Patents by Inventor Hiroaki Nishida

Hiroaki Nishida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate processing apparatus, substrate transfer apparatus, substrate clamp apparatus, and chemical liquid treatment apparatus
    Publication number: 20090067959
    Abstract: The present invention relates to a substrate processing apparatus which can improve a tact time of substrate processing. A polishing apparatus as the substrate processing apparatus includes plural polishing sections (3a, 3b) each for polishing a semiconductor wafer (W), and a swing transporter (7) for transferring the wafer (W). The swing transporter (7) includes a wafer clamp mechanism (112) adapted to clamp the wafer (W), a vertically moving mechanism (104, 106) for vertically moving the wafer clamp mechanism (112) along a frame (102) of a casing of the polishing section (3a), and a swing mechanism (108, 110) for swinging the wafer clamp mechanism (112) about a shaft adjacent to the frame (102).
    Type: Application
    Filed: February 21, 2007
    Publication date: March 12, 2009
    Inventors: Nobuyuki Takahashi, Hiroaki Nishida, Hiroomi Torii, Soichi Isobe, Tadakazu Sone, Ryuichi Kosuge, Hiroyuki Kaneko, Hiroshi Sotozaki, Takao Mitsukura, Takahiro Ogawa, Kenichi Sugita