Abstract: A perpendicular magnetic recording write head has a main pole that is typically CoFe electroplated into a generally trapezoidal shaped alumina trench. A metallic side gap layer is deposited into the alumina trench to adjust the trench width to the desired main pole dimension. A nonmagnetic metallic amorphous underlayer, preferably an amorphous NiTa alloy or an amorphous NiNb alloy, is then deposited on the side gap layer. A pole seed layer, such as a NiCr/CoFe bilayer, is deposited into the trench onto the metallic amorphous underlayer prior to electroplating the CoFe main pole. The metallic amorphous underlayer serves to reset the growth between the side gap layer and the NiCr/CoFe pole seed layer. The metallic amorphous underlayer does not insulate the electroplating CoFe layer from the metallic side gap layer, which allows for better current conduction normal to the layers, resulting in a main pole with improved magnetic properties.

Abstract: The embodiments disclose a method to protect magnetic bits during carbon field planarization, including depositing a stop layer upon magnetic bits and magnetic film of a patterned stack, depositing a carbon fill layer on the stop layer and using the stop layer during planarization and etch-back of the carbon field to protect the patterned stack magnetic bits during the carbon field planarization.

Abstract: A method for manufacturing a magnetic write head having a stepped trailing shield. The stepped trailing shield is formed by forming a non-magnetic bump over a write pole prior to electroplating a wrap-around magnetic shield. The method allows the location of the front edge of the bump relative to the back edge of the wrap-around shield to be monitored by measuring the electrical resistance of an electrical lapping guide formed concurrently with these features. This concurrent formation of a lapping guide can be used to define the relative location of other features as well, such as the location of a back edge of a wrap-around shield relative to a flare point of a write pole.

Abstract: Methods and structures for the fabrication of both thin film longitudinal and perpendicular write heads are disclosed. A unique feature of these write heads is the inclusion of layered return poles, which comprise alternating layers of 22/78 and 80/20 NiFe alloys. The alternating layers also vary in thickness, the 22/78 NiFe layers having a nominal thickness of 1500 angstroms and the 80/20 NiFe layers having a nominal thickness of about 75 angstroms. Head efficiency and signal to noise ratios are significantly improved in heads having layered return pole construction.

Abstract: Embodiments of the present invention pertain to controlling thickness of wafers during electroplating process. Information pertaining to an old current used during an electroplating process of a previous wafer is received. Information pertaining to the thickness of the previous wafer is received. A new current is automatically determined. The new current is to be used during an electroplating process for a new wafer. The new current is determined based on the information pertaining to the old current and the information pertaining to the thickness of the previous wafer.

Abstract: One preferred method for use in making a device structure with use of the resist channel shrinking solution includes the steps of forming a first pedestal portion within a channel of a patterned resist; applying a resist channel shrinking solution comprising a resist channel shrinking film and corrosion inhibitors within the channel of the patterned resist; baking the resist channel shrinking solution over the patterned resist to thereby reduce a width of the channel of the patterned resist; removing the resist channel shrinking solution; and forming a second pedestal portion within the reduced-width channel of the patterned resist. Advantageously, the oxide layer and the corrosion inhibitors of the resist channel shrinking solution reduce corrosion in the pedestal during the act of baking the resist channel shrinking solution.

Abstract: Methods and structures for the fabrication of perpendicular thin film heads are disclosed. Prior to the deposition of shield structures, seed layers having anti-reflective properties are utilized, eliminating the need to deposit, then remove, traditional inorganic anti-reflection coatings prior to shield plating.

Abstract: A magnetic write head and method of manufacture thereof that has a first pole structure having a notched structure configured with a steep shoulder portion and a narrow vertical notch portion extending from the top of the steep shoulder portion. The write head also includes a second pole structure (P2) that has a very narrow width (track width) and that is self aligned with the narrow vertical notch structure of the first pole structure. The write head provides excellent magnetic properties including a very narrow track width and minimal side writing, while avoiding magnetic saturation of the poles.

Abstract: A magnetic disk drive head is disclosed including a write head, which includes a P1 layer having a pedestal portion, a gap layer formed on the P1 layer, and a P2 layer formed on the gap layer. The P1 layer includes a shoulder formation having a neck portion and a beveled portion. Also disclosed is a disk drive having a write head with a P1 layer with shoulder formation, and a method for fabricating a write pole for a magnetic recording head having a P1 layer with shoulder formation.

Abstract: Methods and structures for the fabrication of both thin film longitudinal and perpendicular write heads are disclosed. A unique feature of these write heads is the inclusion of layered return poles, which comprise alternating layers of 22/78 and 80/20 NiFe alloys. The alternating layers also vary in thickness, the 22/78 NiFe layers having a nominal thickness of 1500 angstroms and the 80/20 NiFe layers having a nominal thickness of about 75 angstroms. Head efficiency and signal to noise ratios are significantly improved in heads having layered return pole construction.

Abstract: A method for manufacturing a magnetic write head having a stepped trailing shield. The stepped trailing shield is formed by forming a non-magnetic bump over a write pole prior to electroplating a wrap-around magnetic shield. The method allows the location of the front edge of the bump relative to the back edge of the wrap-around shield to be monitored by measuring the electrical resistance of an electrical lapping guide formed concurrently with these features. This concurrent formation of a lapping guide can be used to define the relative location of other features as well, such as the location of a back edge of a wrap-around shield relative to a flare point of a write pole.

Abstract: Methods and structures for the fabrication of perpendicular thin film heads are disclosed. Prior to the deposition of shield structures, capped seed layers having a dual layer structure are utilized, improving photo resist adhesion and plated shield adhesion, without the need to deposit, then remove, traditional inorganic anti-reflection coatings prior to shield plating.

Abstract: A method and apparatus for integrating a stair notch and a gap bump at a pole tip in a write head is disclosed. A protective plated layer is formed over the bump to prevent the bump form being damaged during formation of the notch at the pole tip. The flux from the second pole outside of the track will be effectively channeled to the first pole piece under the alumina bump.

Abstract: Methods and structures for the fabrication of wrap around and trailing shield structures are disclosed. Capped seed layers having a dual layer structure are utilized, improving photo resist adhesion and plated shield adhesion, without the need to deposit, then remove, traditional inorganic anti-reflection coatings prior to shield plating.

Abstract: Methods and structures for the fabrication of wrap around and trailing shield structures are disclosed. Seed layers having anti-reflective properties are utilized, eliminating the need to deposit, then remove, traditional inorganic anti-reflection coatings prior to shield plating.

Abstract: A method and apparatus for integrating a stair notch and a gap bump at a pole tip in a write head is disclosed. A protective plated layer is formed over the bump to prevent the bump form being damaged during formation of the notch at the pole tip. The flux from the second pole outside of the track will be effectively channeled to the first pole piece under the alumina bump.

Abstract: Embodiments of the present invention pertain to controlling thickness of wafers during electroplating process. Information pertaining to an old current used during an electroplating process of a previous wafer is received. Information pertaining to the thickness of the previous wafer is received. A new current is automatically determined. The new current is to be used during an electroplating process for a new wafer. The new current is determined based on the information pertaining to the old current and the information pertaining to the thickness of the previous wafer.

Abstract: A magnetic write head and method of manufacture thereof that has a first pole structure having a notched structure configured with a steep shoulder portion and a narrow vertical notch portion extending from the top of the steep shoulder portion. The write head also includes a second pole structure (P2) that has a very narrow width (track width) and that is self aligned with the narrow vertical notch structure of the first pole structure. The write head provides excellent magnetic properties including a very narrow track width and minimal side writing, while avoiding magnetic saturation of the poles.

Abstract: The present invention discloses a method for the production of sub-micron structures on magnetic materials using electron beam lithography. A subtractive process is disclosed wherein a portion of a magnetic material layer is removed from the substrate using conventional lithography, and the remaining portion of the magnetic material layer is patterned by e-beam lithography. A additive process is also disclosed wherein a thin magnetic seed layer is deposited on the substrate, a portion of which is removed by conventional lithography and replaced with a non-magnetic conducting layer. The remaining portion of magnetic seed layer is patterned by e-beam lithography and the final magnetic structure produced by electroplating.

Abstract: A magnetic disk drive head is disclosed including a write head, which includes a P1 layer having a pedestal portion, a gap layer formed on the P1 layer, and a P2 layer formed on the gap layer. The P1 layer includes a shoulder formation having a neck portion and a beveled portion. Also disclosed is a disk drive having a write head with a P1 layer with shoulder formation, and a method for fabricating a write pole for a magnetic recording head having a P1 layer with shoulder formation.