Patents by Inventor Hilton T. Toy
Hilton T. Toy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150014836Abstract: An improved electronic module assembly and method of fabrication is disclosed. A patterned array of adhesive is deposited on a laminate, to which a chip is attached. Each region of adhesive is referred to as a lid tie. A lid is placed on the laminate, and is in contact with the lid ties. The lid ties serve to add stability to the laminate and reduce flexing during thermal processing and mechanical stress.Type: ApplicationFiled: July 11, 2013Publication date: January 15, 2015Inventors: Edmund Blackshear, Elaine Cyr, Benjamin Vito Fasano, Paul Francis Fortier, Marcus E. Interrante, Roger Lam, Shidong Li, Thomas Edward Lombardi, Hilton T. Toy, Thomas Weiss
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Publication number: 20150001701Abstract: A multichip module includes a carrier, a stiffening frame, a plurality of semiconductor chips, and a plurality of covers. The carrier has a top surface and a bottom surface configured to be electrically connected to a motherboard. The stiffening frame includes a plurality of openings that accept the plurality of semiconductor chips and may be attached to the top surface of the carrier with an adhesive that absorbs dimensional changes between the stiffening frame and the carrier. The semiconductor chips are concentrically arranged within the plurality of openings of the stiffening frame and the plurality of covers are attached to the stiffening frame so as to enclose the plurality of openings.Type: ApplicationFiled: June 27, 2013Publication date: January 1, 2015Inventors: Shidong Li, Gregg B. Monjeau, Kamal K. Sikka, Hilton T. Toy, Thomas Weiss
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Patent number: 8906809Abstract: A multi-chip electronic package and methods of manufacture are provided. The structure includes a lid encapsulating at least one chip mounted on a chip carrier; at least one seal shim fixed between the lid and the chip carrier, the at least one seal shim forming a gap between pistons of the lid and respective ones of the chips; and thermal interface material within the gap and contacting the pistons of the lid and respective ones of the chips.Type: GrantFiled: June 7, 2012Date of Patent: December 9, 2014Assignee: International Business Machines CorporationInventors: Martin M. Beaumier, Steven P. Ostrander, Kamal K. Sikka, Hilton T. Toy, Jeffrey A. Zitz
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Patent number: 8900927Abstract: A multi-chip electronic package and methods of manufacture are provided. The method includes contacting pistons of a lid with respective ones of chips on a chip carrier. The method further includes separating the lid and the chip carrier and placing at least one seal shim on one of the lid and chip carrier. The at least one seal shim has a thickness that results in a gap between the pistons with the respective ones of the chips on the chip carrier. The method further includes dispensing thermal interface material within the gap and in contact with the chips. The method further includes sealing the lid to the chip carrier with the at least one seal shim between the lid and the chip carrier.Type: GrantFiled: August 16, 2010Date of Patent: December 2, 2014Assignee: International Business Machines CorporationInventors: Martin M. Beaumier, Steven P. Ostrander, Kamal K. Sikka, Hilton T. Toy, Jeffrey A. Zitz
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Patent number: 8860206Abstract: A multi-chip electronic package and methods of manufacture are provided. The method includes adjusting a piston position of one or more pistons with respect to one or more chips on a chip carrier. The adjusting includes placing a chip shim on the chips and placing a seal shim between a lid and the chip carrier. The seal shim is thicker than the chip shim. The adjusting further includes lowering the lid until the pistons contact the chip shim. The method further includes separating the lid and the chip carrier and removing the chip shim and the seal shim. The method further includes dispensing thermal interface material on the chips and lowering the lid until a gap filled with the thermal interface material is about a particle size of the thermal interface material. The method further includes sealing the lid to the chip carrier with sealant.Type: GrantFiled: September 30, 2013Date of Patent: October 14, 2014Assignee: International Business Machines CorporationInventors: Kamal K. Sikka, Hilton T. Toy, Krishna R. Tunga, Jeffrey A. Zitz
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Publication number: 20140051211Abstract: A multi-chip electronic package and methods of manufacture are provided. The multi-chip package includes a plurality of chips mounted on a chip carrier. The multi-chip package further includes a lid mounted on the chip carrier using a bonding material or compression seal, and at least one single piston extending from the lid. Each piston covers an entirety of multiple chips of the plurality of chips.Type: ApplicationFiled: October 28, 2013Publication date: February 20, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Suresh D. KADAKIA, Kamal K. SIKKA, Hilton T. TOY, Jeffrey A. ZITZ
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Publication number: 20140027898Abstract: A multi-chip electronic package and methods of manufacture are provided. The method includes adjusting a piston position of one or more pistons with respect to one or more chips on a chip carrier. The adjusting includes placing a chip shim on the chips and placing a seal shim between a lid and the chip carrier. The seal shim is thicker than the chip shim. The adjusting further includes lowering the lid until the pistons contact the chip shim. The method further includes separating the lid and the chip carrier and removing the chip shim and the seal shim. The method further includes dispensing thermal interface material on the chips and lowering the lid until a gap filled with the thermal interface material is about a particle size of the thermal interface material. The method further includes sealing the lid to the chip carrier with sealant.Type: ApplicationFiled: September 30, 2013Publication date: January 30, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Kamal K. SIKKA, Hilton T. TOY, Krishna R. TUNGA, Jeffrey A. ZITZ
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Publication number: 20140015387Abstract: A multi-chip module (MCM) package is provided and includes a substrate and a hat assembly. The substrate includes a surface on which chips of the MCM are re-workable. The hat assembly is configured to be non-hermetically sealed to the substrate. The hat assembly and the substrate are configured for tension-type disassembly in a dimension oriented substantially normally with respect to a plane of the substrate surface.Type: ApplicationFiled: July 13, 2012Publication date: January 16, 2014Applicant: International Business Machines CorporationInventors: Paul F. Bodenweber, Hilton T. Toy, Krishna R. Tunga, Jeffrey A. Zitz
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Patent number: 8592970Abstract: A multi-chip electronic package and methods of manufacture are provided. The method comprises adjusting a piston position of one or more pistons with respect to one or more chips on a chip carrier. The adjusting comprises placing a chip shim on the chips and placing a seal shim between a lid and the chip carrier. The seal shim is thicker than the chip shim. The adjusting further comprise lowering the lid until the pistons contact the chip shim. The method further comprises separating the lid and the chip carrier and removing the chip shim and the seal shim. The method further comprises dispensing thermal interface material on the chips and lowering the lid until a gap filled with the thermal interface material is about a particle size of the thermal interface material. The method further comprises sealing the lid to the chip carrier with sealant.Type: GrantFiled: June 27, 2011Date of Patent: November 26, 2013Assignee: International Business Machines CorporationInventors: Kamal K. Sikka, Hilton T. Toy, Krishna R. Tunga, Jeffrey A. Zitz
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Patent number: 8587114Abstract: A multi-chip electronic package and methods of manufacture are provided. The multi-chip package includes a plurality of chips mounted on a chip carrier. The multi-chip package further includes a lid mounted on the chip carrier using a bonding material or compression seal, and at least one single piston extending from the lid. Each piston covers an entirety of multiple chips of the plurality of chips.Type: GrantFiled: October 5, 2010Date of Patent: November 19, 2013Assignee: International Business Machines CorporationInventors: Suresh D. Kadakia, Kamal K. Sikka, Hilton T. Toy, Jeffrey A. Zitz
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Patent number: 8531025Abstract: A semiconductor module structure and a method of forming the semiconductor module structure are disclosed. The structure incorporates a die mounted on a substrate and covered by a lid. A thermal compound is disposed within a thermal gap between the die and the lid. A barrier around the periphery of the die extends between the lid and the substrate, contains the thermal compound, and flexes in response to expansion and contraction of both the substrate and the lid during cycling of the semiconductor module. More particularly, either the barrier is formed of a flexible material or has a flexible connection to the substrate and/or to the lid. The barrier effectively contains the thermal compound between the die and the lid and, thereby, provides acceptable and controlled coverage of the thermal compound over the die for heat removal.Type: GrantFiled: May 30, 2007Date of Patent: September 10, 2013Assignee: International Business Machines CorporationInventors: David L. Edwards, Sushumna Iruvanti, Hilton T. Toy, Wei Zou
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Patent number: 8445331Abstract: A multi-chip electronic package and methods of manufacture are provided. The multi-chip package includes a plurality of chips mounted on a chip carrier. The multi-chip package further includes a lid mounted on the chip carrier using a bonding material or compression seal, and at least one single piston extending from the lid. Each piston covers an entirety of multiple chips of the plurality of chips.Type: GrantFiled: March 29, 2012Date of Patent: May 21, 2013Assignee: International Business Machines CorporationInventors: Suresh D. Kadakia, Kamal K. Sikka, Hilton T. Toy, Jeffrey A. Zitz
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Publication number: 20120326294Abstract: A multi-chip electronic package and methods of manufacture are provided. The method comprises adjusting a piston position of one or more pistons with respect to one or more chips on a chip carrier. The adjusting comprises placing a chip shim on the chips and placing a seal shim between a lid and the chip carrier. The seal shim is thicker than the chip shim. The adjusting further comprise lowering the lid until the pistons contact the chip shim. The method further comprises separating the lid and the chip carrier and removing the chip shim and the seal shim. The method further comprises dispensing thermal interface material on the chips and lowering the lid until a gap filled with the thermal interface material is about a particle size of the thermal interface material. The method further comprises sealing the lid to the chip carrier with sealant.Type: ApplicationFiled: June 27, 2011Publication date: December 27, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: KAMAL K. SIKKA, Hilton T. Toy, Krishna R. Tunga, Jeffrey A. Zitz
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Publication number: 20120241944Abstract: A multi-chip electronic package and methods of manufacture are provided. The structure includes a lid encapsulating at least one chip mounted on a chip carrier; at least one seal shim fixed between the lid and the chip carrier, the at least one seal shim forming a gap between pistons of the lid and respective ones of the chips; and thermal interface material within the gap and contacting the pistons of the lid and respective ones of the chips.Type: ApplicationFiled: June 7, 2012Publication date: September 27, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Martin M. BEAUMIER, Steven P. OSTRANDER, Kamal K. SIKKA, Hilton T. TOY, Jeffrey A. ZITZ
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Publication number: 20120196408Abstract: A multi-chip electronic package and methods of manufacture are provided. The multi-chip package includes a plurality of chips mounted on a chip carrier. The multi-chip package further includes a lid mounted on the chip carrier using a bonding material or compression seal, and at least one single piston extending from the lid. Each piston covers an entirety of multiple chips of the plurality of chips.Type: ApplicationFiled: March 29, 2012Publication date: August 2, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Suresh D. KADAKIA, Kamal K. SIKKA, Hilton T. TOY, Jeffrey A. ZITZ
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Patent number: 8232636Abstract: A frontside of a chip is bonded to a top surface of a chip carrier. Seal material is dispensed at a periphery of the top surface of the chip carrier. A solder TIM having a first side and a second side is provided. The first side of the TIM contacts a backside of the chip. A reflow is performed to melt the TIM. The second side of the TIM is bonded to a lid. The seal material is cured. The lid is attached to the top surface of the chip carrier. Backfill material is injected into a space between the top surface of the chip carrier and the lid. The backfill material abuts sides of the TIM. The backfill material is cured. TIM solder cracking and associated thermal degradation are mitigated.Type: GrantFiled: January 26, 2010Date of Patent: July 31, 2012Assignee: International Business Machines CorporationInventors: James N Humenik, Sushumna Iruvanti, Richard Langlois, Hsichang Liu, Govindarajan Natarajan, Kamal K Sikka, Hilton T Toy, Jiantao Zheng, Gregg B Monjeau, Mark Kapfhammer
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Publication number: 20120080784Abstract: A multi-chip electronic package and methods of manufacture are provided. The multi-chip package includes a plurality of chips mounted on a chip carrier. The multi-chip package further includes a lid mounted on the chip carrier using a bonding material or compression seal, and at least one single piston extending from the lid. Each piston covers an entirety of multiple chips of the plurality of chips.Type: ApplicationFiled: October 5, 2010Publication date: April 5, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: SURESH D. KADAKIA, Kamal K. Sikka, Hilton T. Toy, Jeffrey A. Zitz
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Publication number: 20120039046Abstract: A multi-chip electronic package and methods of manufacture are provided. The method includes contacting pistons of a lid with respective ones of chips on a chip carrier. The method further includes separating the lid and the chip carrier and placing at least one seal shim on one of the lid and chip carrier. The at least one seal shim has a thickness that results in a gap between the pistons with the respective ones of the chips on the chip carrier. The method further includes dispensing thermal interface material within the gap and in contact with the chips. The method further includes sealing the lid to the chip carrier with the at least one seal shim between the lid and the chip carrier.Type: ApplicationFiled: August 16, 2010Publication date: February 16, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Martin M. BEAUMIER, Steven P. OSTRANDER, Kamal K. SIKKA, Hilton T. TOY, Jeffrey A. ZITZ
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Patent number: 8037594Abstract: Disclosed are thermally conductive plates. Each plate is configured such that a uniform adhesive-filled gap may be achieved between the plate and a heat generating structure when the plate is bonded to the heat generating structure and subjected to a temperature within a predetermined temperature range that causes the heat generating structure to warp. Additionally, this disclosure presents the associated methods of forming the plates and of bonding the plates to a heat generating structure. In one embodiment the plate is curved and modeled to match the curved surface of a heat generating structure within the predetermined temperature range. In another embodiment the plate is a multi-layer conductive structure that is configured to undergo the same warpage under a thermal load as the heat generating structure. Thus, when the plate is bonded with the heat generating structure it is able to achieve and maintain a uniform adhesive-filled gap at any temperature.Type: GrantFiled: May 7, 2008Date of Patent: October 18, 2011Assignee: International Business Machines CorporationInventors: Jeffrey T. Coffin, Michael A. Gaynes, David L. Questad, Kamal K. Sikka, Hilton T. Toy, Jamil A. Wakil
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Patent number: 8021925Abstract: A semiconductor module structure and a method of forming the semiconductor module structure are disclosed. The structure incorporates a die mounted on a substrate and covered by a lid. A thermal compound is disposed within a thermal gap between the die and the lid. A barrier around the periphery of the die extends between the lid and the substrate, contains the thermal compound, and flexes in response to expansion and contraction of both the substrate and the lid during cycling of the semiconductor module. More particularly, either the barrier is formed of a flexible material or has a flexible connection to the substrate and/or to the lid. The barrier effectively contains the thermal compound between the die and the lid and, thereby, provides acceptable and controlled coverage of the thermal compound over the die for heat removal.Type: GrantFiled: December 13, 2007Date of Patent: September 20, 2011Assignee: International Business Machines CorporationInventors: David L. Edwards, Sushumna Iruvanti, Hilton T. Toy, Wei Zou