoshi, Hiromitsu Kuroda, Hideaki Takehara, Toru Sumi
  • Publication number: 20130323532
    Abstract: A copper-based material includes a base comprising copper and a surface treatment layer disposed on a surface of the base, the surface treatment layer including an amorphous layer containing a metal element that has a greater affinity for oxygen than for copper, oxygen, and, optionally, copper diffused from the base.
    Type: Application
    Filed: May 29, 2013
    Publication date: December 5, 2013
    Inventors: Hideyuki SAGAWA, Seigi Aoyama, Toru Sumi, Keisuke Fujito, Hiromitsu Kuroda
  • Publication number: 20130042949
    Abstract: A method of manufacturing a soft-dilute-copper-alloy material includes a plastic working of a soft-dilute-copper-alloy including an additional element selected from the group consisting of Ti, Mg, Zr, Nb, Ca, V, Ni, Mn and Cr, and a balance consisting of copper and inevitable impurity, and a subsequent annealing treatment of the soft-dilute-copper-alloy. A working ratio in the plastic working before the annealing treatment is not less than 50%.
    Type: Application
    Filed: August 10, 2012
    Publication date: February 21, 2013
    Applicant: Hitachi Cable, Ltd.
    Inventors: Hideyuki Sagawa, Seigi Aoyama, Hiromitsu Kuroda, Toru Sumi, Keisuke Fujito, Ryohei Okada, Shinichi Masui
  • Publication number: 20130022831
    Abstract: A soft dilute copper alloy wire is composed of a soft dilute copper alloy material containing an additive element selected from the group consisting of Ti, Mg, Zr, Nb, Cu, V, Ni, Mn, and Cr, and balance comprising Cu. An average size of crystal grains lying from a surface of the soft dilute copper alloy wire at least to a depth of 20% of a wire diameter is not greater than 20 ?m.
    Type: Application
    Filed: July 19, 2012
    Publication date: January 24, 2013
    Applicant: Hitachi Cable, Ltd.
    Inventors: Hideyuki Sagawa, Seigi Aoyama, Hiromitsu Kuroda, Toru Sumi, Keisuke Fujito
  • Publication number: 20120305286
    Abstract: Provided are a soft dilute copper alloy material, a soft dilute copper alloy wire, a soft dilute copper alloy sheet, a soft dilute copper alloy stranded wire, and a cable, a coaxial cable and a composite cable using same. The disclosed soft-3dilute-copper-alloy material contains: copper; at least one additional element selected from the group consisting of Ti, Mg, Zr, Nb, Ca, V, Ni, Mn, and Cr; and inevitable impurities as the remainder. The soft dilute copper alloy material is characterized in that the average grain size is at most 20 ?m in the surface layer up to a depth of 50 ?m from the surface.
    Type: Application
    Filed: February 8, 2011
    Publication date: December 6, 2012
    Inventors: Seigi Aoyama, Toru Sumi, Hiromitsu Kuroda, Hideyuki Sagawa
  • Publication number: 20120097422
    Abstract: The present invention provides a flexible flat cable having high conductivity and high bending durability, and a method for manufacturing the same. The present invention is a flexible flat cable comprising conductors and insulating films applied over the conductors, wherein the conductor is comprised of at least one additive element selected from the group consisting of magnesium (Mg), zirconium (Zr), niobium (Nb), calcium (Ca), vanadium (V), nickel (Ni), manganese (Mn), titanium (Ti), and chromium (Cr); 2 mass-% or more of oxygen; and the balance being inevitable impurity and copper, wherein the conductor has such a recrystallized texture that the size of crystal grains in the inner area of the conductor is large and that of in the surface area thereof is smaller than that of the inner area, wherein both sides of the conductor are sandwiched between insulating films.
    Type: Application
    Filed: October 19, 2011
    Publication date: April 26, 2012
    Applicant: HITACHI CABLE, LTD.
    Inventors: Toru SUMI, Seigi AOYAMA, Hiromitsu KURODA, Hideyuki SAGAWA
  • Publication number: 20120100390
    Abstract: A weldment includes metal materials that are welded to each other. At least one of the metal materials includes pure copper including an inevitable impurity, more than 2 mass ppm of oxygen, and an additive element selected from the group consisting of Mg, Zr, Nb, Fe, Si, Al, Ca, V, Ni, Mn, Ti and Cr. A method of manufacturing a weldment includes melting a dilute copper alloy material by SCR continuous casting and rolling at a molten copper temperature of not less than 1100° C. and not more than 1320° C. to make a molten metal, forming a cast bar from the molten metal, forming a dilute copper alloy member by hot-rolling the cast bar, and welding the dilute copper alloy member to a metal material.
    Type: Application
    Filed: October 19, 2011
    Publication date: April 26, 2012
    Applicants: Hitachi Wire and Rod LTD, HITACHI CABLE, LTD.
    Inventors: Hiromitsu Kuroda, Toru Sumi, Hideyuki Sagawa, Seigi Aoyama, Masayoshi Goto, Takahiko Hanada, Takahiro Sato, Hidenori Abe
  • Publication number: 20120097904
    Abstract: A dilute copper alloy material used in an environment with presence of hydrogen includes pure copper including an inevitable impurity, more than 2 mass ppm of oxygen, and an additive element selected from the group consisting of Mg, Zr, Nb, Ca, V, Fe, Al, Si, Ni, Mn, Ti and Cr, the additive element being capable of forming an oxide in combination with the oxygen. A method of manufacturing a dilute copper alloy member excellent in characteristics of resistance to hydrogen embrittlement includes melting the dilute copper alloy material by SCR continuous casting and rolling at a copper melting temperature of not less than 1100° C. and not more than 1320° C. to make molten metal, forming a cast bar from the molten metal, and forming the dilute copper alloy member by hot-rolling the cast bar.
    Type: Application
    Filed: October 19, 2011
    Publication date: April 26, 2012
    Applicants: Hitachi Wire and Rod LTD., Hitachi Cable, Ltd
    Inventors: Hiromitsu Kuroda, Toru Sumi, Hideyuki Sagawa, Seigi Aoyama
  • Publication number: 20110198122
    Abstract: An electric wire with a terminal including a conductor, and the terminal connected to an end portion of the conductor. The terminal includes a first connecting portion connected to an electrical equipment and a second connecting portion connected to the conductor. The second connecting portion includes a first connection surface and a second connection surface opposite to the first connection surface. The conductor includes a first conductor and a second conductor that are connected to the first connection surface and the second connection surface, respectively, by ultrasonic bonding. A total cross-sectional area of the first conductor and the second conductor is not less than 20 mm2.
    Type: Application
    Filed: February 9, 2011
    Publication date: August 18, 2011
    Applicant: Hitachi Cable, Ltd.
    Inventors: Hideyuki Sagawa, Tosiyuki Horikoshi, Hiromitsu Kuroda, Hideaki Takehara, Toru Sumi
  • Publication number: 20090186239
    Abstract: A composite material for brazing having features of: forming a homogenous distribution of components in the brazing filler material even after brazing; having an excellent workability; offering low manufacturing costs; and having satisfactory corrosion resistivity as desired. The composite material for brazing has a lamination of a brazing filler material layer thereon, wherein the brazing filler material layer is a layer of alloy that includes copper, aluminum, and nickel.
    Type: Application
    Filed: January 21, 2009
    Publication date: July 23, 2009
    Inventors: Hideyuki SAGAWA, Kazuma Kuroki, Hiromitsu Kuroda
  • Patent number: 7442445
    Abstract: A brazing clad material is a composite material that comprises a base material and a brazing material layer formed integrally on the base material. The brazing material layer has a Ni or Ni alloy layer, a Ti or Ti alloy layer and a Fe—Ni alloy layer that are sequentially stacked in this order on the base material. The brazing material layer has a Fe concentration of 25 to 40 wt % in the entire brazing material layer. The brazing material layer satisfies a ratio of W1/W2 to be 0.56 to 0.66, where W1 is a weight of Ni contained in the entire brazing material layer and W2 is a total weight of Ni and Ti contained in the entire brazing material layer.
    Type: Grant
    Filed: December 23, 2005
    Date of Patent: October 28, 2008
    Assignee: Hitachi Cable, Ltd.
    Inventors: Hideyuki Sagawa, Hiromitsu Kuroda, Kazuma Kuroki, Humio Horii, Tetsuya Tokumitu, Nobuhito Sakuyama, Shigeru Okamoto
  • Publication number: 20060166028
    Abstract: A brazing clad material is a composite material that comprises a base material and a brazing material layer formed integrally on the base material. The brazing material layer has a Ni or Ni alloy layer, a Ti or Ti alloy layer and a Fe—Ni alloy layer that are sequentially stacked in this order on the base material. The brazing material layer has a Fe concentration of 25 to 40 wt % in the entire brazing material layer. The brazing material layer satisfies a ratio of W1/W2 to be 0.56 to 0.66, where W1 is a weight of Ni contained in the entire brazing material layer and W2 is a total weight of Ni and Ti contained in the entire brazing material layer.
    Type: Application
    Filed: December 23, 2005
    Publication date: July 27, 2006
    Inventors: Hideyuki Sagawa, Hiromitsu Kuroda, Kazuma Kuroki, Humio Horii, Tetsuya Tokumitu, Nobuhito Sakuyama, Shigeru Okamoto
  • Publication number: 20050260437
    Abstract: A composite material for brazing has a brazing layer provided on a surface of a base metal. The brazing layer satisfies a requirement represented by formula: W1/W2=0.58 to 0.68 wherein W1 represents the weight of an Ni (nickel) ingredient contained in the brazing layer; and W2 represents the total weight of the Ni ingredient and a Ti (titanium) ingredient contained in the brazing layer.
    Type: Application
    Filed: May 20, 2005
    Publication date: November 24, 2005
    Applicant: Hitachi Cable, Ltd.
    Inventors: Kazuma Kuroki, Hiromitsu Kuroda, Hideyuki Sagawa, Sumio Shirai