Patents by Inventor Hiroaki Nishida
Hiroaki Nishida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11965123Abstract: A red phosphor that has optical characteristics and durability under high-temperature and high-humidity environments, and a method for producing the same. The red phosphor includes a Mn-activated complex fluoride represented by the following general formula (1) and bismuth: A2MF6:Mn4+??(1) wherein A represents at least one alkali metal element selected from the group consisting of lithium, sodium, potassium, rubidium and cesium, and M represents at least one tetravalent element selected from the group consisting of silicon, germanium, tin, titanium, zirconium and hafnium.Type: GrantFiled: March 19, 2020Date of Patent: April 23, 2024Assignee: STELLA CHEMIFA CORPORATIONInventors: Hiroaki Takatori, Shinya Kumazawa, Tetsuya Arakawa, Tetsuo Nishida
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Publication number: 20230356350Abstract: The present invention relates to a technique of determining a time to replace a polishing pad used in a polishing apparatus for polishing a workpiece, such as wafer, substrate, or panel. A polishing apparatus (1) includes: a polishing table (5) configured to support a polishing pad (2); a polishing head (7) configured to press a workpiece (W) against a polishing surface (2a) of the polishing pad (2); a dresser (40) configured to dress the polishing surface (2a) of the polishing pad (2); a detection sensor (60) configured to detect friction between the dresser (40) and the polishing pad (2), the detection sensor (60) being fixed to the dresser (40); and a wear monitoring device (63) configured to determine a wear index value from a plurality of output values of the detection sensor (60) and generate an alarm signal when the wear index value is smaller than a predetermined lower limit.Type: ApplicationFiled: August 5, 2021Publication date: November 9, 2023Inventors: Yuta SUZUKI, Taro TAKAHASHI, Hirofumi OTAKI, Tsuneo TORIKOSHI, Hiroaki NISHIDA
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Publication number: 20230268194Abstract: A substrate processing apparatus for polishing a substrate by pressing the substrate against a polishing pad, comprises: an acoustic sensor having a sensor body that detects polishing sound of the substrate and outputs the polishing sound as an acoustic signal, and a cover member that houses the sensor body; an end point detection unit that detects an end point of polishing of the substrate from the acoustic signal; and a gas supply device that supplies a gas into the cover member so as to prevent adhesion of moisture (water droplets and water vapor) to the sensor body. The gas supply device is connected to the sensor body on an opposite side of a detection surface for the polishing sound, a groove for passing the gas from the gas supply device is formed in the cover member, and a plurality of micro openings for passing the gas from the gas supply device are formed on a waterproof sheet.Type: ApplicationFiled: July 9, 2021Publication date: August 24, 2023Inventor: Hiroaki NISHIDA
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Patent number: 11396082Abstract: There is provided a device and method for accurately positioning a substrate on a stage by a simple method using power of a movement mechanism provided for a movable stage. A substrate holding device for holding a substrate is provided. The substrate holding device includes a substrate stage for supporting the substrate, a stage drive mechanism for causing the substrate stage to move, positioning pin for positioning the substrate on the substrate stage, first urging members each urging the positioning pin, and a stopper member capable of applying a force against the urging member to the positioning pin. The positioning pin is configured to move together with the substrate stage by the stage drive mechanism. The positioning pin moving together with the substrate stage allows the substrate to be positioned on the substrate stage.Type: GrantFiled: November 12, 2018Date of Patent: July 26, 2022Assignee: Ebara CorporationInventor: Hiroaki Nishida
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Patent number: 11059137Abstract: A tool set that can easily check positions of positioning pins for a workpiece even in an environment using a liquid is disclosed. The tool set includes: a reference tool to be placed on the holding stage; a dummy workpiece to be placed on the reference tool; and a check pin having a cylindrical circumferential surface. The reference tool has a central protrusion having a cylindrical circumferential surface. The dummy workpiece has a circular through-hole having a diameter larger than a diameter of the circumferential surface of the central protrusion. A diameter of the check pin is smaller than a value determined by dividing a difference between the diameter of the circular through-hole and the diameter of the circumferential surface of the central protrusion by 2.Type: GrantFiled: February 4, 2019Date of Patent: July 13, 2021Assignee: EBARA CORPORATIONInventor: Hiroaki Nishida
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Publication number: 20190240794Abstract: A tool set that can easily check positions of positioning pins for a workpiece even in an environment using a liquid is disclosed. The tool set includes: a reference tool to be placed on the holding stage; a dummy workpiece to be placed on the reference tool; and a check pin having a cylindrical circumferential surface. The reference tool has a central protrusion having a cylindrical circumferential surface. The dummy workpiece has a circular through-hole having a diameter larger than a diameter of the circumferential surface of the central protrusion. A diameter of the check pin is smaller than a value determined by dividing a difference between the diameter of the circular through-hole and the diameter of the circumferential surface of the central protrusion by 2.Type: ApplicationFiled: February 4, 2019Publication date: August 8, 2019Inventor: Hiroaki NISHIDA
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Publication number: 20190211423Abstract: A foil is manufactured as an aluminum alloy hard thin foil, wherein the aluminum alloy hard thin foil has an alloy composition wherein a content of Fe is 0.05 to 2.0% by mass, with the balance being aluminum and inevitable impurities; a recrystallization completion temperature is 250° C. or less; and a foil thickness of 5 to 50 ?m. The aluminum alloy hard thin foil can be obtained by subjecting an aluminum alloy having, for example, a composition wherein a total content of Cu, Mg, Cr and Zr is 0.05% by mass or less, and a content of Mn is 0.05% by mass or less to intermediate annealing once or more during cold rolling and subjecting the resulting alloy to cold rolling wherein a reduction ratio from after final intermediate annealing to after final cold rolling is 85% or more.Type: ApplicationFiled: August 15, 2017Publication date: July 11, 2019Applicant: MITSUBISHI ALUMINUM CO., LTD.Inventor: Hiroaki NISHIDA
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Publication number: 20190143479Abstract: There is provided a device and method for accurately positioning a substrate on a stage by a simple method using power of a movement mechanism provided for a movable stage. A substrate holding device for holding a substrate is provided. The substrate holding device includes a substrate stage for supporting the substrate, a stage drive mechanism for causing the substrate stage to move, positioning pin for positioning the substrate on the substrate stage, first urging members each urging the positioning pin, and a stopper member capable of applying a force against the urging member to the positioning pin. The positioning pin is configured to move together with the substrate stage by the stage drive mechanism. The positioning pin moving together with the substrate stage allows the substrate to be positioned on the substrate stage.Type: ApplicationFiled: November 12, 2018Publication date: May 16, 2019Applicant: Ebara CorporationInventor: Hiroaki NISHIDA
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Publication number: 20160233118Abstract: A workpiece transport device for transporting a workpiece having a substrate layer and a layer to be processed on a portion of the substrate layer is provided. This workpiece transport device has a workpiece holding mechanism arranged to operate so as to hold and release the workpiece. The workpiece holding mechanism has at least one tapered workpiece holding surface on which the substrate layer of the workpiece is held in a state where the layer to be processed is positioned below the substrate layer. The tapered workpiece holding surface is formed so that a clearance equal to or larger than a predetermined distance R exists between the workpiece holding surface and the layer to be processed of the workpiece when the workpiece is held by the workpiece holding mechanism.Type: ApplicationFiled: April 19, 2016Publication date: August 11, 2016Inventors: Ryuichi KOSUGE, Hiroaki NISHIDA, Tadakazu SONE, Hideo AIZAWA, Tomohiro TANAKA
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Patent number: 9378997Abstract: A substrate holding mechanism includes a substrate holding claw for holding the substrate. The substrate holding claw includes a slant face for sliding the substrate thereon. Height of the slant face is increased from the inside of a space for holding the substrate toward the outside of the space. A crossing angle formed by a direction in which a machining mark is formed on the slant face and a direction in which the substrate is slid is not less than 0 degree and not more than 45 degrees at least in a partial region of the slant face.Type: GrantFiled: March 27, 2015Date of Patent: June 28, 2016Assignee: EBARA CORPORATIONInventor: Hiroaki Nishida
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Patent number: 9236285Abstract: The present invention enables adjustment of a motion range of a workpiece conveying mechanism by a simple configuration. Provided is a workpiece conveying device including a simple motion range adjusting mechanism for conveying workpieces of different sizes. According to one embodiment of the invention, the workpiece conveying device for conveying workpieces includes a workpiece holding mechanism configured to operate to hold and release the workpiece. The workpiece conveying device also includes an actuator equipped with a movable member directly or indirectly connected to the workpiece holding mechanism to drive the workpiece holding mechanism. The workpiece conveying device further includes a stopper device having a male member and a female member, and these male member and female member are configured to engage with each other in at least two different arrangements, thereby defining at least two predefined discontinuous holding positions of the workpiece holding mechanism connected to the movable member.Type: GrantFiled: May 23, 2013Date of Patent: January 12, 2016Assignee: EBARA CORPORATIONInventor: Hiroaki Nishida
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Publication number: 20150279719Abstract: A substrate holding mechanism includes a substrate holding claw for holding the substrate. The substrate holding claw includes a slant face for sliding the substrate thereon. Height of the slant face is increased from the inside of a space for holding the substrate toward the outside of the space. A crossing angle formed by a direction in which a machining mark is formed on the slant face and a direction in which the substrate is slid is not less than 0 degree and not more than 45 degrees at least in a partial region of the slant face.Type: ApplicationFiled: March 27, 2015Publication date: October 1, 2015Inventor: Hiroaki NISHIDA
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Publication number: 20140030048Abstract: A workpiece transport device for transporting a workpiece having a substrate layer and a layer to be processed on a portion of the substrate layer is provided. This workpiece transport device has a workpiece holding mechanism arranged to operate so as to hold and release the workpiece. The workpiece holding mechanism has at least one tapered workpiece holding surface on which the substrate layer of the workpiece is held in a state where the layer to be processed is positioned below the substrate layer. The tapered workpiece holding surface is formed so that a clearance equal to or larger than a predetermined distance R exists between the workpiece holding surface and the layer to be processed of the workpiece when the workpiece is held by the workpiece holding mechanism.Type: ApplicationFiled: July 26, 2013Publication date: January 30, 2014Applicant: EBARA CORPORATIONInventors: Ryuichi KOSUGE, Hiroaki NISHIDA, Tadakazu SONE, Hideo AIZAWA, Tomohiro TANAKA
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Publication number: 20130319820Abstract: The present invention enables adjustment of a motion range of a workpiece conveying mechanism by a simple configuration. Provided is a workpiece conveying device including a simple motion range adjusting mechanism for conveying workpieces of different sizes. According to one embodiment of the invention, the workpiece conveying device for conveying workpieces includes a workpiece holding mechanism configured to operate to hold and release the workpiece. The workpiece conveying device also includes an actuator equipped with a movable member directly or indirectly connected to the workpiece holding mechanism to drive the workpiece holding mechanism. The workpiece conveying device further includes a stopper device having a male member and a female member, and these male member and female member are configured to engage with each other in at least two different arrangements, thereby defining at least two predefined discontinuous holding positions of the workpiece holding mechanism connected to the movable member.Type: ApplicationFiled: May 23, 2013Publication date: December 5, 2013Applicant: EBARA CORPORATIONInventor: Hiroaki NISHIDA
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Patent number: 8550875Abstract: A method of operating a substrate processing apparatus, upon the occurrence of a nonfatal failure in the apparatus, makes it possible to continue part of the apparatus operations for substrates to clean and recover a substrate or to easily discharge a substrate from the apparatus, without stopping an entire apparatus, thereby reducing the risk of a substrate becoming unprocessable. The method of operating a substrate processing apparatus having a polishing section, a cleaning section and a transferring mechanism, includes: classifying substrates, upon detection of a malfunction in any of the polishing section, the cleaning section and the transferring mechanism, according to the site of the malfunction and to the positions of the substrates in the substrate processing apparatus; and carrying out an operation for each of the substrates after the detection of the malfunction, the operation varying depending on the classification of the substrate.Type: GrantFiled: May 18, 2012Date of Patent: October 8, 2013Assignee: Ebara CorporationInventors: Hiroomi Torii, Hiroaki Nishida, Hiroyuki Kaneko, Misao Date, Takashi Mitsuya, Takamasa Nakamura
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Publication number: 20130206287Abstract: A Co-based alloy containing not less than 0.001 mass % and less than 0.100 mass % of C, not less than 9.0 mass % and less than 20.0 mass % of Cr, not less than 2.0 mass % and less than 5.0 mass % of Al, not less than 13.0 mass % and less than 20.0 mass % of W, and not less than 39.0 mass % and less than 55.0 mass % of Ni, with the remainder being made up by Co and unavoidable impurities, wherein the contents of Mo, Nb, Ti and Ta which are included in the unavoidable impurities are as follows: Mo<0.010 mass %, Nb<0.010 mass %, Ti<0.010 mass %, and Ta<0.010 mass %.Type: ApplicationFiled: August 15, 2011Publication date: August 15, 2013Applicants: TOHOKU UNIVERSITY, HITACHI, LTD.Inventors: Jun Sato, Shinya Imano, Mototsugu Osaki, Shigeki Ueta, Kiyohito Ishida, Toshihiro Omori, Hiroaki Nishida, Masahiro Hayashi, Tomoki Shiota
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Publication number: 20120231703Abstract: A method of operating a substrate processing apparatus, upon the occurrence of a nonfatal failure in the apparatus, makes it possible to continue part of the apparatus operations for substrates to clean and recover a substrate or to easily discharge a substrate from the apparatus, without stopping an entire apparatus, thereby reducing the risk of a substrate becoming unprocessable. The method of operating a substrate processing apparatus having a polishing section, a cleaning section and a transferring mechanism, includes: classifying substrates, upon detection of a malfunction in any of the polishing section, the cleaning section and the transferring mechanism, according to the site of the malfunction and to the positions of the substrates in the substrate processing apparatus; and carrying out an operation for each of the substrates after the detection of the malfunction, the operation varying depending on the classification of the substrate.Type: ApplicationFiled: May 18, 2012Publication date: September 13, 2012Inventors: Hiroomi Torii, Hiroaki Nishida, Hiroyuki Kaneko, Misao Date, Takashi Mitsuya, Takamasa Nakamura
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Publication number: 20120193506Abstract: The present invention relates to a substrate processing apparatus which can improve a tact time of substrate processing. A polishing apparatus as the substrate processing apparatus includes plural polishing sections each for polishing a semiconductor wafer (W), and a swing transporter for transferring the wafer (W). The swing transporter includes a wafer clamp mechanism adapted to clamp the wafer (W), a vertically moving mechanism for vertically moving the wafer clamp mechanism along a frame of a casing of the polishing section, and a swing mechanism for swinging the wafer clamp mechanism about a shaft adjacent to the frame.Type: ApplicationFiled: February 24, 2012Publication date: August 2, 2012Inventors: Nobuyuki TAKAHASHI, Hiroaki Nishida, Hiroomi Torii, Soichi Isobe, Tadakazu Sone, Ryuichi Kosuge, Hiroyuki Kaneko, Hiroshi Sotozaki, Takao Mitsukura, Takahiro Ogawa, Kenichi Sugita
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Patent number: 8202139Abstract: A method of operating a substrate processing apparatus, upon the occurrence of a nonfatal failure in the apparatus, makes it possible to continue part of the apparatus operations for substrates to clean and recover a substrate or to easily discharge a substrate from the apparatus, without stopping an entire apparatus, thereby reducing the risk of a substrate becoming unprocessable. The method of operating a substrate processing apparatus having a polishing section, a cleaning section and a transferring mechanism, includes: classifying substrates, upon detection of a malfunction in any of the polishing section, the cleaning section and the transferring mechanism, according to the site of the malfunction and to the positions of the substrates in the substrate processing apparatus; and carrying out an operation for each of the substrates after the detection of the malfunction, the operation varying depending on the classification of the substrate.Type: GrantFiled: January 22, 2009Date of Patent: June 19, 2012Assignee: Ebara CorporationInventors: Hiroomi Torii, Hiroaki Nishida, Hiroyuki Kaneko, Misao Date, Takashi Mitsuya, Takamasa Nakamura
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Publication number: 20090186557Abstract: A method of operating a substrate processing apparatus, upon the occurrence of a nonfatal failure in the apparatus, makes it possible to continue part of the apparatus operations for substrates to clean and recover a substrate or to easily discharge a substrate from the apparatus, without stopping an entire apparatus, thereby reducing the risk of a substrate becoming unprocessable. The method of operating a substrate processing apparatus having a polishing section, a cleaning section and a transferring mechanism, includes: classifying substrates, upon detection of a malfunction in any of the polishing section, the cleaning section and the transferring mechanism, according to the site of the malfunction and to the positions of the substrates in the substrate processing apparatus; and carrying out an operation for each of the substrates after the detection of the malfunction, the operation varying depending on the classification of the substrate.Type: ApplicationFiled: January 22, 2009Publication date: July 23, 2009Inventors: Hiroomi Torii, Hiroaki Nishida, Hiroyuki Kaneko, Misao Date, Takashi Mitsuya, Takamasa Nakamura