Abstract: The present invention relates to an improved sensing amplifier and related method for use in read operations in flash memory devices. In one embodiment, a voltage offset is induced in the sensing amplifier through the use of capacitors.

Abstract: Various architectures and layouts for an array of resistive random access memory (RRAM) cells are disclosed. The RRAM cells are organized into rows and columns, with each cell comprising a top electrode, a bottom electrode, and a switching layer. Circuitry is included for improving the reading and writing of the array, including the addition of a plurality of columns of dummy RRAM cells in the array used as a ground source, connecting source lines to multiple pairs of rows of RRAM cells, and the addition of rows of isolation transistors.

Abstract: Numerous embodiments of methods for writing to a resistive random access memory (RRAM) cell are disclosed. In one embodiment, the system verifies if a current through the RRAM cell exceeds a threshold value, and if it does not, the system executes a concurrent write-while-verify operation. In another embodiment, the system verifies if current through the RRAM cell has reached a target value, and if it has not, the system executes a write operation and then verifies the write operation using a current comparison.

Abstract: Numerous embodiments for an improved sense amplifier circuit for reading data in a flash memory cell are disclosed. The embodiments each compare current or voltage measurements from a data block with a reference block to determine the value stored in the selected memory cell in the data block. The use of one or more localized boost circuits allow the embodiments to utilize lower operating voltages than prior art sense amplifier circuits, resulting in reduced power consumption.

Abstract: A system and method for improved power sequencing within an embedded flash memory device is disclosed. Various power-on sequences and power-down sequences for a plurality of voltage sources are utilized to improve the performance of an embedded flash memory device. The plurality of voltage sources can be used for different purposes within the embedded flash memory device.

Abstract: Numerous embodiments for an improved sense amplifier circuit for reading data in a flash memory cell are disclosed. The embodiments each compare current or voltage measurements from a data block with a reference block to determine the value stored in the selected memory cell in the data block. The use of one or more localized boost circuits allow the embodiments to utilize lower operating voltages than prior art sense amplifier circuits, resulting in reduced power consumption.

Abstract: A non-volatile memory device comprises a semiconductor substrate of a first conductivity type. An array of non-volatile memory cells is located in the semiconductor substrate and arranged in a plurality of rows and columns. Each memory cell comprises a first region on a surface of the semiconductor substrate of a second conductivity type, and a second region on the surface of the semiconductor substrate of the second conductivity type. A channel region is between the first region and the second region. A word line overlies a first portion of the channel region and is insulated therefrom, and adjacent to the first region and having little or no overlap with the first region. A floating gate overlies a second portion of the channel region, is adjacent to the first portion, and is insulated therefrom and is adjacent to the second region. A coupling gate overlies the floating gate. A bit line is connected to the first region.

Abstract: A circuit and method are disclosed for operating a non-volatile memory device, comprising time sampling a reference current or voltage in a floating holding node to obtain a hold voltage and applying the hold voltage in sensing circuitry.

Abstract: Various embodiments for inhibiting the programming of memory cells coupled to unselected bit lines while programming a memory cell coupled to a selected bit line in a flash memory array are disclosed. Various embodiments for compensating for leakage current during the programming of memory cells coupled to a selected bit line in a flash memory array also are disclosed.

Abstract: A system and method are disclosed for performing address fault detection in a flash memory system. An address fault detection array is used to confirm that an activated word line or bit line is the word line or bit line that was actually intended to be activated based upon the received address, which will identify a type of fault where the wrong word line or bit line is activated. The address fault detection array also is used to indicate whether more than one word line or bit line was activated, which will identify a type of fault where two or more word lines or bit lines are activated.

Abstract: A memory device that provides individual memory cell read, write and erase. In an array of memory cells arranged in rows and columns, each column of memory cells includes a column bit line, a first column control gate line for even row cells and a second column control gate line for odd row cells. Each row of memory cells includes a row source line. In another embodiment, each column of memory cells includes a column bit line and a column source line. Each row of memory cells includes a row control gate line. In yet another embodiment, each column of memory cells includes a column bit line and a column erase gate line. Each row of memory cells includes a row source line, a row control gate line, and a row select gate line.

Abstract: The present invention relates to a flash memory system comprising one or more sense amplifiers for reading data stored in flash memory cells. The sense amplifiers utilize fully depleted silicon-on-insulator transistors to minimize leakage. The fully depleted silicon-on-insulator transistors comprise one or more fully depleted silicon-on-insulator NMOS transistors and/or one or more fully depleted silicon-on-insulator PMOS transistors.

Abstract: A memory device including a silicon substrate having a planar upper surface in a memory cell area and an upwardly extending silicon fin in a logic device area. The silicon fin includes side surfaces extending up and terminating at a top surface. The logic device includes spaced apart source and drain regions with a channel region extending there between (along the top surface and the side surfaces), and a conductive logic gate disposed over the top surface and laterally adjacent to the side surfaces. The memory cell includes spaced apart source and drain regions with a second channel region extending there between, a conductive floating gate disposed over one portion of the second channel region, a conductive word line gate disposed over another portion of the second channel region, a conductive control gate disposed over the floating gate, and a conductive erase gate disposed over the source region.

Abstract: The present invention relates to a flash memory cell with only four terminals and decoder circuitry for operating an array of such flash memory cells. The invention allows for fewer terminals for each flash memory cell compared to the prior art, which results in a simplification of the decoder circuitry and overall die space required per flash memory cells. The invention also provides for the use of high voltages on one or more of the four terminals to allow for read, erase, and programming operations despite the lower number of terminals compared to prior art flash memory cells.

Abstract: A method of forming a memory device with memory cells over a planar substrate surface and FinFET logic devices over fin shaped substrate surface portions, including forming a protective layer over previously formed floating gates, erase gates, word line poly and source regions in a memory cell portion of the substrate, then forming fins into the surface of the substrate and forming logic gates along the fins in a logic portion of the substrate, then removing the protective layer and completing formation of word line gates from the word line poly and drain regions in the memory cell portion of the substrate.

Abstract: The present invention relates to an improved sensing amplifier and related method for use in read operations in flash memory devices. In one embodiment, a voltage offset is induced in the sensing amplifier through the use of capacitors.

Abstract: A method of forming a memory device includes forming a first layer of conductive material having opposing upper and lower surfaces, forming a layer of amorphous silicon on the upper surface of the first layer of conductive material, stripping away the layer of amorphous silicon, wherein some of the amorphous silicon remains in the upper surface of the first layer of conductive material, forming a layer of transition metal oxide material on the upper surface of the first layer of conductive material, and forming a second layer of conductive material on the layer of transition metal oxide material. The method smoothes the upper surface of the bottom electrode, and also provides an bottom electrode upper surface with stable material that is hard to oxidize.

Abstract: A method of forming a memory device that includes forming a first insulation layer on a semiconductor substrate, forming a conductive material layer on the first insulation layer, forming an insulation block on the conductive material layer, forming an insulation spacer along a side surface of the insulation block and on the conductive material layer, etching the conductive material layer to form a block of the conductive material disposed directly under the insulation block and the insulation spacer, removing the insulation spacer, forming a second insulation layer having a first portion wrapping around an exposed upper edge of the block of the conductive material and a second portion disposed on a first portion of the first insulation layer over the substrate, and forming a conductive block insulated from the block of the conductive material by the second insulation layer and from the substrate by the first and second insulation layers.

Abstract: The present invention relates to a flash memory system wherein one or more circuit blocks utilize fully depleted silicon-on-insulator transistor design to minimize leakage.

Abstract: A memory device including a silicon substrate having a planar upper surface in a memory cell area and an upwardly extending silicon fin in a logic device area. The silicon fin includes side surfaces extending up and terminating at a top surface. The logic device includes spaced apart source and drain regions with a channel region extending there between (along the top surface and the side surfaces), and a conductive logic gate disposed over the top surface and laterally adjacent to the side surfaces. The memory cell includes spaced apart source and drain regions with a second channel region extending there between, a conductive floating gate disposed over one portion of the second channel region, a conductive word line gate disposed over another portion of the second channel region, a conductive control gate disposed over the floating gate, and a conductive erase gate disposed over the source region.