Patents by Inventor Hiroaki Nishida

Hiroaki Nishida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190211423
    Abstract: A foil is manufactured as an aluminum alloy hard thin foil, wherein the aluminum alloy hard thin foil has an alloy composition wherein a content of Fe is 0.05 to 2.0% by mass, with the balance being aluminum and inevitable impurities; a recrystallization completion temperature is 250° C. or less; and a foil thickness of 5 to 50 ?m. The aluminum alloy hard thin foil can be obtained by subjecting an aluminum alloy having, for example, a composition wherein a total content of Cu, Mg, Cr and Zr is 0.05% by mass or less, and a content of Mn is 0.05% by mass or less to intermediate annealing once or more during cold rolling and subjecting the resulting alloy to cold rolling wherein a reduction ratio from after final intermediate annealing to after final cold rolling is 85% or more.
    Type: Application
    Filed: August 15, 2017
    Publication date: July 11, 2019
    Applicant: MITSUBISHI ALUMINUM CO., LTD.
    Inventor: Hiroaki NISHIDA
  • Publication number: 20190168302
    Abstract: A metal powder for additive manufacturing includes: not less than 0.2 mass % and not more than 1.3 mass % of aluminum; and a balance including copper and an incidental impurity.
    Type: Application
    Filed: February 6, 2019
    Publication date: June 6, 2019
    Applicants: Daihen Corporation, Fukuda Metal Foil & Powder Co., Ltd.
    Inventors: Ryusuke Tsubota, Junichi Tanaka, Yohei Oka, Akira Okamoto, Masato Kikukawa, Hiroaki Okubo, Yoshito Nishizawa, Takeshi Maruyama, Motonori Nishida
  • Publication number: 20190168303
    Abstract: A metal powder for additive manufacturing includes: not less than 0.2 mass % and not more than 1.3 mass % of aluminum; and a balance including copper and an incidental impurity.
    Type: Application
    Filed: February 6, 2019
    Publication date: June 6, 2019
    Applicants: DAIHEN CORPORATION, FUKUDA METAL FOIL & POWDER CO., LTD.
    Inventors: Ryusuke TSUBOTA, Junichi TANAKA, Yohei OKA, Akira OKAMOTO, Masato KIKUKAWA, Hiroaki OKUBO, Yoshito NISHIZAWA, Takeshi MARUYAMA, Motonori NISHIDA
  • Publication number: 20190143479
    Abstract: There is provided a device and method for accurately positioning a substrate on a stage by a simple method using power of a movement mechanism provided for a movable stage. A substrate holding device for holding a substrate is provided. The substrate holding device includes a substrate stage for supporting the substrate, a stage drive mechanism for causing the substrate stage to move, positioning pin for positioning the substrate on the substrate stage, first urging members each urging the positioning pin, and a stopper member capable of applying a force against the urging member to the positioning pin. The positioning pin is configured to move together with the substrate stage by the stage drive mechanism. The positioning pin moving together with the substrate stage allows the substrate to be positioned on the substrate stage.
    Type: Application
    Filed: November 12, 2018
    Publication date: May 16, 2019
    Applicant: Ebara Corporation
    Inventor: Hiroaki NISHIDA
  • Publication number: 20160233118
    Abstract: A workpiece transport device for transporting a workpiece having a substrate layer and a layer to be processed on a portion of the substrate layer is provided. This workpiece transport device has a workpiece holding mechanism arranged to operate so as to hold and release the workpiece. The workpiece holding mechanism has at least one tapered workpiece holding surface on which the substrate layer of the workpiece is held in a state where the layer to be processed is positioned below the substrate layer. The tapered workpiece holding surface is formed so that a clearance equal to or larger than a predetermined distance R exists between the workpiece holding surface and the layer to be processed of the workpiece when the workpiece is held by the workpiece holding mechanism.
    Type: Application
    Filed: April 19, 2016
    Publication date: August 11, 2016
    Inventors: Ryuichi KOSUGE, Hiroaki NISHIDA, Tadakazu SONE, Hideo AIZAWA, Tomohiro TANAKA
  • Patent number: 9378997
    Abstract: A substrate holding mechanism includes a substrate holding claw for holding the substrate. The substrate holding claw includes a slant face for sliding the substrate thereon. Height of the slant face is increased from the inside of a space for holding the substrate toward the outside of the space. A crossing angle formed by a direction in which a machining mark is formed on the slant face and a direction in which the substrate is slid is not less than 0 degree and not more than 45 degrees at least in a partial region of the slant face.
    Type: Grant
    Filed: March 27, 2015
    Date of Patent: June 28, 2016
    Assignee: EBARA CORPORATION
    Inventor: Hiroaki Nishida
  • Patent number: 9236285
    Abstract: The present invention enables adjustment of a motion range of a workpiece conveying mechanism by a simple configuration. Provided is a workpiece conveying device including a simple motion range adjusting mechanism for conveying workpieces of different sizes. According to one embodiment of the invention, the workpiece conveying device for conveying workpieces includes a workpiece holding mechanism configured to operate to hold and release the workpiece. The workpiece conveying device also includes an actuator equipped with a movable member directly or indirectly connected to the workpiece holding mechanism to drive the workpiece holding mechanism. The workpiece conveying device further includes a stopper device having a male member and a female member, and these male member and female member are configured to engage with each other in at least two different arrangements, thereby defining at least two predefined discontinuous holding positions of the workpiece holding mechanism connected to the movable member.
    Type: Grant
    Filed: May 23, 2013
    Date of Patent: January 12, 2016
    Assignee: EBARA CORPORATION
    Inventor: Hiroaki Nishida
  • Publication number: 20150279719
    Abstract: A substrate holding mechanism includes a substrate holding claw for holding the substrate. The substrate holding claw includes a slant face for sliding the substrate thereon. Height of the slant face is increased from the inside of a space for holding the substrate toward the outside of the space. A crossing angle formed by a direction in which a machining mark is formed on the slant face and a direction in which the substrate is slid is not less than 0 degree and not more than 45 degrees at least in a partial region of the slant face.
    Type: Application
    Filed: March 27, 2015
    Publication date: October 1, 2015
    Inventor: Hiroaki NISHIDA
  • Publication number: 20140030048
    Abstract: A workpiece transport device for transporting a workpiece having a substrate layer and a layer to be processed on a portion of the substrate layer is provided. This workpiece transport device has a workpiece holding mechanism arranged to operate so as to hold and release the workpiece. The workpiece holding mechanism has at least one tapered workpiece holding surface on which the substrate layer of the workpiece is held in a state where the layer to be processed is positioned below the substrate layer. The tapered workpiece holding surface is formed so that a clearance equal to or larger than a predetermined distance R exists between the workpiece holding surface and the layer to be processed of the workpiece when the workpiece is held by the workpiece holding mechanism.
    Type: Application
    Filed: July 26, 2013
    Publication date: January 30, 2014
    Applicant: EBARA CORPORATION
    Inventors: Ryuichi KOSUGE, Hiroaki NISHIDA, Tadakazu SONE, Hideo AIZAWA, Tomohiro TANAKA
  • Publication number: 20130319820
    Abstract: The present invention enables adjustment of a motion range of a workpiece conveying mechanism by a simple configuration. Provided is a workpiece conveying device including a simple motion range adjusting mechanism for conveying workpieces of different sizes. According to one embodiment of the invention, the workpiece conveying device for conveying workpieces includes a workpiece holding mechanism configured to operate to hold and release the workpiece. The workpiece conveying device also includes an actuator equipped with a movable member directly or indirectly connected to the workpiece holding mechanism to drive the workpiece holding mechanism. The workpiece conveying device further includes a stopper device having a male member and a female member, and these male member and female member are configured to engage with each other in at least two different arrangements, thereby defining at least two predefined discontinuous holding positions of the workpiece holding mechanism connected to the movable member.
    Type: Application
    Filed: May 23, 2013
    Publication date: December 5, 2013
    Applicant: EBARA CORPORATION
    Inventor: Hiroaki NISHIDA
  • Patent number: 8550875
    Abstract: A method of operating a substrate processing apparatus, upon the occurrence of a nonfatal failure in the apparatus, makes it possible to continue part of the apparatus operations for substrates to clean and recover a substrate or to easily discharge a substrate from the apparatus, without stopping an entire apparatus, thereby reducing the risk of a substrate becoming unprocessable. The method of operating a substrate processing apparatus having a polishing section, a cleaning section and a transferring mechanism, includes: classifying substrates, upon detection of a malfunction in any of the polishing section, the cleaning section and the transferring mechanism, according to the site of the malfunction and to the positions of the substrates in the substrate processing apparatus; and carrying out an operation for each of the substrates after the detection of the malfunction, the operation varying depending on the classification of the substrate.
    Type: Grant
    Filed: May 18, 2012
    Date of Patent: October 8, 2013
    Assignee: Ebara Corporation
    Inventors: Hiroomi Torii, Hiroaki Nishida, Hiroyuki Kaneko, Misao Date, Takashi Mitsuya, Takamasa Nakamura
  • Publication number: 20130206287
    Abstract: A Co-based alloy containing not less than 0.001 mass % and less than 0.100 mass % of C, not less than 9.0 mass % and less than 20.0 mass % of Cr, not less than 2.0 mass % and less than 5.0 mass % of Al, not less than 13.0 mass % and less than 20.0 mass % of W, and not less than 39.0 mass % and less than 55.0 mass % of Ni, with the remainder being made up by Co and unavoidable impurities, wherein the contents of Mo, Nb, Ti and Ta which are included in the unavoidable impurities are as follows: Mo<0.010 mass %, Nb<0.010 mass %, Ti<0.010 mass %, and Ta<0.010 mass %.
    Type: Application
    Filed: August 15, 2011
    Publication date: August 15, 2013
    Applicants: TOHOKU UNIVERSITY, HITACHI, LTD.
    Inventors: Jun Sato, Shinya Imano, Mototsugu Osaki, Shigeki Ueta, Kiyohito Ishida, Toshihiro Omori, Hiroaki Nishida, Masahiro Hayashi, Tomoki Shiota
  • Publication number: 20120231703
    Abstract: A method of operating a substrate processing apparatus, upon the occurrence of a nonfatal failure in the apparatus, makes it possible to continue part of the apparatus operations for substrates to clean and recover a substrate or to easily discharge a substrate from the apparatus, without stopping an entire apparatus, thereby reducing the risk of a substrate becoming unprocessable. The method of operating a substrate processing apparatus having a polishing section, a cleaning section and a transferring mechanism, includes: classifying substrates, upon detection of a malfunction in any of the polishing section, the cleaning section and the transferring mechanism, according to the site of the malfunction and to the positions of the substrates in the substrate processing apparatus; and carrying out an operation for each of the substrates after the detection of the malfunction, the operation varying depending on the classification of the substrate.
    Type: Application
    Filed: May 18, 2012
    Publication date: September 13, 2012
    Inventors: Hiroomi Torii, Hiroaki Nishida, Hiroyuki Kaneko, Misao Date, Takashi Mitsuya, Takamasa Nakamura
  • Publication number: 20120193506
    Abstract: The present invention relates to a substrate processing apparatus which can improve a tact time of substrate processing. A polishing apparatus as the substrate processing apparatus includes plural polishing sections each for polishing a semiconductor wafer (W), and a swing transporter for transferring the wafer (W). The swing transporter includes a wafer clamp mechanism adapted to clamp the wafer (W), a vertically moving mechanism for vertically moving the wafer clamp mechanism along a frame of a casing of the polishing section, and a swing mechanism for swinging the wafer clamp mechanism about a shaft adjacent to the frame.
    Type: Application
    Filed: February 24, 2012
    Publication date: August 2, 2012
    Inventors: Nobuyuki TAKAHASHI, Hiroaki Nishida, Hiroomi Torii, Soichi Isobe, Tadakazu Sone, Ryuichi Kosuge, Hiroyuki Kaneko, Hiroshi Sotozaki, Takao Mitsukura, Takahiro Ogawa, Kenichi Sugita
  • Patent number: 8202139
    Abstract: A method of operating a substrate processing apparatus, upon the occurrence of a nonfatal failure in the apparatus, makes it possible to continue part of the apparatus operations for substrates to clean and recover a substrate or to easily discharge a substrate from the apparatus, without stopping an entire apparatus, thereby reducing the risk of a substrate becoming unprocessable. The method of operating a substrate processing apparatus having a polishing section, a cleaning section and a transferring mechanism, includes: classifying substrates, upon detection of a malfunction in any of the polishing section, the cleaning section and the transferring mechanism, according to the site of the malfunction and to the positions of the substrates in the substrate processing apparatus; and carrying out an operation for each of the substrates after the detection of the malfunction, the operation varying depending on the classification of the substrate.
    Type: Grant
    Filed: January 22, 2009
    Date of Patent: June 19, 2012
    Assignee: Ebara Corporation
    Inventors: Hiroomi Torii, Hiroaki Nishida, Hiroyuki Kaneko, Misao Date, Takashi Mitsuya, Takamasa Nakamura
  • Publication number: 20090186557
    Abstract: A method of operating a substrate processing apparatus, upon the occurrence of a nonfatal failure in the apparatus, makes it possible to continue part of the apparatus operations for substrates to clean and recover a substrate or to easily discharge a substrate from the apparatus, without stopping an entire apparatus, thereby reducing the risk of a substrate becoming unprocessable. The method of operating a substrate processing apparatus having a polishing section, a cleaning section and a transferring mechanism, includes: classifying substrates, upon detection of a malfunction in any of the polishing section, the cleaning section and the transferring mechanism, according to the site of the malfunction and to the positions of the substrates in the substrate processing apparatus; and carrying out an operation for each of the substrates after the detection of the malfunction, the operation varying depending on the classification of the substrate.
    Type: Application
    Filed: January 22, 2009
    Publication date: July 23, 2009
    Inventors: Hiroomi Torii, Hiroaki Nishida, Hiroyuki Kaneko, Misao Date, Takashi Mitsuya, Takamasa Nakamura
  • Publication number: 20090067959
    Abstract: The present invention relates to a substrate processing apparatus which can improve a tact time of substrate processing. A polishing apparatus as the substrate processing apparatus includes plural polishing sections (3a, 3b) each for polishing a semiconductor wafer (W), and a swing transporter (7) for transferring the wafer (W). The swing transporter (7) includes a wafer clamp mechanism (112) adapted to clamp the wafer (W), a vertically moving mechanism (104, 106) for vertically moving the wafer clamp mechanism (112) along a frame (102) of a casing of the polishing section (3a), and a swing mechanism (108, 110) for swinging the wafer clamp mechanism (112) about a shaft adjacent to the frame (102).
    Type: Application
    Filed: February 21, 2007
    Publication date: March 12, 2009
    Inventors: Nobuyuki Takahashi, Hiroaki Nishida, Hiroomi Torii, Soichi Isobe, Tadakazu Sone, Ryuichi Kosuge, Hiroyuki Kaneko, Hiroshi Sotozaki, Takao Mitsukura, Takahiro Ogawa, Kenichi Sugita