Patents by Inventor Hing Chan

Hing Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070283131
    Abstract: To provide for the processing of priority data elements between a host processor and a co-processor that exchange such data elements using a queue, the host processor determines a priority of a data element received from an application. If the priority is higher than a lowest possible priority value, at least one lower priority data element within the queue may be identified and modified thereby temporarily removing it from the queue. When the priority data element is written into the queue a query packet is included that will cause the co-processor to return information regarding a last executed queued data element. Based on the returned information, the host processor can determine one or more unmodified data elements (uniquely corresponding to the one or more modified queued data elements) to be written into the queue in accordance with a sequence of the previously modified queued data elements.
    Type: Application
    Filed: January 30, 2006
    Publication date: December 6, 2007
    Applicant: ATI Technologies Inc.
    Inventors: Serguei Sagalovitch, Hing Chan, Alexei Yurin
  • Publication number: 20050081115
    Abstract: A circuit monitors and resets a co-processor. The circuit includes a hang detector module for detecting a hang in co-processor. The circuit also includes a selective processor reset module for resetting the co-processor without resetting a processor in response to detecting a hang in the co-processor.
    Type: Application
    Filed: September 26, 2003
    Publication date: April 14, 2005
    Applicant: ATI Technologies, Inc.
    Inventors: Jeffrey Cheng, Hing Chan, Yinan Jiang
  • Publication number: 20020074159
    Abstract: A silicon standoff acts as a shim during reflow between a module and a printed circuit board. The silicon standoff is attached to a flexible circuit. A ball grid array interposes the connection pads of the module and the printed circuit board. The height of the standoff is determined based on the amount of ball collapse that is desired. During reflow, the silicon standoff will not collapse, therefore the ball grid array can only collapse as far as the standoff allows before contacting the printed circuit board.
    Type: Application
    Filed: December 15, 2000
    Publication date: June 20, 2002
    Inventors: Kendra Gallup, Brian H. Kim, Hing Chan
  • Patent number: 4915605
    Abstract: A method of consolidating metal powders selected from the group consisting essentially of aluminum, aluminum alloys, and aluminum metal matrix composites includes: pressing the powder into a preform, and preheating the preform to elevated temperatures; providing a bed of flowable pressure transmitting particles; positioning the preform in such relation to the bed that the particles encompass the preform; and pressurizing the bed to compress the particles and cause pressure transmission via the particles to the preform, thereby to consolidate the body into desired shape. Typically, the metal powder has surface oxide, and such pressurizing is carried out to break up, partially or fully, the surface oxide.
    Type: Grant
    Filed: May 11, 1989
    Date of Patent: April 10, 1990
    Assignee: Ceracon, Inc.
    Inventors: Hing Chan, Brian L. Oslin, Raymond L. Anderson