Patents by Inventor Hiroaki Ichikawa

Hiroaki Ichikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210143093
    Abstract: A semiconductor device having an arm block. The arm block includes a first circuit pattern that, in a plan view of the semiconductor device, has a recess formed thereon that extends inward from a side thereof, the recess forming a disposition area of the semiconductor device, a second circuit pattern having at least a part disposed in the disposition area, and a plurality of semiconductor chips formed on the first circuit pattern. Each semiconductor chip has a positive electrode on a back surface thereof, and a control electrode and a negative electrode on a front surface thereof, the negative electrode being electrically connected to the second circuit pattern by a wiring member.
    Type: Application
    Filed: January 22, 2021
    Publication date: May 13, 2021
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventor: Hiroaki ICHIKAWA
  • Publication number: 20210143132
    Abstract: A semiconductor device, having a first semiconductor chip including a first side portion at a front surface thereof and a first control electrode formed in the first side portion, a second semiconductor chip including a second side portion at a front surface thereof and a second control electrode formed in the second side portion, a first circuit pattern, on which the first semiconductor chip and the second semiconductor chip are disposed, a second circuit pattern, and a first control wire electrically connecting the first control electrode, the second control electrode, and the second circuit pattern. The first side portion and the second side portion are aligned. The first control electrode and the second control electrode are aligned. The second circuit pattern are aligned with the first control electrode and the second control electrode.
    Type: Application
    Filed: January 21, 2021
    Publication date: May 13, 2021
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventors: Mitsuhiro KAKEFU, Hiroaki ICHIKAWA
  • Publication number: 20210060186
    Abstract: Provided are a compound represented by the following formula (1): wherein X1 represents a hydrogen atom or a halogen atom, X2 represents a fluorine atom or a nitrile group, and X3 represents a radioactive halogen atom, or a salt thereof, and a medicament including the same.
    Type: Application
    Filed: December 20, 2018
    Publication date: March 4, 2021
    Applicants: Nihon Medi-Physics Co., Ltd., National Hospital Organization
    Inventors: Akihiro IZAWA, Yuki OKUMURA, Yurie FUKUI, Hiroaki ICHIKAWA, Yoshifumi MAYA, Miho IKENAGA, Hiroyuki OKUDAIRA, Yoshihiro DOI, Mitsuhide NARUSE
  • Publication number: 20200395343
    Abstract: A semiconductor device, having a first semiconductor chip including a first side portion at a front surface thereof and a first control electrode formed in the first side portion, a second semiconductor chip including a second side portion at a front surface thereof and a second control electrode formed in the second side portion, a first circuit pattern, on which the first semiconductor chip and the second semiconductor chip are disposed, a second circuit pattern, and a first control wire electrically connecting the first control electrode, the second control electrode, and the second circuit pattern. The first side portion and the second side portion are aligned. The first control electrode and the second control electrode are aligned. The second circuit pattern are aligned with the first control electrode and the second control electrode.
    Type: Application
    Filed: August 27, 2020
    Publication date: December 17, 2020
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventors: Mitsuhiro KAKEFU, Hiroaki ICHIKAWA
  • Patent number: 10672762
    Abstract: A semiconductor device is provided to reduce thermal fatigue in a junction portion of an external wiring to enhance long-term reliability, where the semiconductor device includes a semiconductor substrate, a transistor portion and a diode portion that are alternately arranged along a first direction parallel to a front surface of the semiconductor substrate inside the semiconductor substrate, a surface electrode that is provided above the transistor portion and the diode portion and that is electrically connected to the transistor portion and the diode portion, an external wiring that is joined to the surface electrode and that has a contact width with the surface electrode in the first direction, the contact width being larger than at least one of a width of the transistor portion in the first direction and a width of the diode portion in the first direction.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: June 2, 2020
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Akio Yamano, Aiko Takasaki, Hiroaki Ichikawa
  • Publication number: 20200121811
    Abstract: Provided is a method for producing a radiohalogen-labeled compound, the method comprises: a step in which a radiohalogen-labeling precursor compound (S-L) having a leaving group (L) capable of being nucleophilically substituted by a radioactive halide ion (X?) is subjected to a radiohalogenation reaction to obtain a reaction mixture RM1 which contains the radiohalogen-labeling precursor compound (S-L) and a reaction product (S—X) resulting from the radiohalogenation reaction; a step in which the reaction mixture RM1 is mixed with a polyvalent acid or a salt thereof to obtain a reaction mixture RM2; and a step in which the reaction product (S—X) is purified from the reaction mixture RM2 by a solid phase extraction method.
    Type: Application
    Filed: May 28, 2018
    Publication date: April 23, 2020
    Applicant: NIHON MEDI-PHYSICS CO., LTD.
    Inventors: Yuki OKUMURA, Daisaku NAKAMURA, Masato KIRIU, Hiroaki ICHIKAWA, Gota TONOYA, Naomi SUGIMOTO
  • Publication number: 20200009273
    Abstract: There is provided a labeling precursor compound represented by the general formula (2): wherein S represents a substrate, L represents a straight alkyl group having 1 to 6 carbon atoms which may contain an ether group, R1 and R2 each independently represent a straight or branched alkyl group having 1 to 30 carbon atoms, or a substituted or unsubstituted monocyclic or condensed polycyclic aryl group, R3 each independently represent an alkyl group having 1 to 4 carbon atoms or an alkoxy group having 1 to 4 carbon atoms, and p represents an integer of 0 to 4.
    Type: Application
    Filed: March 5, 2018
    Publication date: January 9, 2020
    Applicants: NIHON MEDI-PHYSICS CO., LTD., TOKYO INSTITUTE OF TECHNOLOGY
    Inventors: Masato KIRIU, Hiroaki ICHIKAWA, Yuki OKUMURA, Hiroshi TANAKA
  • Publication number: 20190287964
    Abstract: A semiconductor device is provided to reduce thermal fatigue in a junction portion of an external wiring to enhance long-term reliability, where the semiconductor device includes a semiconductor substrate, a transistor portion and a diode portion that are alternately arranged along a first direction parallel to a front surface of the semiconductor substrate inside the semiconductor substrate, a surface electrode that is provided above the transistor portion and the diode portion and that is electrically connected to the transistor portion and the diode portion, an external wiring that is joined to the surface electrode and that has a contact width with the surface electrode in the first direction, the contact width being larger than at least one of a width of the transistor portion in the first direction and a width of the diode portion in the first direction.
    Type: Application
    Filed: June 3, 2019
    Publication date: September 19, 2019
    Inventors: Akio YAMANO, Aiko TAKASAKI, Hiroaki ICHIKAWA
  • Patent number: 10058373
    Abstract: A treatment instrument includes a treatment body that includes a treatment surface provided in the first clamp surface, the treatment surface protruding toward the second clamp surface in response to the supply of heat energy and increasing pressure on the living tissue to treat the living tissue in cooperation with the action of the heat energy.
    Type: Grant
    Filed: January 19, 2017
    Date of Patent: August 28, 2018
    Assignee: OLYMPUS CORPORATION
    Inventors: Tomoyuki Takashino, Hiroaki Ichikawa, Yusuke Takei, Kazuhiro Tanaka
  • Patent number: 9967991
    Abstract: A semiconductor device, including a plurality of semiconductor modules, each including a semiconductor element, a main terminal and a wiring portion that connects the semiconductor element and the main terminal, and at least one busbar that each includes a terminal portion, and a plurality of attachment portions, the attachment portions being respectively connected to the main terminals of the semiconductor modules, such that the at least one busbar connects the semiconductor modules in parallel. The largest resistance among all resistances between the terminal portion and each of the attachment portions in each busbar is 10% or less of a resistance of the wiring portion in each semiconductor module. The largest inductance among all inductances between the terminal portion and each of the attachment portions in each busbar is 10% or less of an inductance of the wiring portion in each semiconductor module.
    Type: Grant
    Filed: October 7, 2016
    Date of Patent: May 8, 2018
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Hiroaki Ichikawa
  • Patent number: 9871465
    Abstract: A semiconductor device can include an insulating substrate on which at least four semiconductor elements forming a three-level power conversion circuit are mounted, a base plate on which the insulating substrate is provided, a positive conductor plate with a positive DC potential which is connected to one semiconductor element among the semiconductor elements; a negative conductor plate with a negative DC potential which is connected to another semiconductor element among the semiconductor elements and an intermediate potential conductor plate with an intermediate potential which is connected to the remaining two semiconductor elements among the semiconductor elements. The positive conductor plate, the negative conductor plate, and the intermediate potential conductor plate are provided on the base plate. The positive conductor plate and the negative conductor plate are arranged close to the intermediate potential conductor plate so as to face the intermediate potential conductor plate.
    Type: Grant
    Filed: June 4, 2015
    Date of Patent: January 16, 2018
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Shuangching Chen, Hiroaki Ichikawa
  • Publication number: 20170298378
    Abstract: It is intended to provide a gene capable of conferring more practical environmental stress tolerances to a plant and the use thereof. The present invention provides a plant having enhancement in one or two or more genes selected from the group consisting of a second gene selected from a gene group consisting of a first gene subgroup consisting of Os12g0150200 gene, Os01g0858350 gene, Os05g0445100 gene, Os11g0151400 gene, AT3G48520 gene, and AT2G27690 gene, and a gene functionally equivalent to any of these genes and a second gene subgroup consisting of Os04g0584800 gene and a gene functionally equivalent to this gene.
    Type: Application
    Filed: January 5, 2017
    Publication date: October 19, 2017
    Applicants: National University Corporation Nagoya University, National Agriculture and Food Research Organization
    Inventors: Shin Takeda, Tsukaho Hattori, Ken-Ichi Kurotani, Hiroaki Ichikawa
  • Patent number: 9737295
    Abstract: A suture-needle holder includes: a sheath part; a grasping portion; an operation wire; and an operation part body formed to extend along a longitudinal axis, and connected such that the sheath part is movable in a direction aligned with the longitudinal axis and rotatable around the longitudinal axis. A first groove part having a distal end and a proximal end and extending along the longitudinal axis, and a second groove part having one end connected to the proximal end of the first groove part and the other end at a position separated from the one end in the direction aligned with the longitudinal axis and in a circumferential direction of the longitudinal axis, and extending from the one end to the other end are formed in the operation part body.
    Type: Grant
    Filed: December 16, 2016
    Date of Patent: August 22, 2017
    Assignee: OLYMPUS CORPORATION
    Inventors: Hiroaki Ichikawa, Akihiro Shimazu
  • Patent number: 9722598
    Abstract: A semiconductor device, according to one possible configuration, includes switching circuits, each switching circuit comprising IGBT chips connected in series and clamping diodes. The semiconductor device also includes a first and a second wiring line and auxiliary emitter lines. The first wiring line and a first auxiliary emitter line connect the emitter terminals of IGBT chips of the first and second switching circuits. The second wiring line and another auxiliary emitter line connect the emitter terminals of the third IGBT chips of the first and second switching circuits. The wiring lines have a large current carrying capacity and a lower resistance value than their respectively connected auxiliary emitter line.
    Type: Grant
    Filed: July 22, 2015
    Date of Patent: August 1, 2017
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Hiroaki Ichikawa
  • Publication number: 20170128121
    Abstract: A treatment instrument includes a treatment body that includes a treatment surface provided in the first clamp surface, the treatment surface protruding toward the second clamp surface in response to the supply of heat energy and increasing pressure on the living tissue to treat the living tissue in cooperation with the action of the heat energy.
    Type: Application
    Filed: January 19, 2017
    Publication date: May 11, 2017
    Applicant: OLYMPUS CORPORATION
    Inventors: Tomoyuki TAKASHINO, Hiroaki ICHIKAWA, Yusuke TAKEI, Kazuhiro TANAKA
  • Publication number: 20170095249
    Abstract: A suture-needle holder includes: a sheath part; a grasping portion; an operation wire; and an operation part body formed to extend along a longitudinal axis, and connected such that the sheath part is movable in a direction aligned with the longitudinal axis and rotatable around the longitudinal axis. A first groove part having a distal end and a proximal end and extending along the longitudinal axis, and a second groove part having one end connected to the proximal end of the first groove part and the other end at a position separated from the one end in the direction aligned with the longitudinal axis and in a circumferential direction of the longitudinal axis, and extending from the one end to the other end are formed in the operation part body.
    Type: Application
    Filed: December 16, 2016
    Publication date: April 6, 2017
    Applicant: OLYMPUS CORPORATION
    Inventors: Hiroaki ICHIKAWA, Akihiro SHIMAZU
  • Publication number: 20170027074
    Abstract: A semiconductor device, including a plurality of semiconductor modules, each including a semiconductor element, a main terminal and a wiring portion that connects the semiconductor element and the main terminal, and at least one busbar that each includes a terminal portion, and a plurality of attachment portions, the attachment portions being respectively connected to the main terminals of the semiconductor modules, such that the at least one busbar connects the semiconductor modules in parallel. The largest resistance among all resistances between the terminal portion and each of the attachment portions in each busbar is 10% or less of a resistance of the wiring portion in each semiconductor module. The largest inductance among all inductances between the terminal portion and each of the attachment portions in each busbar is 10% or less of an inductance of the wiring portion in each semiconductor module.
    Type: Application
    Filed: October 7, 2016
    Publication date: January 26, 2017
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventor: Hiroaki ICHIKAWA
  • Publication number: 20160157931
    Abstract: A treatment device includes a first energy output portion that is disposed in one of a pair of holding portions and includes first and second operation regions; and a second energy output portion that is disposed in the other holding portion of the pair of holding portions and includes third and fourth operation regions. The first operation region projects toward the second energy output portion more than the second operation region. The third operation region projects toward the first energy output portion more than the fourth operation region. Each of the first and third operation regions includes steps.
    Type: Application
    Filed: February 11, 2016
    Publication date: June 9, 2016
    Applicant: OLYMPUS CORPORATION
    Inventors: Hiroaki ICHIKAWA, Hideyuki KASAHARA, Yusuke OISHI
  • Publication number: 20160072499
    Abstract: A semiconductor device, according to one possible configuration, includes switching circuits, each switching circuit comprising IGBT chips connected in series and clamping diodes. The semiconductor device also includes a first and a second wiring line and auxiliary emitter lines. The first wiring line and a first auxiliary emitter line connect the emitter terminals of IGBT chips of the first and second switching circuits. The second wiring line and another auxiliary emitter line connect the emitter terminals of the third IGBT chips of the first and second switching circuits. The wiring lines have a large current carrying capacity and a lower resistance value than their respectively connected auxiliary emitter line.
    Type: Application
    Filed: July 22, 2015
    Publication date: March 10, 2016
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventor: Hiroaki ICHIKAWA
  • Patent number: D884662
    Type: Grant
    Filed: November 7, 2018
    Date of Patent: May 19, 2020
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Taichi Itoh, Hiroaki Ichikawa, Mitsuhiro Kakefu, Akio Yamano, Takuya Yamamoto