Abstract: An anticancer agent having a novel chemical structure and high anticancer activity is provided. A phosphine transition metal complex of general formula (1) and an anticancer agent containing the complex are disclosed. R1 and R2, which may be the same or different, each represent a group having 1 to 10 carbon atoms selected from a straight-chain or branched alkyl group, a cycloalkyl group, a substituted cycloalkyl group, an adamantyl group, a phenyl group, and a substituted phenyl group; R3 and R4, which may be the same or different, each represent a hydrogen atom, a straight-chain alkyl group having 1 to 6 carbon atoms or branched alkyl group having 1 to 6 carbon atoms; or R3 and R4 are taken together to form a saturated or unsaturated ring which may have a substituted group; M represents a transition metal atom selected from the group consisting of gold, copper, and silver; and X? represents an anion.

Abstract: A phosphine transition metal complex is expressed by general formula (1): wherein A represents a groups selected from among alkylene, phenylene, and cis-vinylene; M represents an atom selected from the group consisting of gold, silver, copper, and platinum; B1 and B2 each represent a substituted or unsubstituted heterocyclic group containing a trivalent phosphorus atom forming a covalent bond with A and coordinating with M; and C represents an anionic atom.

Abstract: An optical interface module and a method for manufacturing an optical interface module. One method includes forming a lower clad layer on a first surface of a substrate, forming a core layer on the lower clad layer and forming two grooves in part of the core layer to form a first core part between the two grooves having one end and another end. Also included is forming an upper clad layer on the core layer and in the grooves, mounting a light-emitting element on the first surface and mounting a light-receiving element on the first surface of the substrate. A second core part is optically coupled to the light-emitting element and the first core part, and a third core part is optically coupled to the light-receiving element and the other end of the first core part.

Abstract: It is an object of the present invention to provide a method for highly selectively releasing a molecule of interest such as an agent at a desired site while suppressing the influence of catabolic enzymes existing in vivo.

Abstract: Control of cell cycle is important in crop breeding, and it is demanded to develop, through the control, techniques for modifying cell growth in plants, techniques for modifying the development/differentiation of plant individuals and plant genes for use therein. It has been successfully disclosed that plant gene 3Rmyb is a factor indispensable for the multiplication of plant cells. Thus, there are provided, with the gene as a target, techniques for modifying the multiplication of plant cells and techniques for modifying the development/differentiation of plant individuals, and there can be obtained plants and plant cells retaining modified cell growth and development/differentiation. These enable development of plants with desirable properties, such as specified organ enlargement, male sterility or improved stress resistance.

Abstract: [Problem] Provided are a method of maintaining/expanding hematopoietic stem cells, a hematopoietic stem cell population obtained by the method, a hematopoietic function ameliorating agent based on administration of the hematopoietic stem cell population to a living organism, and the like. [Solving Means] A method of maintaining/expanding hematopoietic stem cells, comprising culturing hematopoietic stem cells in the presence of the HSC activity supporting factor of the present invention, which comprises the same or substantially the same amino acid sequence as an amino acid sequence shown by SEQ ID NO:2 or 4, or in the co-presence of a mammalian cell, preferably a stromal cell, incorporating an expression vector harboring a nucleic acid that encodes the HSC activity supporting factor, a cell population containing expanded hematopoietic stem cells obtained by the method, and a hematopoietic function ameliorating agent comprising the cell population.

Abstract: A phosphine transition metal complex is expressed by general formula (1): wherein A represents a groups selected from among alkylene, phenylene, and cis-vinylene; M represents an atom selected from the group consisting of gold, silver, copper, and platinum; B1 and B2 each represent a substituted or unsubstituted heterocyclic group containing a trivalent phosphorus atom forming a covalent bond with A and coordinating with M; and C represents an anionic atom.

Abstract: The present invention aims to provide a substrate for mounting an IC chip, on which an optical signal passing region is formed and which can suppress a transmission loss in an optical signal and transmit an optical signal more positively with high reliability. The substrate for mounting an IC chip according to the present invention is a substrate for mounting an IC chip, in which a conductor circuit and an insulating layer are laminated in alternate fashion and in repetition on both faces of a substrate and an optical element is mounted on the substrate. Herein, the substrate for mounting an IC chip includes an optical signal passing region, and a microlens arranged on an end portion of the optical signal passing region on the opposite side from the optical element.

Abstract: There is provided a novel transition metal phosphine complex having excellent anticancer activity. The transition metal phosphine complex is represented by general formula (1): (wherein R1s and R3s each represent an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group, a pyridyl group, or a pyrimidyl group; R2s and R4s each represent an alkyl group or a cycloalkyl group, provided that each R1 and each R2 are not the same group and that each R3 and each R4 are not the same group; As each represent a linear alkylene group or a cis-vinylene group; M represents a gold atom, a silver atom, a copper atom, or a platinum atom; and B represents an anionic species).

Abstract: An optoelectronic wiring board includes a rigid, a flexible flex section made of an optical wiring, a flex rigid substrate section provided with an electric wiring, and optical wiring means. In the rigid section, a lamination which is formed of a conductive circuit and an insulating layer is formed on both sides of a substrate. The flexible flex section is made of an optical wiring. The flex rigid substrate section is provided with an electric wiring. The optical wiring means has an end face substantially perpendicular to the optical wiring means. The end face is arranged facing an optical element mounting region provided on the rigid section, and at least a part of the flex section is fixed on the rigid section.

Abstract: The multilayer printed circuit board according to the present invention is a multilayer printed circuit board where at least one insulating layer, a conductor circuit and a plurality of optical circuits are formed and layered, wherein the optical circuits are formed and layered so as to be located in different layers.

Abstract: An optical and electrical circuit board includes a patterned electrical wiring and a micro convex lens. The micro convex lens is provided in at least one hole formed in the optical and electrical circuit board.

Abstract: The optical/electrical composite wiring board comprises a lower insulating layer that also serves as a lower clad; a upper insulating layer that also serves as an upper clad; a core that is placed between the lower insulating layer and the upper insulating layer and has a predetermined optical wiring pattern; and a conductor layer that is placed along with the core between the lower insulating layer and the upper insulating layer and has a predetermined electrical wiring pattern. Herein, the core and the conductor layer are formed via a short manufacturing method, whereby the concave portion for optical wiring and the concave portion for electrical wiring are formed on the lower insulating layer by press process, and a core material and conductor material are filled into each of the concave portions, and afterward, the core material and conductor material are ground until they are flush with the upper surface of the lower insulating layer.

Abstract: A device for optical communication comprising; at least a conductor circuit and an insulating layer formed and laminated, an optical circuit and an optical path for transmitting an optical signal; and an optical element or a package substrate on which an optical element is mounted, wherein an optical path converting member is disposed at the optical path for transmitting an optical signal so as to transmit an optical signal between the optical element and the optical circuit, the optical path converting member comprises a lens and an optical path conversion mirror having an entrance surface, an exit surface and a reflection surface, and the lens is provided at least one position selected from the entrance surface, the exit surface, and inside of the optical path conversion mirror.

Abstract: A device for optical communication comprising; at least a conductor circuit and an insulating layer formed and laminated, an optical circuit and an optical path for transmitting an optical signal; and an optical element or a package substrate on which an optical element is mounted, wherein an optical path converting member is disposed at the optical path for transmitting an optical signal so as to transmit an optical signal between the optical element and the optical circuit, the optical path converting member comprises a lens and an optical path conversion mirror having an entrance surface, an exit surface and a reflection surface, and the lens is provided at at least one position selected from the entrance surface, the exit surface, and inside of the optical path conversion mirror.

Abstract: The present invention aims to provide a substrate for mounting an IC chip, on which an optical signal passing region is formed and which can suppress a transmission loss in an optical signal and transmit an optical signal more positively with high reliability. The substrate for mounting an IC chip according to the present invention is a substrate for mounting an IC chip, in which a conductor circuit and an insulating layer are laminated in alternate fashion and in repetition on both faces of a substrate and an optical element is mounted on the substrate. Herein, the substrate for mounting an IC chip includes an optical signal passing region, and a microlens arranged on an end portion of the optical signal passing region on the opposite side from the optical element.

Abstract: A package substrate according to an embodiment of the present invention comprises: at least a conductor circuit and an insulating layer formed and laminated to form a laminated body; at least one solder resist layer further formed and laminated on both sides of the laminated body; an optical element; and an optical path for transmitting an optical signal, wherein at least one outermost layer of the solder resist layers formed and laminated on the laminated body has a transmittance for light having a wavelength for communication of about 60% or more at a thickness of 30 ?m.

Abstract: The substrate for mounting an IC chip according to the present invention is a substrate for mounting an IC chip, where conductor circuits and insulating layers are formed and layered, an optical element is mounted, an optical path for transmitting an optical signal is formed, wherein an optical element sealing layer is formed so as to make contact with the periphery of the above described optical element.

Abstract: The multilayer printed circuit board according to the present invention is a multilayer printed circuit board, in which conductor circuits and insulating layers are formed and layered, an optical path for transmitting an optical signal comprising a resin composite is formed, and conductor circuits are formed on an outermost insulating layer. Herein, an end portion of the above described optical path for transmitting an optical signal protrudes from the surface of the outermost insulating layer.

Abstract: An optical element of the present invention comprises: one or a plurality of unit elements having a plurality of external electrodes formed on one main surface thereof, wherein upon taking the one main surface of the unit elements in a plan view, the plurality of external electrodes are locally formed in a first region of two regions of a planar shape of the main surface, the two region formed by equally dividing the planar shape with a center line.