Abstract: A welding laser beam (L1) is radiated along welding loci (C11, C12) set in workpieces (W1, W2), or an inspection laser beam (L5) is radiated along scanning loci (C51, C52) set in a molten pool (Y1) of the workpieces (W1, W2) that are molten by radiation of the welding laser beam (L1), a returned light beam (L2) including reflection light from the molten pool (Y1) of the workpieces, vapor light caused due to melting and evaporation of the workpieces, and thermal radiation light emitted from the molten pool (Y1) of the workpieces is received, and a welding state of a welded portion of the workpieces is inspected based on an intensity change of the returned light beam (L2) thus received.

Abstract: According to one embodiment, a semiconductor module includes a first semiconductor element, a second semiconductor element, a first light emitting element and a second light emitting element. The first semiconductor element is provided with a first light receiving circuit and a first output circuit. The second semiconductor element is provided with a second light receiving circuit and a second output circuit. The first light emitting element is electrically connected to the second output circuit and mounted on the first semiconductor element such that first light emitted from the first light emitting element is received by the first light receiving circuit. The second light emitting element is electrically connected to the first output circuit and mounted on the second semiconductor element such that second light emitted from the second light emitting element is received by the second light receiving circuit.

Abstract: A laser welding method is capable of easily restraining poor welding when spatters adhere to a protective glass of an optical system. The laser welding method includes a step of calculating a decrease-amount of the laser power before laser welding is performed by irradiating a welding portion of a workpiece with the laser beam having a predetermined power. The step of calculating the decrease-amount includes irradiating the welding portion with an inspecting laser beam having a power smaller than the predetermined power, receiving a return beam of the inspecting laser beam, measuring an intensity of the return beam, and comparing the intensity of the return beam with a standard intensity to calculate an amount of decrease in power of the inspecting laser beam at the welding portion.

Abstract: A welding laser beam (L1) is radiated along welding loci (C11, C12) set in workpieces (W1, W2), or an inspection laser beam (L5) is radiated along scanning loci (C51, C52) set in a molten pool (Y1) of the workpieces (W1, W2) that are molten by radiation of the welding laser beam (L1), a returned light beam (L2) including reflection light from the molten pool (Y1) of the workpieces, vapor light caused due to melting and evaporation of the workpieces, and thermal radiation light emitted from the molten pool (Y1) of the workpieces is received, and a welding state of a welded portion of the workpieces is inspected based on an intensity change of the returned light beam (L2) thus received.

Abstract: A welding laser beam (L1) is radiated along welding loci (C11, C12) set in workpieces (W1, W2), or an inspection laser beam (L5) is radiated along scanning loci (C51, C52) set in a molten pool (Y1) of the workpieces that are molten by radiation of the welding laser beam, a returned light beam (L2) including reflection light from the molten pool, vapor light caused due to melting and evaporation of the workpieces, and thermal radiation light emitted from the molten pool is received, and a welding state of a welded portion of the workpieces is inspected based on an intensity of a returned light beam received in a first region inside the molten pool which is relatively close to a given point and an intensity of a returned light beam received in a second region inside the molten pool which is relatively spaced from the given point.

Abstract: Provided is a laser welding inspection apparatus capable of improving the accuracy for determining the welding defect. The laser welding inspection apparatus includes a head which irradiates a welded portion of a workpiece with a laser beam for inspection, an optical receiver which receives a return light of the laser beam for inspection from the welded portion, an optical system which adjusts at least a focal diameter of the laser beam for inspection applied to the welded portion and a region where the return light from the welded portion is recognized, and a controller which controls the optical system and determines, based on intensity of the return light, whether a welding defect exists in the welded portion. The controller controls the optical system so that a diameter of the region is not more than 1.5 times as large as the focal diameter.

Abstract: Provided is a laser beam welding apparatus capable of correctly detecting the beginning and the end of one welding point even in remote laser beam welding. The laser beam welding apparatus includes a head which irradiates a workpiece with a laser beam, an optical receiver which receives a reflected light of the laser beam from the workpiece, and a controller. The optical receiver receives only a laser beam and a plasma of the reflected light. The controller determines that one welding point begins when a time during which intensity of the reflected light is larger than or equal to a second set-intensity is longer than or equal to a first set-time, and determines that the one welding point ends when a time during which the intensity of the reflected light is smaller than or equal to a first set-intensity is longer than or equal to a second set-time.

Abstract: A welded portion inspection method accurately identifies emitted light from a molten portion during inspection laser light irradiation, enabling reliable inspection. When transitioning from welding laser light irradiation to inspection laser light irradiation, the welding laser light irradiation is interrupted and then the welding laser light is switched to the inspection laser light. In inspecting a welded portion, two points in time at which the emitted light intensity is equal to or less than a certain threshold value are extracted from an intensity waveform of the emitted light as an inspection start point in time and an inspection end point in time. The interval between the inspection start and end points is estimated as being a irradiation period of the inspection laser light. The welded state is inspected based on the intensity waveform of the emitted light in the irradiation period.

Abstract: The present invention provides a track rail mounting structure of a rectilinear guide apparatus comprising a track rail having a rotating/running surface where a plenty of rotating/running bodies rotate and run; an endless circulation route for guiding the plenty of rotating/running bodies; and a slider movably arranged with respect to the track rail via the rotating/running bodies; wherein a base where the track rail is mounted has a groove for inserting a bottom portion of the track rail, so that the bottom portion of the track rail is inserted into the groove, and a pressure member is provided for pressing at least one side surface of the track rail toward an inner side surface of the groove.

Abstract: The present invention provides a track rail mounting structure of a rectilinear guide apparatus comprising a track rail having a rotating/running surface where a plenty of rotating/running bodies rotate and run; an endless circulation route for guiding the plenty of rotating/running bodies; and a slider movably arranged with respect to the track rail via the rotating/running bodies; wherein a base where the track rail is mounted has a groove for inserting a bottom portion of the track rail, so that the bottom portion of the track rail is inserted into the groove, and a pressure member is provided for pressing at least one side surface of the track rail toward an inner side surface of the groove.

Abstract: A base film 9 on which a first pattern 31 is formed and a conductive foil 12 on which a second pattern 32 is formed are laminated by being passed through a gap between laminating rolls 7a, 7b which are provided with an adjusting means for adjusting the gap width and parallelism between them. Then, a relative position between the first pattern 31 and the second pattern 32 is detected. After patterning the conductive foil 12 to form a wiring 12w, displacements of the first pattern 31 and the second pattern 32 are detected, and the gap width and parallelism between the laminating rolls 7a, 7b are adjusted corresponding to the detected displacements. Thus, the laminate can be formed uniformly, and the base film 9 and the wiring 12 can be prevented from being deformed with the release of a residual stress in the patterning step. According to the manufacturing method of a high-precision film carrier tape, highly-integrated semiconductor devices are mounted with high productivity.

Abstract: A semiconductor integrated circuit includes a semiconductor chip having a plurality of pad electrodes fixed in a lead frame. Electrical leads connected to the chip include outer lead portions, external to the lead frame, and inner lead portions, internal to the lead frame and electrically connected to the semiconductor chip. At least one lead is a dummy lead, providing additional space in the lead frame. Due to the extra space, the inner lead portions may have various shapes, including large leads, or branched leads, for elimination power noise.