Abstract: In a molded composite article formed by directly bonding a resin member comprising a polyamide-series resin to a resin member comprising a thermoplastic polyurethane-series resin, the polyamide-series resin comprises a polyamide block copolymer containing (A) a polyether segment having at least one terminal imino group. The polyamide-series resin may comprise a polyamide-series resin having a free amino group in a concentration of not less than about 10 mmol/kg. The molded composite article is producible, for example, by heating at least one of the polyamide-series resin and the thermoplastic polyurethane-series resin to bond the former to the latter. Thus obtained molded composite article is suitable for a member of a shoe and an industrial roll. In such a process, the polyamide-series resin member and the thermoplastic polyurethane-series resin member both of which are different in nature from each other can be directly and firmly bonded together.

Abstract: In a molded composite article, a resin member comprising a non-urethane-series thermoplastic resin and a resin member comprising a thermoplastic polyurethane-series resin are directly joined with each other; and the non-urethane-series thermoplastic resin is a non-urethane-series thermoplastic resin (Ib) or (IIb), and the non-urethane-series thermoplastic resin and the thermoplastic polyurethane-series resin fulfill a following requirement (Ia) or (IIa), (Ia): the non-urethane-series thermoplastic resin (Ib) comprises at least one member selected from the group consisting of a polyamide component having an alicyclic ring, and an amino group-containing compound, or (IIa): each of the non-urethane-series thermoplastic resin (IIb) and the thermoplastic polyurethane-series resin has a polyether segment. The resin composition (Ib) may be a resin composition (Ib-2) containing a non-urethane-series thermoplastic resin and the amino group-containing compound.

Abstract: It is an object of the present invention to provide an organic thin-film transistor exhibiting high carrier mobility and a manufacturing method thereof. Disclosed is an organic thin-film transistor prossessing a film having a contact angle against pure water of a surface of not less than 50°, wherein an organic semiconductor layer is formed on the film prepared by a CVD (chemical vapor deposition) method employing a reactive gas.

Abstract: In a molded composite article formed by directly joining a resin member comprising a polyamide-series resin to a resin member comprising a thermoplastic polyurethane-series resin, as the polyamide-series resin, a polyamide-series resin having an amino group of not less than 10 mmol/kg is used. The molded composite article may be produced by heating at least any one of the polyamide-series resin and the thermoplastic polyurethane-series resin to join to the other resin.

Abstract: A thermoplastic resin composition material 1 includes a resin portion (a) 2 made of a thermoplastic resin (A); elastomer portions (b) 3 made of a thermoplastic elastomer (B) having substantially no compatibility with the thermoplastic resin (A) and having a glass transition temperature of lower than or equal to ?40° C.; and polymer portions (c) 4 made of a high polymer (C) having substantially no compatibility with the thermoplastic resin (A) and the thermoplastic elastomer (B), having a glass transition temperature or crystallization temperature of lower than or equal to ?50° C., and having a viscosity at 40° C. of 0.1 to 200000 cP. The material has a structure in which the elastomer portions (b) 3 are dispersed in the resin portion (a) 2, and the polymer portions (c) 4 are dispersed in the elastomer portions (b) 3. Accordingly, low-temperature impact resistance can significantly be improved without deterioration in the other inherent excellent physical properties of the thermoplastic resin.

Abstract: A thin film forming method, wherein a discharge gas is introduced into a discharge space to be excited under an atmospheric or approximately atmospheric pressure, a thin film forming gas containing an orgenometallic compound with an organic group containing a fluorine atom being brought into contact with said excited discharge gas outside the discharge space to be converted into an indirectly excited gas, and a substrate is exposed to said indirectly excited gas to form a thin film on said substrate, and a thin film formed substance formed by the same.

Abstract: A resin composition of the invention includes a thermoplastic elastomer and a glycol or its derivative. Polyamide- or polyester-based thermoplastic elastomers, for example, can be used as the thermoplastic elastomer. The soft segment of the thermoplastic elastomer may be composed of a polyether or polyester. As the glycol or its derivative, for example, a compound represented by the following Formula (1): R1O&Parenopenst;A1—O&Parenclosest;l&Parenopenst;A2—O&Parenclosest;m&Parenopenst;A3—O&Parenclosest;nR2  (1) (wherein each of R1 and R2 is, identical to or different from each other, a hydrogen atom, an alkyl group or an acyl group; each of A1, A2 and A3 is, identical to or different from one another, an alkylene group having 2 or more carbon atoms; each of l, m and n is, identical to or different from one another, an integer of 0 or more, where l+m+n>0) can be used.

Abstract: A thermoplastic resin composition material 1 includes a resin portion (a) 2 made of a thermoplastic resin (A); elastomer portions (b) 3 made of a thermoplastic elastomer (B) having substantially no compatibility with the thermoplastic resin (A) and having a glass transition temperature of lower than or equal to −40° C.; and polymer portions (c) 4 made of a high polymer (C) having substantially no compatibility with the thermoplastic resin (A) and the thermoplastic elastomer (B), having a glass transition temperature or crystallization temperature of lower than or equal to −50° C., and having a viscosity at 40° C. of 0.1 to 200000 cP. The material has a structure in which the elastomer portions (b) 3 are dispersed in the resin portion (a) 2, and the polymer portions (c) 4 are dispersed in the elastomer portions (b) 3.

Abstract: A polymer comprising an anionic group (e.g. an acid anhydride group, a carboxyl group) and a hydrophilic segment (e.g. a polyoxyalkylene ether unit) is used as a cement retarder. The polymer is obtainable by copolymerization of a monomer including maleic anhydride with a monomer including a vinylalkyl ether-series monomer in which an alkylene oxide is added to allyl alcohol. The polymer may be a copolymer copolymerized with other monomers such as styrene. Use of this cement retarder can provide patterns or washing-finished face on the surface of a concrete product. The cement retarder is suitable for application for a cement retardative sheet.

Abstract: A polymer comprising an anionic group (e.g. an acid anhydride group, a carboxyl group) and a hydro-philic segment (e.g. a polyoxyalkylene ether unit) is used as a cement retarder. The polymer is obtainable by copolymerization of a monomer including maleic anhydride with a monomer including a vinylalkyl ether-series monomer in which an alkylene oxide is added to allyl alcohol. The polymer may be a copolymer copolymerized with other monomers such as styrene. Use of this cement retarder can provide patterns or washing-finished face on the surface of a concrete product. The cement retarder is suitable for application for a cement retardative sheet.

Abstract: A composite member is obtained which includes a thermoplastic resin and a rubber directly and firmly adhering to each other. A composite member is obtained by adhering a molded element of a thermoplastic resin including a homo- or co-polymer of a vinyl cyanide including acrylonitrile, and a rubber molded element constituting a rubber composition containing a vinyl cyanide as a comonomer by means of heating. The resin molded element may be formed from, for example, AS resin, ABS resin or an polymer alloy containing ABS resin. The rubber molded element may be composed of a vulcanizable rubber composition containing NBR or another rubber. Both the molded elements can adhere to each other by contacting the resin molded element with the rubber molded element closely and heating at least either the resin molded element or the rubber molded element by means of melting, vulcanization or the like.