Patents by Inventor Hiroaki Arita

Hiroaki Arita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11859058
    Abstract: Provided is a method for producing resin particles by melt-kneading with a non-water-soluble resin in a wide range of melt-kneading temperature according to the melting point or glass transition temperature of the resin. This production method includes melt-kneading a water-soluble matrix, containing a modified polyvinyl alcohol-based resin, and a non-water-soluble resin to form a pre-molded article in which the non-water-soluble resin is dispersed in particulate; and bringing the pre-molded article into contact with an aqueous solvent to elute the matrix. The modified polyvinyl alcohol-based resin contains in a side chain thereof an alkyl group including at least one hydroxyl group (for example, a 1,2-dihydroxyalkyl group).
    Type: Grant
    Filed: June 6, 2018
    Date of Patent: January 2, 2024
    Assignee: DAICEL-EVONIK LTD.
    Inventors: Mitsuteru Mutsuda, Yoshiki Nakaie, Hiroaki Arita
  • Patent number: 11066529
    Abstract: Provided are: a water-soluble matrix whose melt-kneading temperature can be adjusted according to the melting point or glass transition temperature of a resin; a pre-molded article in which resin particles are dispersed in the water-soluble matrix; and a method for producing resin particles. This production method includes melt-kneading a water-soluble matrix containing a modified polyvinyl alcohol-based resin and a water-soluble saccharide at a weight ratio of the former/the latter=from 99/1 to 50/50 and a thermoplastic resin, and bringing the pre-molded article in which the resin particles are dispersed into contact with an aqueous solvent to elute the matrix. The modified polyvinyl alcohol-based resin contains in a side chain thereof an alkyl group including at least one hydroxyl group (for example, a 1,2-dihydroxyalkyl group).
    Type: Grant
    Filed: June 6, 2018
    Date of Patent: July 20, 2021
    Assignee: DAICEL-EVONIK LTD.
    Inventors: Mitsuteru Mutsuda, Yoshiki Nakaie, Hiroaki Arita
  • Patent number: 10750815
    Abstract: A sheet for forming a shoe sole, useful for efficiently joining a crosslinked rubber layer as a stud and a thermoplastic elastomer layer as a sole, is provided. The sheet comprises a resin component (A) containing a polyamide resin (a) and having an amino group concentration of not less than 10 mmol/kg and a flexural modulus of not less than 300 MPa in accordance with ISO178. The polyamide resin (a) may contain a polyamide resin having a melting point of not less than 165° C. at a predetermined concentration (e.g., not less than 30% by weight) in the total polyamide resin (a).
    Type: Grant
    Filed: March 11, 2011
    Date of Patent: August 25, 2020
    Assignee: DAICEL-EVONIK LTD.
    Inventors: Mitsuteru Mutsuda, Hiroaki Arita, Tomohiro Kawahara
  • Publication number: 20200207931
    Abstract: Provided are: a water-soluble matrix whose melt-kneading temperature can be adjusted according to the melting point or glass transition temperature of a resin; a pre-molded article in which resin particles are dispersed in the water-soluble matrix; and a method for producing resin particles. This production method includes melt-kneading a water-soluble matrix containing a modified polyvinyl alcohol-based resin and a water-soluble saccharide at a weight ratio of the former/the latter=from 99/1 to 50/50 and a thermoplastic resin, and bringing the pre-molded article in which the resin particles are dispersed into contact with an aqueous solvent to elute the matrix. The modified polyvinyl alcohol-based resin contains in a side chain thereof an alkyl group including at least one hydroxyl group (for example, a 1,2-dihydroxyalkyl group).
    Type: Application
    Filed: June 6, 2018
    Publication date: July 2, 2020
    Applicant: DAICEL-EVONIK LTD.
    Inventors: Mitsuteru MUTSUDA, Yoshiki NAKAIE, Hiroaki ARITA
  • Publication number: 20200079916
    Abstract: Provided is a method for producing resin particles by melt-kneading with a non-water-soluble resin in a wide range of melt-kneading temperature according to the melting point or glass transition temperature of the resin. This production method includes melt-kneading a water-soluble matrix, containing a modified polyvinyl alcohol-based resin, and a non-water-soluble resin to form a pre-molded article in which the non-water-soluble resin is dispersed in particulate; and bringing the pre-molded article into contact with an aqueous solvent to elute the matrix. The modified polyvinyl alcohol-based resin contains in a side chain thereof an alkyl group including at least one hydroxyl group (for example, a 1,2-dihydroxyalkyl group).
    Type: Application
    Filed: June 6, 2018
    Publication date: March 12, 2020
    Applicant: DAICEL-EVONIK LTD.
    Inventors: Mitsuteru MUTSUDA, Yoshiki NAKAIE, Hiroaki ARITA
  • Patent number: 9513313
    Abstract: A method for inspecting an electronic device, in which inspection of electrical characteristics is carried out, uses conduction to pass a current to an electronic device while the electronic device is being continuously conveyed.
    Type: Grant
    Filed: May 23, 2012
    Date of Patent: December 6, 2016
    Assignee: KONICA MINOLTA, INC.
    Inventors: Hiroaki Arita, Osamu Masuda
  • Patent number: 9385571
    Abstract: A stator member may comprise a core member comprising a plurality of cores disposed juxtaposed to one another, a coil being wound around each of the cores and a terminal member attached to one end of the core member. The terminal member may comprise a terminal portion comprising three external terminal portions used as terminals of U, V, and W phase and a common terminal portion used as a common terminal. The three external terminal portions and the common terminal may be integrally provided. A plurality of fitting portions may protrude from the terminal portion toward the core member. Each of the plurality of fitting portions may be configured to be fitted into a corresponding one of a plurality of recessed portions formed at the one end of the core member in an elastic deformed state.
    Type: Grant
    Filed: June 11, 2013
    Date of Patent: July 5, 2016
    Assignee: AISAN KOGYO KABUSHIKI KAISHA
    Inventors: Yoshihiko Honda, Hiroaki Arita, Yoichi Kawakita
  • Patent number: 9263677
    Abstract: A method for manufacturing a transparent gas barrier film for an organic electroluminescence element having a substrate with a gas barrier layer thereon. The gas barrier layer is formed on the substrate by plasma CVD using an organic silicon compound as a raw material gas and an oxygen gas as a decomposition gas. Formation of the gas barrier layer is carried out so that a carbon content of the gas barrier layer in the thickness direction repeatedly changes more than two times from high value, via intermediate value, low value and intermediate value, to high value.
    Type: Grant
    Filed: November 22, 2013
    Date of Patent: February 16, 2016
    Assignee: Konica Minolta Holdings, Inc.
    Inventors: Kazuhiro Fukuda, Toshio Tsuji, Chikao Mamiya, Hiroaki Arita
  • Patent number: 9127186
    Abstract: A film sealant useful for tightly sealing an electric device at a low temperature and a sealing method of using the sealant are provided. The device is covered and sealed by covering at least a region of the device with a film sealant containing a copolyamide-series resin, heat-melting the sealant, and cooling the sealant. The copolyamide-series resin may have a melting point or softening point of 75 to 160° C. and may be a crystalline resin. The copolyamide-series resin may be a multiple copolymer or may contain a unit derived from a long-chain component having a C8-16alkylene group (e.g., a C9-17lactam and an aminoC9-17alkanecarboxylic acid). The film sealant may cover one side of the device.
    Type: Grant
    Filed: September 21, 2011
    Date of Patent: September 8, 2015
    Assignee: DAICEL-EVONIK LTD.
    Inventors: Hiroaki Arita, Yoshiki Nakaie, Taiji Yamabe
  • Publication number: 20150024224
    Abstract: A paste sealant capable of shortening sealing and molding cycles in spite of containing an aqueous medium and a sealing method of using the sealant are provided. The paste sealant for molding and sealing a device comprises a copolyamide-series resin and an aqueous medium. The copolyamide-series resin may be a crystalline resin. The copolyamide-series resin may have a melting point or softening point of 75 to 160° C. The copolyamide-series resin may be a multiple copolymer, e.g., a binary or ternary copolymer. Further, the copolyamide-series resin may contain a unit derived from a long-chain component having a C8-16alkylene group (at least one component selected from the group consisting of a C9-17lactam and an aminoC9-17alkanecarboxylic acid). The paste sealant may further contain a thickener [e.g., a (meth)acrylic polymer].
    Type: Application
    Filed: March 8, 2013
    Publication date: January 22, 2015
    Inventors: Hiroaki Arita, Yoshiki Nakaie, Mitsuteru Mutsuda
  • Publication number: 20150024130
    Abstract: A sealant capable of tightly sealing an electric device at a low temperature and a sealing method of using the sealant are provided. The sealant for sealing a device comprises a copolyamide-series resin powder having a particle diameter of not more than 1 mm. The copolyamide-series resin powder contains at least a fine particle (e.g., a copolyamide-series resin particle having an average particle diameter of 20 to 400 ?m), or may contain the fine particle in combination with a coarse particle (e.g., a copolyamide-series resin particle having an average particle diameter of 450 to 800 ?m). The copolyamide-series resin may be a crystalline resin. The copolyamide-series resin may have a melting point or softening point of 75 to 160° C. The copolyamide-series resin may be, e.g., a binary or ternary copolymer.
    Type: Application
    Filed: February 8, 2013
    Publication date: January 22, 2015
    Applicant: Daicel-Evonik Ltd.
    Inventors: Hiroaki Arita, Yoshiki Nakaie, Mitsuteru Mutsuda
  • Publication number: 20140255288
    Abstract: A gas barrier laminate comprising a substrate having thereon at least a gas barrier layer and a polymer layer, wherein at least one polymer layer is provided adjacent to at least one gas barrier layer; and an average carbon content of the polymer layer at a contact interface between the gas barrier layer is lower than an average carbon content in the polymer layer.
    Type: Application
    Filed: May 5, 2014
    Publication date: September 11, 2014
    Applicant: KONICA MINOLTA, INC.
    Inventors: Hiroaki ARITA, Toshio TSUJI, Chikao MAMIYA, Kazuhiro FUKUDA
  • Publication number: 20140170423
    Abstract: A transparent gas barrier film comprising a substrate having thereon a gas barrier layer comprising at least a low density layer and a high density layer, wherein one or more intermediate density layers are sandwiched between the low density layer and the high density layer.
    Type: Application
    Filed: November 22, 2013
    Publication date: June 19, 2014
    Applicant: KONICA MINOLTA HOLDINGS, INC.
    Inventors: Kazuhiro FUKUDA, Toshio Tsuji, Chikao Mamiya, Hiroaki Arita
  • Patent number: 8748003
    Abstract: A gas barrier laminate comprising a substrate having thereon at least a gas barrier layer and a polymer layer, wherein at least one polymer layer is provided adjacent to at least one gas barrier layer; and an average carbon content of the polymer layer at a contact interface between the gas barrier layer is lower than an average carbon content in the polymer layer.
    Type: Grant
    Filed: August 30, 2005
    Date of Patent: June 10, 2014
    Assignee: Konica Minolta Holdings, Inc.
    Inventors: Hiroaki Arita, Toshio Tsuji, Chikao Mamiya, Kazuhiro Fukuda
  • Publication number: 20140139253
    Abstract: A method for inspecting an electronic device, in which inspection of electrical characteristics is carried out, uses conduction to pass a current to an electronic device while the electronic device is being continuously conveyed.
    Type: Application
    Filed: May 23, 2012
    Publication date: May 22, 2014
    Applicant: KONICA MINOLTA, INC.
    Inventors: Hiroaki Arita, Osamu Masuda
  • Patent number: 8652625
    Abstract: A transparent gas barrier film comprising a substrate having thereon a gas barrier layer comprising at least a low density layer and a high density layer, wherein one or more intermediate density layers are sandwiched between the low density layer and the high density layer.
    Type: Grant
    Filed: September 7, 2005
    Date of Patent: February 18, 2014
    Assignee: Konica Minolta Holdings, Inc.
    Inventors: Kazuhiro Fukuda, Toshio Tsuji, Chikao Mamiya, Hiroaki Arita
  • Publication number: 20130336817
    Abstract: A stator member may comprise a core member comprising a plurality of cores disposed juxtaposed to one another, a coil being wound around each of the cores and a terminal member attached to one end of the core member. The terminal member may comprise a terminal portion comprising three external terminal portions used as terminals of U, V, and W phase and a common terminal portion used as a common terminal. The three external terminal portions and the common terminal may be integrally provided. A plurality of fitting portions may protrude from the terminal portion toward the core member. Each of the plurality of fitting portions may be configured to be fitted into a corresponding one of a plurality of recessed portions formed at the one end of the core member in an elastic deformed state.
    Type: Application
    Filed: June 11, 2013
    Publication date: December 19, 2013
    Inventors: Yoshihiko Honda, Hiroaki Arita, Yoichi Kawakita
  • Publication number: 20130318835
    Abstract: A sheet for forming a shoe sole, useful for efficiently joining a crosslinked rubber layer as a stud and a thermoplastic elastomer layer as a sole, is provided. The sheet comprises a resin component (A) containing a polyamide resin (a) and having an amino group concentration of not less than 10 mmol/kg and a flexural modulus of not less than 300 MPa in accordance with ISO178. The polyamide resin (a) may contain a polyamide resin having a melting point of not less than 165° C. at a predetermined concentration (e.g., not less than 30% by weight) in the total polyamide resin (a).
    Type: Application
    Filed: March 11, 2011
    Publication date: December 5, 2013
    Applicant: DAICEL-EVONIK LTD.
    Inventors: Mitsuteru Mutsuda, Hiroaki Arita, Tomohiro Kawahara
  • Patent number: 8486487
    Abstract: A gas barrier film comprising a resin substrate provided thereon at least one layer of a ceramic film, wherein the density ratio Y (=?f/?b) satisfies 1?Y?0.95 and the ceramic film has a residual stress being a compression stress of 0.01 MPa or more and 100 Mpa or less, wherein ?f is the density of the ceramic film and ?b is the density of a comparative ceramic film being formed by thermal oxidation or thermal nitridation of a metal as a mother material of the ceramic film so as to being the same composition ratio of the ceramic film.
    Type: Grant
    Filed: August 19, 2011
    Date of Patent: July 16, 2013
    Assignee: Konica Minolta Holdings, Inc.
    Inventors: Kazuhiro Fukuda, Chikao Mamiya, Hiroaki Arita
  • Publication number: 20130177704
    Abstract: A sealant capable of tightly sealing an electric device at a low temperature and a sealing method of using the sealant are provided. The sealant for molding and sealing a device comprises a copolyamide-series resin powder. The copolyamide-series resin may be a crystalline resin. The copolyamide-series resin may have a melting point or softening point of 75 to 160° C. The copolyamide-series resin may be a multiple copolymer, e.g., a binary or ternary copolymer. Further, the copolyamide-series resin may contain a unit derived from a long-chain component having a C8-16alkylene group (at least one component selected from the group consisting of a C9-17lactam and an aminoC9-17alkanecarboxylic acid).
    Type: Application
    Filed: September 21, 2011
    Publication date: July 11, 2013
    Applicant: DAICEL-EVONIK LTD.
    Inventors: Hiroaki Arita, Yoshiki Nakaie, Mitsuteru Mutsuda