Abstract: A semiconductor processing system includes a transfer apparatus for transferring a wafer. The transfer apparatus has a pick arm member with wings. The reference distances between the wafer located at the normal position and the wings are stored in a memory of a CPU. Detection ranges of line sensors are set in a standby position in front of a process chamber in order to detect the distances between the wafer and the wings. In the CPU, the amount of positional shift of the wafer is detected based on the reference distances and the detected distances.

Abstract: The invention is a method for positioning a conveying mechanism having a holding portion for semiconductor wafers. Respective provisional position coordinates of an orienting teaching standard position and a container teaching standard positions are inputted into a controlling unit in advance. A wafer to be conveyed precisely positioned with respect to and held by the holding portion is conveyed and placed on the rotating orienting device according a control based on the provisional coordinates of the orienting teaching standard position. A posture detector then detects the eccentric volume and eccentric direction of the wafer. Appropriate position coordinates are made by amending the provisional coordinates. Then, a wafer to be conveyed precisely positioned with respect to the container teaching standard position is conveyed and placed on the rotating orienting device according a control based on the provisional coordinates of the orienting teaching standard position.

Abstract: Atomizing air flowing in an atomizing gas passage is merged with a fuel spray to promote atomization of the fuel, and carrier air flowing in a carrier gas passage is merged with the fuel spray at a further downstream position so as to surround the fuel spray. By doing so, the atomized fuel spray is carried to the downstream side so as to prevent the fuel spray from adhering onto the wall surface. The starting-up performance, fuel consumption and exhaust gas cleaning of an internal combustion engine are improved in this way.

Abstract: In most cases, a hot, corrosive atmosphere is created in, for example, a semiconductor wafer processing chamber. When an arm including belts, such as steel belts, is moved into such a semiconductor wafer processing chamber, the belts are exposed to the hot, corrosive atmosphere. Belts, such as steel belts, have limited heat resistance and corrosion resistance and the hot, corrosive atmosphere in the processing chamber shortens the life of the belts. A carrying device of the present invention has a frog leg type arm (3) and a wafer holder (4) connected to the frog leg type arm (3). The wafer holder (4) is pivotally connected to front end parts of a first front arm (8A) and a second front arm (8B) by coaxial joints (10). The wafer holder (4) is linked to the first front arm (8A) and the second front arm (8B) by a posture maintaining linkage (5) including two antiparallel linkages capable of controlling the turning of the wafer holder (4) relative to the first and the second front arms (8A, 8B).

Abstract: The invention has an object to provide a substrate detecting device which is capable of detecting the presence of a substrate and the existence of the substrate's off-position by a low number of substrate sensing parts. In the substrate detecting device for detecting both presence and off-position of the substantially circular substrate W mounted on a substrate mounting part 26, the device includes the plural substrate sensing parts 50, 52 arranged somewhat inward from the outer peripheral edge of the substrate mounted on the substrate mounting part and also arranged at substantially regular intervals along the circumferential direction of the substrate and a judgement controlling unit 40 for judging the presence of the substrate and the existence of the off-position on the ground of respective outputs from the plural substrate sensing parts. Consequently, the presence of the substrate and the existence of the off-position in excess of an allowance can be detected by e.g. three sensing parts.

Abstract: An apparatus for detaching/attaching a lid of a wafer carrier includes a driving section for rotating a key member. The driving section includes a moving member horizontally movable by a driving source and a link mechanism to convert motion of the moving member into rotation of the key member. When a lock mechanism is to be locked, the driving section rotates the key member, which engages with an engaging member of the lock mechanism, to exceed a set angle by an extra angle, and then to return by the extra angle.

Abstract: In a deadlock avoidance method of the present invention, after setting two kinds of transport routes, it is determined whether each of treatment chambers located on the respective transport routes is located upstream or downstream of other treatment chambers on a transport route formed by integrating the transport routes, and an upstream/downstream table indicative of an upstream/downstream relationship between the respective treatment chambers on all the transport routes. When it is determined that a common treatment chamber corresponds to both of upstream and downstream positions while preparing the upstream/downstream table, it is determined that the wafers cause a deadlock.

Abstract: In most cases, a hot, corrosive atmosphere is created in, for example, a semiconductor wafer processing chamber. When an arm including belts, such as steel belts, is moved into such a semiconductor wafer processing chamber, the belts are exposed to the hot, corrosive atmosphere. Belts, such as steel belts, have limited heat resistance and corrosion resistance and the hot, corrosive atmosphere in the processing chamber shortens the life of the belts. A carrying device of the present invention has a frog leg type arm (3) and a wafer holder (4) connected to the frog leg type arm (3). The wafer holder (4) is pivotally connected to front end parts of a first front arm (8A) and a second front arm (8B) by coaxial joints (10). The wafer holder (4) is linked to the first front arm (8A) and the second front arm (8B) by a posture maintaining linkage (5) including two antiparallel linkages capable of controlling the turning of the wafer holder (4) relative to the first and the second front arms (8A, 8B).

Abstract: The present invention provides an idle speed controller comprising a guide plate having a spigot portion fixedly attached to a cylindrical projected portion of a solenoid coil assembly for guiding a shaft to and away from a plunger wherein a symmetrical central axis is maintained between the shaft and the plunger during the guiding of the shaft.

Abstract: A table for a transfer container is provided with an opening portion formed therein. A clamp is swingably supported on the lower side of the table. The clamp has a second engaging portion hook to project upward from the table through the opening portion, and to engage with the first engaging portion of the transfer container. A first actuator is disposed to apply a swing-driving force to the clamp. The first actuator has a reciprocation rod pivotally connected to the clamp, and is swingably supported on the lower side of the table.

Abstract: Two load lock chambers 130 and 132 are arranged between a first transfer chamber 122 and a second transfer chamber 133. Each of the load lock chambers is capable of accommodating a single wafer W. The first transfer chamber 122 is provided with a first transfer unit 124 having two substrate holders 124a, 124b each capable of holding a single object to be processed, in order to transport the wafer W among a load port site 120, the first load lock chamber 130, the second load lock chamber 132 and a positioning unit 150. The second transfer chamber 133 is provided with a second transfer unit 156 having two substrate holders 156a, 156b each capable of holding the single object to be processed, in order to transport the wafer between the first load lock chamber 130, the second load lock chamber 132 and respective vacuum processing chambers 158 to 164. Since the volume of each load lock chamber can be minimized, it is possible to perform the prompt control of atmospheres in the load lock chambers.

Abstract: A transfer apparatus for transferring a semiconductor wafer in a semiconductor processing system includes first and second support portions each for supporting the wafer. The first and second support portions have structures and functions different from each other. The first support portion is provide with backside receiving members having horizontal surfaces to come into contact with the backside of the wafer. The second support portion is provided with edge receiving members having slant surfaces to come into contact with the edge of the wafer. The first and second support portions are selectively used to prevent the wafer from positionally shifting.

Abstract: A load-lock mechanism according to the invention comprises a vacuum chamber 31 arranged between a vacuum first transferring chamber 20 and atmospheric second transferring chambers 40. The vacuum chamber 31 has a first opening 31A facing the first transferring chamber 20, a vertical pair of second openings 31B facing the second transferring chambers 40 and open-close mechanisms 34A, 34B to open and close each of the second opening 31B. One vertical pair of load-lock chambers 32, 33 are movably housed in the vacuum chamber 31. The supply-discharge passageways 31G, 31H are provided in the vacuum chamber 31 to supply and discharge air into and out of each of the load-lock chambers 32, 33. Each of the load-lock chamber 32, 33 has a first port 32A, 33A which can communicate with the first opening 31A, a second port 32B, 33B which can communicate with the corresponding second opening 31B.

Abstract: A semiconductor processing system includes a transfer apparatus for transferring a wafer. The transfer apparatus has a pick arm member with wings. The reference distances between the wafer located at the normal position and the wings are stored in a memory of a CPU. Detection ranges of line sensors are set in a standby position in front of a process chamber in order to detect the distances between the wafer and the wings. In the CPU, the amount of positional shift of the wafer is detected based on the reference distances and the detected distances.

Abstract: A semiconductor processing system comprises a first vacuum processing unit and a second vacuum processing unit connected thereto. The first and second vacuum processing units respectively comprise I/O transfer chambers. Casings of the transfer chambers are connected to each other, and a common transfer robot is arranged in the casings. The transfer robot is moved along horizontal guide rails and formed by connecting rails of the transfer chambers. A rail adjusting mechanism is provided to obtain linearity of the horizontal rails.

Abstract: A main passage mounting a throttle valve and an air bypass flow passage for reducing HC emission by promoting atomization of the fuel spray injected from the assembly pipe fuel injector are integrated in a body of an intake air control device arranged upstream of an assembly pipe in one-piece structure to form a unit. Thereby, the intake air control device can be easily manufactured, and easily mounted on and dismounted from the intake air system. An amount of HC emitted at warming-up operation of an internal combustion engine is reduced by efficiently supplying fuel spray injected from an assembly pipe fuel injector at starting and warming-up operations to the internal combustion engine.

Abstract: Atomizing air flowing in an atomizing gas passage is merged with fuel spray to promote atomization of the fuel, and carrier air flowing in a carrier gas passage is merged with the fuel spray at a further downstream position so as to surround around the fuel spray. By doing so, the atomized fuel spray is carried to the downstream side so as to prevent the fuel spray from adhering onto the wall surface. Starting-up performance, fuel consumption and exhaust gas cleaning of an internal combustion engine are improved.

Abstract: A load port for semiconductor equipment includes a transporting apparatus 18 and/or a moving apparatus 30 for respectively transporting a carrier base 14 and moving a cover 15, using a smaller force until the carrier base 14 and/or the cover 15 reaches a predetermined position that is at a predetermined distance from an opening 16 of the equipment. This position is at a distance where it is no longer possible to catch a hand or other object between the carrier base 14 or cover 15 and the semiconductor equipment. Then, the carrier base 14 and/or the cover 15 is transported or moved towards the opening 16 by the transporting apparatus 18 and/or moving apparatus 30 respectively transporting the carrier base 14 and/or moving the cover 15 towards the opening 16 to completely close the opening 16 using a larger force.

Abstract: A transfer arm apparatus has first, second, and third arms. The second arm has a proximal link pivotally mounted on the distal end of the first arm, and first and second links connecting the proximal link and the third arm to constitute a link mechanism. The first and second links form a first pair of parallel links, and the proximal link and the third link form a second pair of parallel links connecting the first pair of parallel links. A transmission is contained in the first arm, and has an axial shaft and a hollow axial shaft coaxially arranged at the distal end of the first arm. The axial shaft transmits a rotational driving force to the first pair of parallel links, and the hollow axial shaft transmits a rotational driving force to the second pair of parallel links through the proximal link.

Abstract: An idle speed control device has a valve portion disposed in an auxiliary intake air passage by-passing a throttle valve disposed in a main intake air passage for opening and closing a valve provided in the auxiliary air passage, and a spring urging the valve portion to close. The spring is arranged in a portion separated from the air flow in the auxiliary intake air passage, and the valve portion has a guide portion formed therein to be integrated therewith for guiding sliding of the valve portion.