Patents by Inventor Hiroaki Yamaguchi

Hiroaki Yamaguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110284694
    Abstract: An aircraft fuel tank that is capable of suppressing the occurrence of sparks on a pipe caused by a lightning current through the pipe during a lightning strike, and also suppressing static electricity charging of a pipe caused by flow electrification generated by the fuel. An aircraft fuel tank (1) in which a storage section is formed using a conductive upper skin (5), a conductive lower skin (7) and conductive spars (9), the tank comprising: pipes inside the tank, such as a refuel pipe (17), an engine feed pipe (19) and an inert gas pipe (21), which are disposed inside the storage section and are earthed (27) at a plurality of locations, and pipe outer surface layers (31) having semiconductor properties that are formed in an integrated manner on the outer surfaces of the pipes inside the tank such as the replenishing pipe (17), the supply pipe (19) and the gas pipe (21).
    Type: Application
    Filed: June 24, 2009
    Publication date: November 24, 2011
    Inventors: Hiroaki Yamaguchi, Yuichiro Kamino, Tooru Hashigami, Kazuyuki Oguri
  • Patent number: 8043697
    Abstract: A polyimide film-laminated body is composed of a metal layer and an aromatic polyimide layer formed by casting a polyamic acid solution composition, comprising 3,3?,4,4?-biphenyltetracarboxylic dianhydride as an essential tetracarboxylic dianhydride component and with introduction of a specific diamine component, onto a metal foil. The polyimide film-laminated body has an excellent gas permeation rate and moisture permeation rate, with heat resistance, a high elastic modulus and a low linear expansion coefficient, and with reduced foaming and delamination during the high-temperature steps for formation of the laminated body.
    Type: Grant
    Filed: April 17, 2006
    Date of Patent: October 25, 2011
    Assignee: Ube Industries, Ltd.
    Inventors: Masato Murakami, Hiroaki Yamaguchi
  • Publication number: 20110218265
    Abstract: Disclosed is a polyimide foam made of an aromatic polyimide composed of a tetracarboxylic acid component, which is composed of 0 to 90% by mole of a 3,3?,4,4?-biphenyltetracarboxylic acid component and 100 to 10% by mole of a 3,3?,4,4?-benzophenone tetracarboxylic acid component and/or a 2,3,3?,4?-biphenyltetracarboxylic acid component, and a diamine component, which is composed of 50 to 97% by mole of m-phenylenediamine and 50 to 3% by mole of 4,4?-methylenedianiline. The polyimide foam can be produced easily, has uniform and fine cells, and has the mechanical properties required for practical use as a foam, such as flexibility that prevents the foam from cracking easily even when deformed and excellent cushioning properties, as well as heat resistance that can resist use at high temperatures.
    Type: Application
    Filed: November 12, 2009
    Publication date: September 8, 2011
    Applicant: UBE INDUSTRIES, LTD.
    Inventors: Yukio Kaneko, Hiroaki Yamaguchi, Masafumi Kohda
  • Publication number: 20110079277
    Abstract: A polyimide-metal laminate comprising a polyimide film and a metal layer for use as an electrode, which is formed on the side (Side B) of the polyimide film which was in contact with a support when producing a self-supporting film in the production of the polyimide film, is used to produce a CIS solar cell.
    Type: Application
    Filed: May 20, 2009
    Publication date: April 7, 2011
    Applicant: UBE INDUSTRIES, LTD.
    Inventors: Hiroto Shimokawa, Takeshi Uekido, Naoyuki Matsumoto, Ken Kawagishi, Hiroaki Yamaguchi
  • Patent number: 7918021
    Abstract: A flexible circuit printable board can be favorably produced by a process composed of steps of forming in a polyimide film having a metal coat on each surface side a via hole penetrating at least one metal coat and the polyimide film; and applying a mixture of liquid and abrasive grains under pressure onto the via hole, whereby smoothing an edge of the via hole and cleaning the via hole.
    Type: Grant
    Filed: July 9, 2008
    Date of Patent: April 5, 2011
    Assignee: Ube Industries, Ltd.
    Inventors: Ryuichiro Kogure, Tadahiro Yokozawa, Hiroaki Yamaguchi, Osamu Nakayama
  • Publication number: 20110067760
    Abstract: Disclosed is a polyimide film prepared from an aromatic tetracarboxylic acid component and an aromatic diamine component, which has a dimensional change from 25° C. to 500° C. within a range of from ?0.3% to +0.6% based on the initial dimension at 25° C. The polyimide film may be used as a substrate for a CIS solar cell.
    Type: Application
    Filed: May 20, 2009
    Publication date: March 24, 2011
    Applicant: UBE INDUSTRIES, LTD.
    Inventors: Hiroto Shimokawa, Takeshi Uekido, Ken Kawagishi, Hiroaki Yamaguchi
  • Publication number: 20100331432
    Abstract: A polyimide foam formed of an aromatic polyimide prepared from a 3,3?,4,4?-biphenyltetracarboxylic acid component and an aromatic diamine component. The polyimide foam has flexibility at least such that no cracking occurs when a specimen of the polyimide foam with a 1 cm by 1 cm cross-section and a length of 5 cm is deformed until both ends thereof come into contact with each other to make a closed loop. The polyimide foam is obtained by dissolving a 3,3?,4,4?-biphenyltetracarboxylic acid component and an aromatic diamine component in a solvent in the presence of an acid phosphoric ester having a specific structure to prepare a polyimide precursor and heating the polyimide precursor to expand.
    Type: Application
    Filed: July 11, 2008
    Publication date: December 30, 2010
    Applicant: UBE INDUSTRIES, LTD.
    Inventors: Tatsuya Arai, Hiroaki Yamaguchi
  • Publication number: 20100323183
    Abstract: A thermosetting solution composition composed of a biphenyltetracarboxylic acid compound containing a partial lower aliphatic alkyl ester of 2,3,3?,4?-biphenyltetracarboxylic acid and/or a partial lower aliphatic alkyl ester of 2,2?,3,3?-biphenyltetracarboxylic acid, an aromatic diamine compound in a molar amount larger than a molar amount of the biphenyltetracarboxylic acid compound, a partial lower aliphatic alkyl ester of 4-(2-phenylethynyl)phthalic acid compound in a molar amount as much as 1.8-2.2 times a molar amount corresponding to a difference between the molar amount of the aromatic diamine compound and the molar amount of the biphenyltetracarboxylic acid compound, and an organic solvent composed of a lower aliphatic alcohol is of value for manufacture of a prepreg.
    Type: Application
    Filed: August 27, 2010
    Publication date: December 23, 2010
    Applicant: UBE INDUSTRIES, LTD.
    Inventors: Hiroaki YAMAGUCHI, Fumio AOKI
  • Publication number: 20100252309
    Abstract: The polyimide film of the present invention is to be used for the production of a wiring board having a metal wiring, which is formed by forming a metal layer on one side (Side B) of the polyimide film, and etching the metal layer; the polyimide film is curled toward the side (Side A) opposite Side B; and the curling of the polyimide film is controlled so as to reduce the drooping of the wiring board having a metal wiring formed thereon. The handling characteristics and productivity in IC chip mounting may be improved by the use of the polyimide film.
    Type: Application
    Filed: July 25, 2008
    Publication date: October 7, 2010
    Applicant: UBE INDUSTRIES, LTD.
    Inventors: Hiroaki Yamaguchi, Tadahiro Yokozawa, Shuichi Maeda
  • Patent number: 7807014
    Abstract: A thermosetting solution composition composed of a biphenyltetracarboxylic acid compound containing a partial lower aliphatic alkyl ester of 2,3,3?,4?-biphenyltetracarboxylic acid and/or a partial lower aliphatic alkyl ester of 2,2?,3,3?-biphenyltetracarboxylic acid, an aromatic diamine compound in a molar amount larger than a molar amount of the biphenyltetracarboxylic acid compound, a partial lower aliphatic alkyl ester of 4-(2-phenylethynyl)phthalic acid compound in a molar amount as much as 1.8-2.2 times a molar amount corresponding to a difference between the molar amount of the aromatic diamine compound and the molar amount of the biphenyltetracarboxylic acid compound, and an organic solvent composed of a lower aliphatic alcohol is of value for manufacture of a prepreg.
    Type: Grant
    Filed: July 24, 2008
    Date of Patent: October 5, 2010
    Assignee: UBI Industries, Ltd.
    Inventors: Hiroaki Yamaguchi, Fumio Aoki
  • Publication number: 20100130628
    Abstract: Disclosed is an aromatic polyimide having extremely high stiffness and extremely high gas barrier property, which is prepared from a tetracarboxylic acid component consisting essentially of 25 mol % to 97 mol % of 3,3?,4,4?-biphenyltetracarboxylic acid and 75 mol % to 3 mol % of 4,4?-oxydiphthalic acid based on 100 mol % of the total amount of the tetracarboxylic acid component, and a diamine component consisting essentially of p-phenylenediamine.
    Type: Application
    Filed: March 31, 2008
    Publication date: May 27, 2010
    Applicant: UBE INDUSTRIES, LTD.
    Inventors: Hiroaki Yamaguchi, Seiichirou Takabayashi, Tooru Murakami, Takeshige Nakayama
  • Patent number: 7682189
    Abstract: A dummy connector includes a main body including an opening into which a real connector is to be inserted, and a first holding portion and a second holding portion installed respectively on surfaces which face to each other in the opening, and for holding the real connector by sandwiching from a direction of height of the real connector.
    Type: Grant
    Filed: December 23, 2008
    Date of Patent: March 23, 2010
    Assignee: Kabushiki Kaisha Tokai Rika Denki Seisakusho
    Inventors: Hiroaki Yamaguchi, Takahiro Ishiyama
  • Publication number: 20100041860
    Abstract: A polyimide obtained by reacting a tetracarboxylic acid component with a diamine component containing a diamine compound represented by the following general formula (1): wherein, A represents a biphenylene group which may be substituted with an alkyl group having up to 4 carbon atoms.
    Type: Application
    Filed: November 12, 2007
    Publication date: February 18, 2010
    Applicant: UBE INDUSTRIES, LTD.
    Inventors: Hiroaki Yamaguchi, Shuichi Maeda, Nobuharu Hisano, Shinsuke Yabunaka, Kiyotaka Yoshii, Masayoshi Ohue, Akio Matsushita, Yasuhiro Kawachi
  • Publication number: 20090242411
    Abstract: A process for producing a polyimide-metal laminated body includes forming a metal conductive layer on a polyimide film having a ceramic-modified or pseudoceramic-modified surface with a wet plating process which includes forming at least a ground treatment layer by electroless plating, conducting electroless metal plating and conducting electrolytic copper plating.
    Type: Application
    Filed: May 14, 2009
    Publication date: October 1, 2009
    Applicant: Ube Industries, Ltd,
    Inventors: Tadahiro Yokozawa, Hiroaki Yamaguchi, Keita Banba, Masao Okubo, Sumiko Okubo
  • Publication number: 20090242250
    Abstract: Disclosed is a polyimide film produced by heating a self-supporting film of a polyimide precursor solution onto which a solution containing an aluminum chelate compound and, optionally, a nonionic surfactant and/or an aluminum alcoholate compound having at least one alkoxy group is applied to effect imidization.
    Type: Application
    Filed: March 30, 2009
    Publication date: October 1, 2009
    Applicant: UBE INDUSTRIES, LTD.
    Inventors: Masafumi KOHDA, Hiroaki YAMAGUCHI, Toshifumi YAMANE
  • Publication number: 20090197068
    Abstract: Disclosed is a polyimide film prepared from an aromatic tetracarboxylic acid component consisting essentially of 3,3?,4,4?-biphenyltetracarboxylic dianhydride and an aromatic diamine component consisting essentially of not less than 65 mol phenylenediamine % but less than 97 mol % of p-phenylenediamine and not less than 3 mol % but less than 35 mol % of 2,4-toluenediamine.
    Type: Application
    Filed: January 30, 2009
    Publication date: August 6, 2009
    Applicant: UBE INDUSTRIES, LTD.
    Inventors: Hiroaki Yamaguchi, Masafumi Kohda, Nobuharu Hisano, Shinsuke Yabunaka
  • Publication number: 20090181576
    Abstract: A dummy connector includes a main body including an opening into which a real connector is to be inserted, and a first holding portion and a second holding portion installed respectively on surfaces which face to each other in the opening, and for holding the real connector by sandwiching from a direction of height of the real connector.
    Type: Application
    Filed: December 23, 2008
    Publication date: July 16, 2009
    Applicant: KABUSHIKI KAISHA TOKAI RIKA DENKI SEISAKUSHO
    Inventors: Hiroaki YAMAGUCHI, Takahiro ISHIYAMA
  • Patent number: 7550615
    Abstract: Provided is a preparation process of a diglyceride-rich fat or oil, which includes bringing a fat or oil containing diglycerides in an amount of 50 mass % or greater and having a transition metal content of 5 ppm or less into contact with steam while forming a thin film of the fat or oil. This process makes it possible to prepare a diglyceride-rich fat or oil having a reduced odor and good color efficiently.
    Type: Grant
    Filed: November 8, 2007
    Date of Patent: June 23, 2009
    Assignee: Kao Corporation
    Inventors: Eizo Maruyama, Keiji Shibata, Hiroaki Yamaguchi
  • Patent number: 7517674
    Abstract: A process is disclosed for hydrolyzing an oil or fat by mixing and feeding an oil-phase substrate and a water-phase substrate to a packed layer with an immobilized enzyme packed therein. The oil or fat is subjected to a hydrolytic reaction under feeding conditions such that a shear stress factor (?w), which is applied to a surface of said immobilized enzyme and is expressed by the following formula (1): ?w=(?P/L)×dp×?/(1??)??(1) wherein ?P represents a maximum pressure loss [MPa] through said packed layer during said hydrolytic reaction, L represents a thickness [m] of said packed layer, dp represents a weight-basis average particle size [m] of particles of said packed, immobilized enzyme, and ? represents a void volume [?] of said packed layer, remains within a range of from 1×10?4 to 1.4×10?3 MPa.
    Type: Grant
    Filed: June 6, 2005
    Date of Patent: April 14, 2009
    Assignee: Kao Corporation
    Inventors: Toshiteru Komatsu, Hiroaki Yamaguchi, Naoto Yamada
  • Publication number: 20090068454
    Abstract: A polyimide film-laminated body is composed of a metal layer and an aromatic polyimide layer formed by casting a polyamic acid solution composition, comprising 3,3?,4,4?-biphenyltetracarboxylic dianhydride as an essential tetracarboxylic dianhydride component and with introduction of a specific diamine component, onto a metal foil. The polyimide film-laminated body has an excellent gas permeation rate and moisture permeation rate, with heat resistance, a high elastic modulus and a low linear expansion coefficient, and with reduced foaming and delamination during the high-temperature steps for formation of the laminated body.
    Type: Application
    Filed: April 17, 2006
    Publication date: March 12, 2009
    Inventors: Masato Murakami, Hiroaki Yamaguchi