Abstract: An information processing apparatus (1) included in a welding training system includes a transmittance adjuster (14) capable of adjusting a transmittance of a window of a welding helmet in virtual space in multiple grades, and a display controller (17) configured to cause a display of an HMD (2) to display a situation of a welding operation in the virtual space at an illuminance corresponding to the adjusted transmittance. The transmittance adjuster (14) adjusts the transmittance based on a skill level of a trainee determined by a skill level determination unit (13).

Abstract: An image forming apparatus includes a latent image forming device and a visualizing device. The latent image forming device forms a latent image with an adhesive on a base material. The visualizing device causes particles to adhere to the latent image to visualize the latent image as an uneven image. The particles each contains an insoluble substance.

Abstract: A road surface condition estimation device includes a control circuit, an acquisition circuit and an estimation circuit. The control circuit is configured to control a driving device that is able to independently drive a plurality of wheels. The acquisition circuit is configured to acquire detection results of a plurality of wheel speed sensors that detects rotation speeds of the plurality of wheels respectively. The estimation circuit is configured to calculate a slip ratio for each driving wheel, based on a detection result of a first wheel speed sensor and a detection result of a second wheel sensor. The estimation circuit is configured to estimate a friction coefficient for each region on a road surface that corresponds to the driving wheel, based on the slip ratio.

Abstract: There is provided a method for manufacturing Ni wiring. The method includes forming an Ni film on a surface of a substrate having a recess formed thereon by CVD or ALD by using an Ni compound as a film forming material and NH3 gas and H2 gas as reduction gases to partially fill the recess. The method further includes annealing the substrate to make the Ni film on the surface of the substrate and on a side surface of the recess reflow into the recess.

Abstract: The present invention provides a melter that can improve melting efficiency compared to prior arts and an injection apparatus with improved injection efficiency. A melter according to the present invention includes a through hole, one opening of the through hole is an inflow port and the other opening is an outflow port, an inner wall surface of the through hole is formed of an inclined surface so that the opening becomes narrower from the inflow port to the outflow port of the through hole, an opening width of the inflow port is 4.1 mm to 10 mm and an opening width of the outflow port is 1.0 mm to 4.5 mm.

Abstract: Methods for integration of conformal barrier layers and Ru metal liners with Cu metallization in semiconductor manufacturing are described in several embodiments. According to one embodiment, the method includes providing a substrate containing a recessed feature, depositing a barrier layer in the recessed feature, depositing a Ru metal liner on the barrier layer, and exposing the substrate to an oxidation source gas to oxidize the barrier layer through the Ru metal liner. The method further includes filling the recessed feature with CuMn metal using an ionized physical vapor deposition (IPVD) process, heat-treating the substrate to diffuse Mn from the CuMn metal to the oxidized barrier layer, and reacting the diffused Mn with the oxidized barrier layer to form a Mn-containing diffusion barrier.

Abstract: The present invention relates to a method by which cells usable for an immune cell therapy are separated from peripheral blood and grown. The present invention makes it possible to provide immune system cells which are large enough in number to be used in the immune cell therapy.

Abstract: The present invention relates to a method for producing a formyl group-containing porous base matrix, comprising the steps of introducing a spacer in a formyl group-containing porous particle; and then oxidizing the spacer with periodic acid and/or a periodate, to transform the part of the spacer into a formyl group; wherein the formyl group content in the porous particle after introduction of the spacer is not more than 3 ?mol per 1 mL of the porous particle. Also, the present invention relates to a method for producing an adsorbent, comprising the step of immobilizing an amino group-containing ligand on the formyl group-containing porous base matrix. According to the present invention, a formyl-group containing porous base matrix and an adsorbent produced from the porous base matrix of which adsorption amount is high and which is has high strength and of which ligand is difficult to be leaked are provided.

Abstract: There is provided a method for manufacturing Ni wiring. The method includes forming an Ni film on a surface of a substrate having a recess formed thereon by CVD or ALD by using an Ni compound as a film forming material and NH3gas and H2 gas as reduction gases to partially fill the recess. The method further includes annealing the substrate to make the Ni film on the surface of the substrate and on a side surface of the recess reflow into the recess.

Abstract: An electric motor (40) includes stator (10), rotor (14) including rotation body (20), a pair of bearings (15), and a pair of brackets (17, 24). Rotation body (20) includes outer iron core (25), inner iron core (26), and dielectric layer (23). Outer iron core (25) is located in the outer side of rotation body (20). Inner iron core (26) is fixed to shaft (16). Dielectric layer (23) is located between outer iron core (25) and inner iron core (26) and includes at least two dielectric bodies different in dielectric constant.

Abstract: A permanent-magnet-embedded electric motor includes a stator having a coil wound on a stator core, and a rotor disposed rotatably inside the stator through a gap to an inner circumferential surface of the stator core. The rotor is provided with a rotor core formed of laminated steel plates having a plurality of magnet-embedding holes, and a permanent magnet housed and retained in each of the magnet-embedding holes. A thickness of the bridge portions formed between edges of the magnet-embedding holes and an outer circumference of the rotor core, and a thickness of a thinned link portion connecting adjoining two of the bridge portions are thinner than a thickness of the steel plates.

Abstract: It is an object of the present invention to provide a resin molded body capable of appropriately and easily improving strength compared to the prior art. The resin molded body according to the present invention includes first phases (21, 24) in which convex and concave parts extend in substantially linear directions (D, E), observed within a measurement range (A) of 5 ?m×5 ?m arbitrarily selected on a resin cross section and the first phases account for 50% or more. The first phases are preferably in a crystalline state. A second phase made of an amorphous substance (25) is preferably interposed between the first phases.

Abstract: The present invention provides a connection structure and a manufacturing method therefor capable of increasing reliability of a connection part compared to the prior arts. A connection structure according to the present invention includes a plurality of conductive members, a connection part that electrically connects the conductive members, and an electrically insulating molded body in which the connection part is embedded. It is thereby possible to physically reinforce the connection part of the conductive members, keep the connection part in a hermetically sealed condition, thereby prevent corrosion and increase reliability compared to the prior arts.

Abstract: Methods for integration of conformal barrier layers and Ru metal liners with Cu metallization in semiconductor manufacturing are described in several embodiments. According to one embodiment, the method includes providing a substrate containing a recessed feature, depositing a barrier layer in the recessed feature, depositing a Ru metal liner on the barrier layer, and exposing the substrate to an oxidation source gas to oxidize the barrier layer through the Ru metal liner. The method further includes filling the recessed feature with CuMn metal using an ionized physical vapor deposition (IPVD) process, heat-treating the substrate to diffuse Mn from the CuMn metal to the oxidized barrier layer, and reacting the diffused Mn with the oxidized barrier layer to form a Mn-containing diffusion barrier.

Abstract: A method in accordance with the present invention includes the steps of: concentrating cord blood-derived mesenchymal stem cells; and causing the mesenchymal stem cells thus concentrated to grow with use of a particular factor while maintaining undifferentiated state of the mesenchymal stem cells.

Abstract: An injection device in a molding machine includes: a cylinder having an outlet member formed at a tip-end injection side, a stopper part provided at a rear side, and a pellet supply opening for supplying plastic pellets; a melting device having a plurality of melting holes formed communicating from inflow-side large openings to outflow-side small openings in the longitudinal direction of a device main body, the melting device having a diameter equal to an inner diameter of the cylinder; a heating unit for heating the melting device; and a drive unit for causing the melting device to move in a reciprocating manner.

Abstract: An electric motor according to the present invention includes a stator and a rotor. The stator includes a stator iron core and a coil. The stator iron core includes a plurality of iron core divisions connected to form an annular shape. Each of iron core divisions includes yoke and a tooth. The plurality of iron core divisions engage with each other such that protrusion portion of one of each adjoining pair of the plurality of iron core divisions engages with recess portion of the other of the corresponding adjoining pair of the plurality of iron core divisions in a manner that protrusion portion and recess portion are rotatable. In this case, rotation center S of protrusion portion is positioned on a bisector of an angle formed by extended and crossed center lines of the teeth of respective iron core divisions of corresponding adjoining pair of the plurality of iron core divisions. An internal diameter side extension portion projects toward adjoining iron core division.

Abstract: A permanent-magnet-embedded electric motor includes a stator having a coil wound on a stator core, and a rotor disposed rotatably inside the stator through a gap to an inner circumferential surface of the stator core. The rotor is provided with a rotor core formed of laminated steel plates having a plurality of magnet-embedding holes, and a permanent magnet housed and retained in each of the magnet-embedding holes. A thickness of the bridge portions formed between edges of the magnet-embedding holes and an outer circumference of the rotor core, and a thickness of a thinned link portion connecting adjoining two of the bridge portions are thinner than a thickness of the steel plates.

Abstract: Packing a column with a chromatography medium at prescribed compression factor, and then passing a mobile phase through the column packed with the chromatography medium while switching the mobile phase flow direction two or more times. According to the present invention, a small-diameter chromatography column packed uniformly and densely as well as a large-diameter column can be reproducibly prepared. The small-diameter chromatography column prepared in this way has the asymmetry factor of not less than 0.80 and not more than 1.80.

Abstract: A method of fabricating a semiconductor device including a substrate having a copper interconnect exposed on a surface of an insulation film, wherein a layer of an anti-corrosion agent composed of organic material is formed on the surface of the copper interconnect. The method includes removing the layer of the anti-corrosion agent by heating the substrate; and forming a thin layer including manganese oxide on the surface of the copper interconnect by supplying a gas containing an organic compound of manganese to the substrate.