Abstract: A bacterium capable of producing ethanol at a temperature of 40° C. or more from a carbon compound which is gaseous at ordinary temperature and ordinary pressure as the raw material, and a process for producing ethanol by culturing the bacterium at 40° C. or more.

Abstract: A superconductive magnet comprised of a bulk member or sheet member of a type II superconductive material, wherein a distribution of the magnetic flux density component vertical to the surface directly above the surface of the bulk member or sheet member (a) has a maximum value at a center of said bulk member or sheet member and is about zero at its side edge, and (b) has at least one minimal value point between said center and side edge. A superconductor is cooled to not more than a critical temperature after applying a magnetic field Hex1 [A/m] near the magnetic field generation system in the normal conductive state, then the applied magnetic field is reduced to zero, then a magnetic field is applied until the applied magnetic field becomes ?Hex2 [A/m] in the opposite direction to the trapped magnetic flux to make the trapped magnetic flux density Bin0 [T], then the applied magnetic field is again returned to zero, where Hex1>0 and Hex2>0.

Abstract: A method of connecting a TAB tape to a semiconductor chip is disclosed which comprises the steps of preliminarily locating and fixing bumps at positions corresponding to a pattern of electrodes of the semiconductor chip to be connected; and bonding the bumps by thermocompression to the electrodes of the semiconductor chip and the leads of the TAB tape, respectively, so that each electrode of the semiconductor chip is electrically connected to the corresponding lead of the TAB tape through a corresponding one of the bumps. Also disclosed are a bump sheet and a bumped tape to be used in a method of connecting a TAB tape to a semiconductor chip.

Abstract: A method of bonding bumps to leads of a TAB tape comprises the steps of preparing a substrate which is provided with through-holes, each having a size which will not allow the bumps to pass therethrough, at positions corresponding to bonding positions of the leads of the TAB tape where the bumps are to be bonded; provisionally arranging the bumps at positions of the through-holes at one side of the substrate by reducing a pressure in another side of the substrate opposite to said one side thereof to such the bumps in said through-holes; disposing the substrate on which the bumps are provisionally arranged and said TAB tape in such a positional relationship that said bumps face to the bonding positions of the leads of said TAB tape; and bonding the provisionally arranged bumps to the leads at the bonding positions and an apparatus for arranging bumps in a positional relationship corresponding to bonding positions of leads of a TAB tape.