Patents by Inventor Hiep Nguyen

Hiep Nguyen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10222557
    Abstract: A spring push with a main body, a crimp portion and two extensions also provides a trigger extending from the main body. The extensions provide engagement with the connector housing and also surfaces to engage the spring. The spring push may be a single component or be comprised of two separate pieces. An adapter is also disclosed with a cut-out portion on a bottom side.
    Type: Grant
    Filed: September 29, 2015
    Date of Patent: March 5, 2019
    Assignee: US Conec, Ltd.
    Inventors: Hiep Nguyen, Joseph L. Graham
  • Publication number: 20180344913
    Abstract: A dialysis device implantable in a patient for dialysis includes a filtration unit. The filtration unit includes at least one dialysis chamber for containing and/or circulating dialysate; and at least one blood chamber for containing and/or circulating blood of the patient, disposed on at least one dialysis chamber and being in communication with the at least one dialysis chamber. Each of the at least one dialysis chamber and the at least one blood chamber comprise at least one inlet for circulating fluid into and/or out of the at least one dialysis chamber and the at least one blood chamber. The at least one dialysis chamber and the at least one blood chamber are configured such that the blood in the at least one blood chamber and the dialysate in the at least one dialysis chamber operably interact with each other for dialysis.
    Type: Application
    Filed: May 30, 2018
    Publication date: December 6, 2018
    Inventors: Hiep Nguyen, Nikhil Shah, Julie Wilderman
  • Publication number: 20180239507
    Abstract: Methods and systems for compact presentation of automatically summarized information according to rule-based graphically represented information. One of the methods includes obtaining, via a user accessible user interface, a request for uploaded textual information to be analyzed. Ontology information is accessed based on an indicated type associated with the textual information, and ontology information for the type. The ontology information specifies nodes, with the nodes causing the server system to extract values for textual expressions defined by the nodes, and relational information between the nodes, with the relational information indicating links between textual expressions. The textual information is parsed based on the ontology information. The parsing causes traversal of the nodes and extraction of values from associated textual expressions based on the textual information. Values are obtained based on the parsing, with the values being utilized as summary information.
    Type: Application
    Filed: February 23, 2018
    Publication date: August 23, 2018
    Inventors: Alin Bui, Andrew Pope, Ben Tortorelli, Binh Nguyen, Chau Nguyen, Cuong Manh Pham, Cuong Tran, Hiep Nguyen, Julien Houbin, Quang Xuan Do, Tam Nguyen, Duc Tam Nguyen, Thu Tran, Tri Nguyen
  • Publication number: 20180239959
    Abstract: Computer-implemented systems and methods for processing a document package are disclosed. A method for processing a document may include analyzing one or more documents to determine potential signer information, determining on such information, a respective set of signers, and sending electronic notifications to the signers. The notifications may include selectable links configured to provide access to the electronic documents associated with the signers. Upon selection of a link, an interactive user interface may be provided including access to the electronic documents. Signature data from a signer may be received via the interactive user interface. Based on the signature data, the system may determine whether completion criteria associated with the one or more documents is satisfied; in response to the completion criteria being satisfied, further electronic notifications to at least the signers may be sent out.
    Type: Application
    Filed: February 23, 2018
    Publication date: August 23, 2018
    Inventors: Alin Bui, Andrew Pope, Ben Tortorelli, Binh Nguyen, Cuong Manh Pham, Dat Tien Nguyen, Hiep Nguyen, Julien Houbin, Nguyen Nguyen, Phuoc Nguyen, Quang Xuan Do, Tri Nguyen
  • Patent number: 10039555
    Abstract: Systems and methods for treating disc herniation include surgical and endoscopic access and removal of disc tissue. The tissue removal devices that may be used include flexible elongate members, such as a cable, that may be inserted into a vertebral disc and rotated to pulverize the disc material and facilitate its removal.
    Type: Grant
    Filed: February 24, 2014
    Date of Patent: August 7, 2018
    Assignee: Spine View, Inc.
    Inventors: John T. To, Gary Daniel Zaretzka, Hiep Nguyen, Singfatt Chin, Robert May
  • Publication number: 20180194577
    Abstract: A robotic document feeder system may comprise a robotic arm coupled to a Bernoulli cup assembly powered by a vacuum source; a base disposed over an imaging surface of a document scanner, wherein the base comprises a designated scan area through which a document may be imaged by the document scanner; an input bin for storing at least one document to be imaged by the document scanner; and an output bin for storing the at least one document after it has been imaged by the document scanner. The system may further comprise an alignment mechanism in proximity to the designated scan area and configured to align the document substantially over the imaging surface of the document scanner; at least one automated door configured to close the designated scan area after the document has been placed in the designated scan area; and a camera positioned above the designated scan area for imaging a second side of the document.
    Type: Application
    Filed: March 6, 2018
    Publication date: July 12, 2018
    Inventors: Brian Gross, Hiep Nguyen, Dale Remmers
  • Publication number: 20180185046
    Abstract: Disclosed herein are tissue-removal devices and methods for treating spinal diseases using such devices. The tissue-removal devices may comprise a cable and/or extendable elements with a retracted and a deployed configuration. The cable and/or extendable elements may be distally supported and restrained by a support element such that the support element may be pushed transversely away when the extendable element is distally extended into its deployed configuration. An annular cutting element may be provided about the distal end of the extendable element or the support element. Various configurations of the extendable and support elements are described herein, as well as methods of using tissue-removal devices with extendable and support elements coupled by an annular cutting element for treating spinal diseases.
    Type: Application
    Filed: August 22, 2017
    Publication date: July 5, 2018
    Applicant: Spine View, Inc.
    Inventors: David Batten, John To, Hiep Nguyen
  • Patent number: 9948802
    Abstract: A system may include a robotic arm and a Bernoulli cup assembly powered by a vacuum source and coupled to the robotic arm. The Bernoulli cup assembly may lift a document, and the robotic arm may move the Bernoulli cup assembly with the lifted document to a document scanner for imaging the document. The system may further include an input bin, a base supported by a platform and disposed over an imaging surface of the document scanner, and an output bin. A method may include lifting a document from an input bin via suction pressure using a Bernoulli cup assembly, robotically moving the Bernoulli cup assembly with the lifted document to a document scanner, and scanning the document. The method may further include robotically moving the Bernoulli cup assembly with the lifted document away from the document scanner, and de-activating the suction pressure to release the document.
    Type: Grant
    Filed: June 22, 2016
    Date of Patent: April 17, 2018
    Assignee: Mentalix, Inc.
    Inventors: Thomas Allen, Ravi Gattamaraju, Brian Gross, Dalton McFarling, Hiep Nguyen, Dale Remmers, Ashish Thapa
  • Patent number: 9857538
    Abstract: An adapter with novel alignment features engages alignment features on a plug, providing general alignment of the ferrule holders and ferrules in the plug. After the plug engages the adapter, the ferrule holders engage a second set of alignment features in the adapter to provide fine alignment for the ferrules.
    Type: Grant
    Filed: March 15, 2014
    Date of Patent: January 2, 2018
    Assignee: US Conec, Ltd.
    Inventors: Hiep Nguyen, Darrell R. Childers, Michael E. Hughes, Jillcha Fekadu Wakjira, Joseph P. Howard
  • Patent number: 9788849
    Abstract: Disclosed herein are tissue-removal devices and methods for treating spinal diseases using such devices. The tissue-removal devices may comprise a cable and/or extendable elements with a retracted and a deployed configuration. The cable and/or extendable elements may be distally supported and restrained by a support element such that the support element may be pushed transversely away when the extendable element is distally extended into its deployed configuration. An annular cutting element may be provided about the distal end of the extendable element or the support element. Various configurations of the extendable and support elements are described herein, as well as methods of using tissue-removal devices with extendable and support elements coupled by an annular cutting element for treating spinal diseases.
    Type: Grant
    Filed: August 18, 2014
    Date of Patent: October 17, 2017
    Assignee: Spine View, Inc.
    Inventors: David Batten, John To, Hiep Nguyen
  • Patent number: 9698075
    Abstract: A microelectronic device includes semiconductor device with a component at a front surface of the semiconductor device and a backside heat spreader layer on a back surface of the semiconductor device. The backside heat spreader layer is 100 nanometers to 3 microns thick, has an in-plane thermal conductivity of at least 150 watts/meter-° K, and an electrical resistivity less than 100 micro-ohm-centimeters.
    Type: Grant
    Filed: July 15, 2016
    Date of Patent: July 4, 2017
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Archana Venugopal, Marie Denison, Luigi Colombo, Hiep Nguyen, Darvin Edwards
  • Publication number: 20170123915
    Abstract: Described herein are techniques for rebuilding the contents of a failed storage unit in a storage system having a plurality of storage units. Rather than rebuilding the contents on a dedicated spare which may be costly, the contents are rebuilt on system-level over provisioned (OP) space of the non-failed storage units. Such system-level OP space is ordinarily used to perform garbage collection, but in the event of a storage unit failure, a fraction of the system-level OP space is repurposed into a temporary hot spare for storing the rebuilt contents. Upon recovery of the failed storage unit, the storage space allocated to the temporary hot spare is returned to the system-level OP space.
    Type: Application
    Filed: October 29, 2015
    Publication date: May 4, 2017
    Inventors: Hiep Nguyen, Anil Nanduri, Chunqi Han
  • Patent number: 9500824
    Abstract: To increase the protection of a fiber optic connector system from EMI, apertures in the system must be as small as possible. To reduce the size of apertures in the system, the openings are minimized by using electrically conductive fiber optic connector parts, including a connector housing, a fiber optic ferrule disposed within the electrically conductive connector housing, and an electrically conductive heat-shrink attachment securable to the connector housing. An electrically conductive heat shrink may be attached to the heat-shrink attachment to provide more protection.
    Type: Grant
    Filed: October 10, 2015
    Date of Patent: November 22, 2016
    Assignee: US Conec, Ltd.
    Inventors: Hiep Nguyen, Darrell R. Childers, Michael E. Hughes
  • Patent number: 9496198
    Abstract: A microelectronic device includes semiconductor device with a component at a front surface of the semiconductor device and a backside heat spreader layer on a back surface of the semiconductor device. The backside heat spreader layer is 100 nanometers to 3 microns thick, has an in-plane thermal conductivity of at least 150 watts/meter-° K, and an electrical resistivity less than 100 micro-ohm-centimeters.
    Type: Grant
    Filed: September 28, 2014
    Date of Patent: November 15, 2016
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Archana Venugopal, Marie Denison, Luigi Colombo, Hiep Nguyen, Darvin Edwards
  • Publication number: 20160322277
    Abstract: A microelectronic device includes semiconductor device with a component at a front surface of the semiconductor device and a backside heat spreader layer on a back surface of the semiconductor device. The backside heat spreader layer is 100 nanometers to 3 microns thick, has an in-plane thermal conductivity of at least 150 watts/meter-° K, and an electrical resistivity less than 100 micro-ohm-centimeters.
    Type: Application
    Filed: July 15, 2016
    Publication date: November 3, 2016
    Inventors: Archana Venugopal, Marie Denison, Luigi Colombo, Hiep Nguyen, Darvin Edwards
  • Publication number: 20160304303
    Abstract: A system may include a robotic arm and a Bernoulli cup assembly powered by a vacuum source and coupled to the robotic arm. The Bernoulli cup assembly may lift a document, and the robotic arm may move the Bernoulli cup assembly with the lifted document to a document scanner for imaging the document. The system may further include an input bin, a base supported by a platform and disposed over an imaging surface of the document scanner, and an output bin. A method may include lifting a document from an input bin via suction pressure using a Bernoulli cup assembly, robotically moving the Bernoulli cup assembly with the lifted document to a document scanner, and scanning the document. The method may further include robotically moving the Bernoulli cup assembly with the lifted document away from the document scanner, and de-activating the suction pressure to release the document.
    Type: Application
    Filed: June 22, 2016
    Publication date: October 20, 2016
    Inventors: Thomas Allen, Ravi Gattamaraju, Brian Gross, Dalton McFarling, Hiep Nguyen, Dale Remmers, Ashish Thapa
  • Publication number: 20160161680
    Abstract: An adapter with novel alignment features engages alignment features on a plug, providing general alignment of the ferrule holders and ferrules in the plug. After the plug engages the adapter, the ferrule holders engage a second set of alignment features in the adapter to provide fine alignment for the ferrules.
    Type: Application
    Filed: March 15, 2014
    Publication date: June 9, 2016
    Inventors: Hiep Nguyen, Darrell R. Childers, Michael E. Hughes, Jillcha Fekadu Wakjira, Joseph P. Howard
  • Publication number: 20160103284
    Abstract: To increase the protection of a fiber optic connector system from EMI, apertures in the system must be as small as possible. To reduce the size of apertures in the system, the openings are minimized by using electrically conductive fiber optic connector parts, including a connector housing, a fiber optic ferrule disposed within the electrically conductive connector housing, and an electrically conductive heat-shrink attachment securable to the connector housing. An electrically conductive heat shrink may be attached to the heat-shrink attachment to provide more protection.
    Type: Application
    Filed: October 10, 2015
    Publication date: April 14, 2016
    Inventors: Hiep Nguyen, Darrell R. Childers, Michael E. Hughes
  • Publication number: 20160093552
    Abstract: A microelectronic device includes semiconductor device with a component at a front surface of the semiconductor device and a backside heat spreader layer on a back surface of the semiconductor device. The backside heat spreader layer is 100 nanometers to 3 microns thick, has an in-plane thermal conductivity of at least 150 watts/meter-° K, and an electrical resistivity less than 100 micro-ohm-centimeters.
    Type: Application
    Filed: September 28, 2014
    Publication date: March 31, 2016
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Archana Venugopal, Marie Denison, Luigi Colombo, Hiep Nguyen, Darvin Edwards
  • Publication number: 20160091671
    Abstract: A spring push with a main body, a crimp portion and two extensions also provides a trigger extending from the main body. The extensions provide engagement with the connector housing and also surfaces to engage the spring. The spring push may be a single component or be comprised of two separate pieces. An adapter is also disclosed with a cut-out portion on a bottom side.
    Type: Application
    Filed: September 29, 2015
    Publication date: March 31, 2016
    Inventors: Hiep Nguyen, Joseph L. Graham