Patents by Inventor Hiroaki Kodama

Hiroaki Kodama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7390915
    Abstract: An anti-cancer agent contains a phosphine transition metal complex having a ferrocene skeleton, the complex being represented by general formula (3) below: (wherein R1, R2, R3, and R4 each represent a linear or branched alkyl group, a cycloalkyl group, an alkoxy group, an aryl group, or an aralkyl group; A represents a linear or branched alkyl group, a phenyl group, or a hydrogen atom; M1 represents a transition metal atom selected from the group consisting of gold, copper, platinum, and silver; and X1 represents an anion).
    Type: Grant
    Filed: August 20, 2007
    Date of Patent: June 24, 2008
    Assignee: Nippon Chemical Industrial Co., Ltd
    Inventors: Hiroaki Kodama, Keisuke Ohto, Nobuhiko Oohara, Kazuhiro Nakatsui, Yoshirou Kaneda
  • Publication number: 20080118199
    Abstract: The present invention aims to provide a substrate for mounting an IC chip, on which an optical signal passing region is formed and which can suppress a transmission loss in an optical signal and transmit an optical signal more positively with high reliability. The substrate for mounting an IC chip according to the present invention is a substrate for mounting an IC chip, in which a conductor circuit and an insulating layer are laminated in alternate fashion and in repetition on both faces of a substrate and an optical element is mounted on the substrate. Herein, the substrate for mounting an IC chip includes an optical signal passing region, and a microlens arranged on an end portion of the optical signal passing region on the opposite side from the optical element.
    Type: Application
    Filed: December 27, 2007
    Publication date: May 22, 2008
    Applicant: IBIDEN CO., LTD.
    Inventors: Motoo Asai, Hiroaki Kodama
  • Patent number: 7315970
    Abstract: A semiconductor device able to improve data retaining characteristics and decrease power consumption, further able to realize more unrestricted system without increasing excessive circuits, and having the following: an ALPG receiving a start signal and a mode selection signal to generate commands and addresses with respect to a DRAM circuit with the predetermined patterns in accordance with modes, and outputting an ending signal when ending a pattern generating processing in each of modes; an ECC circuit receiving a start signal and a mode selection signal indicating a parity generation mode to generate a parity based on data read from the DRAM circuit, receiving the start signal and a mode selection signal indicating an error correction mode to perform an error correction with respect to data read from the DRAM circuit based on the parity generated in the parity generation mode and outputting data after correcting; and an interface circuit.
    Type: Grant
    Filed: March 14, 2005
    Date of Patent: January 1, 2008
    Assignee: Sony Corporation
    Inventors: Tomofumi Arakawa, Hiroaki Kodama, Kazutoshi Inoue
  • Publication number: 20070297729
    Abstract: A device for optical communication comprising; at least a conductor circuit and an insulating layer formed and laminated, an optical circuit and an optical path for transmitting an optical signal; and an optical element or a package substrate on which an optical element is mounted, wherein an optical path converting member is disposed at the optical path for transmitting an optical signal so as to transmit an optical signal between the optical element and the optical circuit, the optical path converting member comprises a lens and an optical path conversion mirror having an entrance surface, an exit surface and a reflection surface, and the lens is provided at least one position selected from the entrance surface, the exit surface, and inside of the optical path conversion mirror.
    Type: Application
    Filed: June 15, 2007
    Publication date: December 27, 2007
    Applicant: IBIDEN CO., LTD
    Inventors: Hiroaki KODAMA, Motoo Asai, Kazuhito Yamada
  • Publication number: 20070223935
    Abstract: A multilayer printed circuit board according to the present invention is a multilayer printed circuit board where a plurality of insulating layers, a conductor circuit and an optical circuit are formed and layered and an optical element is mounted, wherein the above described optical circuit is formed between the above described insulating layers.
    Type: Application
    Filed: April 20, 2007
    Publication date: September 27, 2007
    Applicant: IBIDEN CO., LTD
    Inventors: Motoo ASAI, Hiroaki Kodama, Kazuhito Yamada
  • Patent number: 7187603
    Abstract: A semiconductor memory device according to the present invention includes a BIST circuit for evaluating quality of each of memory cells and a buffer (memory) for storing address information of abnormal cells which information is sent from the BIST circuit, the BIST circuit and the buffer being mounted on the same chip as a DRAM. A repair search circuit determines a minimum of address information required to determine redundant cells for replacement in the address information of the abnormal cells which information is sent from the BIST circuit, and stores only the determined address information in the buffer. Since only a minimum of address pairs required determining the redundant cells for repairing the abnormal cells are stored in the buffer, circuit scale is reduced. Further, processing for calculating address information of the redundant cells for repairing the abnormal cells can be performed at high speed.
    Type: Grant
    Filed: February 10, 2004
    Date of Patent: March 6, 2007
    Assignee: Sony Corporation
    Inventors: Kou Nagata, Hiroaki Kodama
  • Publication number: 20060263003
    Abstract: The present invention aims to provide a substrate for mounting an IC chip, on which an optical signal passing region is formed and which can suppress a transmission loss in an optical signal and transmit an optical signal more positively with high reliability. The substrate for mounting an IC chip according to the present invention is a substrate for mounting an IC chip, in which a conductor circuit and an insulating layer are laminated in alternate fashion and in repetition on both faces of a substrate and an optical element is mounted on the substrate. Herein, the substrate for mounting an IC chip includes an optical signal passing region, and a microlens arranged on an end portion of the optical signal passing region on the opposite side from the optical element.
    Type: Application
    Filed: April 12, 2006
    Publication date: November 23, 2006
    Applicant: IBIDEN CO., LTD.
    Inventors: Motoo Asai, Hiroaki Kodama
  • Publication number: 20060171928
    Abstract: The present invention is to provide a multipotent cell wherein the sufficient amount necessary can be stably and conveniently supplied with a minimum invasion, that will not cause rejection at the time of cell transplantation, that has a potential to differentiate into various cells such as mesenchymal cells including bone, cartilage, skeletal muscle and fat, endothelial cells, myocardial cells, neurons, mesenchymal cells, myocardial cells, endothelial cells, neurons induced to differentiate from the multipotent cell, and a therapeutic agent/treating method comprising these as active ingredient. Peripheral blood mononuclear cells (PMBC) are cultured on fibronectin-coated plastic plates for 7 to 10 days. The generating cell population with a fibroblast-like morphology is derived from circulating CD14+ monocyte, with a unique phenotype of CD14+CD45+CD34+ type I collagen+.
    Type: Application
    Filed: March 18, 2004
    Publication date: August 3, 2006
    Inventors: Masataka Kuwana, Hiroaki Kodama
  • Publication number: 20060107343
    Abstract: Control of cell cycle is important in crop breeding, and it is demanded to develop, through the control, techniques for modifying cell growth in plants, techniques for modifying the development/differentiation of plant individuals and plant genes for use therein. It has been successfully disclosed that plant gene 3Rmyb is a factor indispensable for the multiplication of plant cells. Thus, there are provided, with the gene as a target, techniques for modifying the multiplication of plant cells and techniques for modifying the development/differentiation of plant individuals, and there can be obtained plants and plant cells retaining modified cell growth and development/differentiation. These enable development of plants with desirable properties, such as specified organ enlargement, male sterility or improved stress resistance.
    Type: Application
    Filed: March 11, 2004
    Publication date: May 18, 2006
    Inventors: Masaki Ito, Satoshi Araki, Hiroaki Kodama, Yasunori Machida
  • Patent number: 7020033
    Abstract: A memory unit includes unit blocks laid out to form a block matrix. Each of the unit blocks has a plurality of memory cells laid out to form a cell matrix and redundant lines including redundant memory cells each used for repairing an abnormal memory cell. Every plurality of unit blocks forms a two-dimensional group oriented in a first direction and a second direction, and the redundant lines connected in the first and second directions are shared by the unit blocks pertaining to the two-dimensional group. Self-repair means embedded in the same chip as the memory unit stores only a minimum number of address pairs in storage means provided for each of the unit blocks as address pairs required for determining a redundant line to be used for repairing an abnormal memory cell and, then, finds a redundant line to be used for repairing an abnormal memory cell for each of the unit blocks pertaining to the two-dimensional group on the basis of the address pairs stored in the storage means.
    Type: Grant
    Filed: April 20, 2004
    Date of Patent: March 28, 2006
    Assignee: Sony Corporation
    Inventors: Kou Nagata, Hiroaki Kodama
  • Patent number: 7016242
    Abstract: In a memory unit provided by the present invention, unit blocks are laid out to form a block matrix. Each of the unit blocks has a plurality of memory cells arranged to form a cell matrix and a redundant line including a redundant memory cell. A plurality of unit blocks in the block matrix forms a one-dimensional group oriented in a first or second direction so that unit blocks pertaining to each one-dimensional group share a redundant line. Self-repair means embedded in the same chip as the memory unit stores only a minimum number of address pairs required for determining a redundant line to be used for repairing an abnormal memory cell for each unit block in storage means. The address of the redundant line to be used for repairing an abnormal memory is then found for each unit block on the basis of the minimum number of address pairs stored in the storage means. By storing only minimum required address information as such, a small size of the storage means and, hence, small circuit scales are sufficient.
    Type: Grant
    Filed: April 14, 2004
    Date of Patent: March 21, 2006
    Assignee: Sony Corporation
    Inventors: Kou Nagata, Hiroaki Kodama
  • Publication number: 20060012967
    Abstract: An object of the present invention is to provide a substrate for mounting an IC chip which is a component for optical communication having an IC chip and an optical component integrally provided thereon, which can ensure a short distance between the IC chip and the optical component, which is excellent in electric signal transmission reliability and which can transmit optical signal through an optical path for transmitting optical signal. The substrate for mounting an IC chip of the present invention is a substrate for mounting an IC chip comprising: a substrate and, as serially built up on both faces thereof, a conductor circuit and an interlaminar insulating layer in an alternate fashion and in repetition; a solder resist layer formed as an outermost layer; and an optical element mounted thereto, wherein an optical path for transmitting optical signal, which penetrates the substrate for mounting an IC chip, is disposed.
    Type: Application
    Filed: March 28, 2003
    Publication date: January 19, 2006
    Applicant: IBIDEN CO., LTD.
    Inventors: Motoo Asai, Hiroaki Kodama, Toyoaki Tanaka
  • Publication number: 20050210186
    Abstract: A semiconductor device able to improve data retaining characteristics and decrease power consumption, further able to realize more unrestricted system without increasing excessive circuits, and having the following: an ALPG receiving a start signal and a mode selection signal to generate commands and addresses with respect to a DRAM circuit with the predetermined patterns in accordance with modes, and outputting an ending signal when ending a pattern generating processing in each of modes; an ECC circuit receiving a start signal and a mode selection signal indicating a parity generation mode to generate a parity based on data read from the DRAM circuit, receiving the start signal and a mode selection signal indicating an error correction mode to perform an error correction with respect to data read from the DRAM circuit based on the parity generated in the parity generation mode and outputting data after correcting; and an interface circuit.
    Type: Application
    Filed: March 14, 2005
    Publication date: September 22, 2005
    Applicant: Sony Corporation
    Inventors: Tomofumi Arakawa, Hiroaki Kodama, Kazutoshi Inoue
  • Publication number: 20050007841
    Abstract: In a memory unit provided by the present invention, unit blocks are laid out to form a block matrix. Each of the unit blocks has a plurality of memory cells arranged to form a cell matrix and a redundant line including a redundant memory cell. A plurality of unit blocks in the block matrix forms a one-dimensional group oriented in a first or second direction so that unit blocks pertaining to each one-dimensional group share a redundant line. Self-repair means embedded in the same chip as the memory unit stores only a minimum number of address pairs required for determining a redundant line to be used for repairing an abnormal memory cell for each unit block in storage means. The address of the redundant line to be used for repairing an abnormal memory is then found for each unit block on the basis of the minimum number of address pairs stored in the storage means. By storing only minimum required address information as such, a small size of the storage means and, hence, small circuit scales are sufficient.
    Type: Application
    Filed: April 14, 2004
    Publication date: January 13, 2005
    Inventors: Kou Nagata, Hiroaki Kodama
  • Publication number: 20040246791
    Abstract: A memory unit includes unit blocks laid out to form a block matrix. Each of the unit blocks has a plurality of memory cells laid out to form a cell matrix and redundant lines including redundant memory cells each used for repairing an abnormal memory cell. Every plurality of unit blocks forms a two-dimensional group oriented in a first direction and a second direction, and the redundant lines connected in the first and second directions are shared by the unit blocks pertaining to the two-dimensional group. Self-repair means embedded in the same chip as the memory unit stores only a minimum number of address pairs in storage means provided for each of the unit blocks as address pairs required for determining a redundant line to be used for repairing an abnormal memory cell and, then, finds a redundant line to be used for repairing an abnormal memory cell for each of the unit blocks pertaining to the two-dimensional group on the basis of the address pairs stored in the storage means.
    Type: Application
    Filed: April 20, 2004
    Publication date: December 9, 2004
    Inventors: Kou Nagata, Hiroaki Kodama
  • Publication number: 20040208070
    Abstract: A semiconductor memory device according to the present invention includes a BIST circuit for evaluating quality of each of memory cells and a buffer (memory) for storing address information of abnormal cells which information is sent from the BIST circuit, the BIST circuit and the buffer being mounted on the same chip as a DRAM. A repair search circuit determines a minimum of address information required to determine redundant cells for replacement in the address information of the abnormal cells which information is sent from the BIST circuit, and stores only the determined address information in the buffer. Since only a minimum of address pairs required determining the redundant cells for repairing the abnormal cells are stored in the buffer, circuit scale is reduced. Further, processing for calculating address information of the redundant cells for repairing the abnormal cells can be performed at high speed.
    Type: Application
    Filed: February 10, 2004
    Publication date: October 21, 2004
    Inventors: Kou Nagata, Hiroaki Kodama
  • Patent number: 5954579
    Abstract: A female screw portion is formed around an axis of a rotor of a step motor to penetrate through the rotor in an axial direction of the rotor. A male screw portion is formed on an outer peripheral surface of a screw shaft so that the screw shaft is screwed into the female screw portion. The screw shaft is inserted in a ring rod, and a connection clip portion is connected to the ring rod. When the rotor rotates, the ring rod reciprocates linearly in the axial direction of the rotor, and vertical fins rock in the axial direction of the rotor.
    Type: Grant
    Filed: September 9, 1997
    Date of Patent: September 21, 1999
    Assignees: Denso Corporation of Kariya, Tokai Riki Mfg. Co. Ltd.
    Inventors: Toshihide Masui, Toshio Tsuboko, Yoshinaka Nakamura, Hiroaki Kodama, Fumihisa Ichioka, Takumi Miyaki, Ikuma Harada
  • Patent number: 5267772
    Abstract: A rear body structure of a vehicle body has a crushable reinforcement disposed inside a rear fender panel and extending in a lengthwise direction for structurally reinforcing a rear body portion of the vertical body. The crushable reinforcement is controlled so as to crush in an intended pattern during a rear-end collision. Consequently, the impact energy generated during the rear-end collision and applied to the automotive vehicle body is absorbed.
    Type: Grant
    Filed: May 29, 1992
    Date of Patent: December 7, 1993
    Assignee: Mazda Motor Corporation
    Inventors: Michitaka Ohta, Hiroaki Kodama
  • Patent number: 5061691
    Abstract: The invention relates to enkephalin analogs of the formula ##STR1## wherein in case of X is D-Val, D-Phe, Pro, D-Met, D-Met(O), D-Leu, D-Glu, D-Glu(Obzl), D-Lys, D-Lys(Z), or D-Arg,Y is Gly or Phe; andR isa) a direct bond,b) an alkylene group having from 1 to 6 carbon atoms,c) o-, m-, or p-phenylene group,d) a cycloalkane; orwherein in case ofX is D-Ala,Y is Phe; andR isa) a direct bond,b) an alkylene group having from 1 to 6 carbon atoms,c) o-, m-, or p-phenylene group, ord) a cycloalkane,its salts and hydrates, as well as a therapeutic composition containing at least one of the enkephalin analogs, as an effective component.
    Type: Grant
    Filed: August 23, 1988
    Date of Patent: October 29, 1991
    Assignee: Kabushiki Kaisha Vitamin Kenkyuso
    Inventors: Kunio Yagi, Yasuyuki Shimohigashi, Hiroaki Kodama, Tomio Ogasawara, Takuya Koshizaka, Masayasu Kurono
  • Patent number: 4950031
    Abstract: An automobile rear underbody structure which comprises generally elongated side frames extending in a direction lengthwise of an automobile body structure and each having a front and rear frame portions. The rear frame portion of each side frame lies in a level offset upwardly relative to the front frame portion. The rear frame portion has a depressed zone defined at a predetermined position thereof to permit the rear frame portion to bend downwardly when an external impact greater than a predetermined value is applied thereto.
    Type: Grant
    Filed: June 29, 1988
    Date of Patent: August 21, 1990
    Assignee: Mazda Motor Corporation
    Inventors: Sumiaki Mizunaga, Katsuaki Matsui, Hiroaki Kodama, Makoto Tokuda, Morikazu Sakamoto