Patents by Inventor Hiroaki YUTO
Hiroaki YUTO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11939667Abstract: A method for manufacturing a wavelength conversion member, includes: providing a wavelength conversion layer having a phosphor-containing portion and a light reflecting portion surrounding the phosphor-containing portion, and the wavelength conversion layer having an upper surface, a bottom surface and at least one side surface; forming a light-blocking film on the upper surface of the wavelength conversion layer; and removing a part of the light-blocking film by laser processing to expose at least a part of the phosphor-containing portion from the light-blocking film.Type: GrantFiled: April 14, 2021Date of Patent: March 26, 2024Assignee: NICHIA CORPORATIONInventors: Naoki Eboshi, Hiroaki Yuto, Hiroki Sakata, Toshiaki Yamashita, Akinori Hara
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Publication number: 20230216268Abstract: An optical member includes: a conversion member including a fluorescent material; a light reflecting ceramic holding the conversion member, the conversion member and the light reflecting ceramic having a continuous surface; a light-transmissive film on the continuous surface; and a wiring on the light-transmissive film.Type: ApplicationFiled: March 9, 2023Publication date: July 6, 2023Applicant: NICHIA CORPORATIONInventors: Tomonori MIYOSHI, Hiroaki YUTO
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Patent number: 11646544Abstract: A method of manufacturing an optical member includes: providing a conversion member and a holding member connected to the conversion member; removing a portion of the conversion member and a portion of the holding member to obtain a first surface of the conversion member and a second surface of the holding member; and heat-treating the first surface of the conversion member and the second surface of the holding member.Type: GrantFiled: July 29, 2021Date of Patent: May 9, 2023Assignee: NICHIA CORPORATIONInventors: Tomonori Miyoshi, Hiroaki Yuto, Teruhiko Noguchi
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Publication number: 20210359489Abstract: A method of manufacturing an optical member includes: providing a conversion member and a holding member connected to the conversion member; removing a portion of the conversion member and a portion of the holding member to obtain a first surface of the conversion member and a second surface of the holding member; and heat-treating the first surface of the conversion member and the second surface of the holding member.Type: ApplicationFiled: July 29, 2021Publication date: November 18, 2021Applicant: NICHIA CORPORATIONInventors: Tomonori MIYOSHI, Hiroaki YUTO, Teruhiko NOGUCHI
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Publication number: 20210332475Abstract: A method for manufacturing a wavelength conversion member, includes: providing a wavelength conversion layer having a phosphor-containing portion and a light reflecting portion surrounding the phosphor-containing portion, and the wavelength conversion layer having an upper surface, a bottom surface and at least one side surface; forming a light-blocking film on the upper surface of the wavelength conversion layer; and removing a part of the light-blocking film by laser processing to expose at least a part of the phosphor-containing portion from the light-blocking film.Type: ApplicationFiled: April 14, 2021Publication date: October 28, 2021Inventors: Naoki EBOSHI, Hiroaki YUTO, Hiroki SAKATA, Toshiaki YAMASHITA, Akinori HARA
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WAVELENGTH CONVERSION MEMBER MANUFACTURING METHOD AND METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE
Publication number: 20210323094Abstract: A wavelength conversion member manufacturing method includes: providing the wavelength conversion member having an upper surface, the wavelength conversion member including a phosphor portion, and a light-transmissive portion configured to transmit fluorescence from the phosphor portion; and forming, in the wavelength conversion member, at least one depressed portion each having an inclined surface inclined with respect to the upper surface by irradiating the wavelength conversion member with a pulsed laser beam from above more than once to form a plurality of continuous machining marks at different processing depths.Type: ApplicationFiled: June 30, 2021Publication date: October 21, 2021Inventors: Naoki EBOSHI, Hiroaki YUTO -
Patent number: 11108210Abstract: An optical member includes a conversion member including a first surface that serves as a light-irradiated surface or a light extraction surface, and adapted to convert laser light, which is an excitation light, into light having a wavelength different from a wavelength of the excitation light; a holding member holding the conversion member and including a second surface that is continuous with the first surface of the conversion member; and a wiring having an elongated shape and extending continuously along the first surface of the conversion member and the second surface of the holding member.Type: GrantFiled: December 21, 2018Date of Patent: August 31, 2021Assignee: NICHIA CORPORATIONInventors: Tomonori Miyoshi, Masanobu Tanaka, Hiroaki Yuto, Akinori Hara, Teruhiko Noguchi
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Patent number: 11084128Abstract: A wavelength conversion member manufacturing method includes providing a wavelength conversion member having an upper surface, and forming, in the wavelength conversion member, at least one depressed portion having an inclined surface inclined with respect to the upper surface by irradiating the wavelength conversion member with a pulsed laser beam from above. The forming of the at least one depressed portion includes performing a set of scanning more than once at different processing depths in regions overlapping each other in a top view, the set of scanning includes performing scanning with the pulsed laser beam along a first direction more than once at irradiation positions shifted in a second direction perpendicular to the first direction in the top view, and the performing of the scanning includes applying the pulsed laser beam at a fixed processing depth.Type: GrantFiled: July 13, 2017Date of Patent: August 10, 2021Assignee: NICHIA CORPORATIONInventors: Naoki Eboshi, Hiroaki Yuto
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Patent number: 10720752Abstract: The method includes the steps of: preparing a single crystal SiC including an upper surface 10a and a lower surface 10b and provided with a micropipe 11 penetrating from the upper surface 10a to the lower surface 10b; forming a first seed layer 21 made of a metal material on the upper surface 10a of the single crystal SiC; and forming a first plated layer 31 on the first seed layer 21 so as to close an upper end of the micropipe 11, using an electroplating method.Type: GrantFiled: July 10, 2018Date of Patent: July 21, 2020Assignee: NICHIA CORPORATIONInventors: Akinori Yoneda, Shinya Sonobe, Hiroaki Yuto
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Patent number: 10415794Abstract: A light emitting device includes: a base member; a laser element disposed on or above a mounting surface of the base member; a fluorescent member including a first main surface and a second main surface respectively positioned on opposite sides of the fluorescent member, the second main surface being fixed to the mounting surface of the base member; a first optical member configured to change a traveling direction of laser light emitted by the laser element to be directed toward the first main surface of the fluorescent member; and a lid connected to the base member and enclosing the laser element, the fluorescent member, and the first optical member in a space beneath the lid, the lid being configured to transmit light from the fluorescent member.Type: GrantFiled: March 29, 2017Date of Patent: September 17, 2019Assignee: NICHIA CORPORATIONInventors: Seiji Kiyota, Hiroaki Yuto, Kei Adachi
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Publication number: 20190199052Abstract: An optical member includes a conversion member including a first surface that serves as a light-irradiated surface or a light extraction surface, and adapted to convert laser light, which is an excitation light, into light having a wavelength different from a wavelength of the excitation light; a holding member holding the conversion member and including a second surface that is continuous with the first surface of the conversion member; and a wiring having an elongated shape and extending continuously along the first surface of the conversion member and the second surface of the holding member.Type: ApplicationFiled: December 21, 2018Publication date: June 27, 2019Applicant: Nichia CorporationInventors: Tomonori MIYOSHI, Masanobu TANAKA, Hiroaki YUTO, Akinori HARA, Teruhiko NOGUCHI
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Patent number: 10180237Abstract: A light emitting device includes a laser light, a wavelength conversion member, a base member and a lid. The wavelength conversion member includes a plurality of projected portions each extending along a first direction on an upper surface side thereof and arranged side by side in a second direction. Each of the plurality of projected portions has a first surface extending along the first direction. The first surface is inclined with respect to a reference surface. The laser light source and the wavelength conversion member are arranged so that an optical axis of first light from the laser light source extends along the second direction when viewed from above and is inclined with respect to the reference surface, and light directly incident to the first surface along a direction parallel to the optical axis of the first light is regularly reflected toward an upward direction.Type: GrantFiled: June 13, 2017Date of Patent: January 15, 2019Assignee: NICHIA CORPORATIONInventors: Masahiko Sano, Hiroaki Yuto, Naoki Eboshi, Toru Takasone
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Publication number: 20180316157Abstract: The method includes the steps of: preparing a single crystal SiC including an upper surface 10a and a lower surface 10b and provided with a micropipe 11 penetrating from the upper surface 10a to the lower surface 10b; forming a first seed layer 21 made of a metal material on the upper surface 10a of the single crystal SiC; and forming a first plated layer 31 on the first seed layer 21 so as to close an upper end of the micropipe 11, using an electroplating method.Type: ApplicationFiled: July 10, 2018Publication date: November 1, 2018Inventors: Akinori YONEDA, Shinya SONOBE, Hiroaki YUTO
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Patent number: 10050411Abstract: The method includes the steps of: preparing a single crystal SiC including an upper surface 10a and a lower surface 10b and provided with a micropipe 11 penetrating from the upper surface 10a to the lower surface 10b; forming a first seed layer 21 made of a metal material on the upper surface 10a of the single crystal SiC; and forming a first plated layer 31 on the first seed layer 21 so as to close an upper end of the micropipe 11, using an electroplating method.Type: GrantFiled: October 22, 2015Date of Patent: August 14, 2018Assignee: NICHIA CORPORATIONInventors: Akinori Yoneda, Shinya Sonobe, Hiroaki Yuto
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Publication number: 20180021889Abstract: A wavelength conversion member manufacturing method includes providing a wavelength conversion member having an upper surface, and forming, in the wavelength conversion member, at least one depressed portion having an inclined surface inclined with respect to the upper surface by irradiating the wavelength conversion member with a pulsed laser beam from above. The forming of the at least one depressed portion includes performing a set of scanning more than once at different processing depths in regions overlapping each other in a top view, the set of scanning includes performing scanning with the pulsed laser beam along a first direction more than once at irradiation positions shifted in a second direction perpendicular to the first direction in the top view, and the performing of the scanning includes applying the pulsed laser beam at a fixed processing depth.Type: ApplicationFiled: July 13, 2017Publication date: January 25, 2018Inventors: Naoki EBOSHI, Hiroaki YUTO
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Publication number: 20170363269Abstract: A light emitting device includes a laser light, a wavelength conversion member, a base member and a lid. The wavelength conversion member includes a plurality of projected portions each extending along a first direction on an upper surface side thereof and arranged side by side in a second direction. Each of the plurality of projected portions has a first surface extending along the first direction. The first surface is inclined with respect to a reference surface. The laser light source and the wavelength conversion member are arranged so that an optical axis of first light from the laser light source extends along the second direction when viewed from above and is inclined with respect to the reference surface, and light directly incident to the first surface along a direction parallel to the optical axis of the first light is regularly reflected toward an upward direction.Type: ApplicationFiled: June 13, 2017Publication date: December 21, 2017Inventors: Masahiko SANO, Hiroaki YUTO, Naoki EBOSHI, Toru TAKASONE
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Publication number: 20170284634Abstract: A light emitting device includes: a base member; a laser element disposed on or above a mounting surface of the base member; a fluorescent member including a first main surface and a second main surface respectively positioned on opposite sides of the fluorescent member, the second main surface being fixed to the mounting surface of the base member; a first optical member configured to change a traveling direction of laser light emitted by the laser element to be directed toward the first main surface of the fluorescent member; and a lid connected to the base member and enclosing the laser element, the fluorescent member, and the first optical member in a space beneath the lid, the lid being configured to transmit light from the fluorescent member.Type: ApplicationFiled: March 29, 2017Publication date: October 5, 2017Applicant: NICHIA CORPORATIONInventors: Seiji KIYOTA, Hiroaki YUTO, Kei ADACHI
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Patent number: 9496680Abstract: A semiconductor laser device can include an insulating single crystal SiC having a first surface, a second surface, and micropipes having openings in the first surface and the second surface. A conductive base can be provided on a side of the first surface of the single crystal SiC, and a semiconductor laser element can be provided on a side of the second surface of the single crystal SiC. An insulating member can be formed in the micropipes.Type: GrantFiled: March 1, 2016Date of Patent: November 15, 2016Assignee: NICHIA CORPORATIONInventors: Hiroki Sakata, Hiroaki Yuto, Eiichiro Okahisa, Kazuma Kozuru
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Publication number: 20160181760Abstract: A semiconductor laser device can include an insulating single crystal SiC having a first surface, a second surface, and micropipes having openings in the first surface and the second surface. A conductive base can be provided on a side of the first surface of the single crystal SiC, and a semiconductor laser element can be provided on a side of the second surface of the single crystal SiC. An insulating member can be formed in the micropipes.Type: ApplicationFiled: March 1, 2016Publication date: June 23, 2016Inventors: Hiroki SAKATA, Hiroaki YUTO, Eiichiro OKAHISA, Kazuma KOZURU
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Publication number: 20160118767Abstract: The method includes the steps of: preparing a single crystal SiC including an upper surface 10a and a lower surface 10b and provided with a micropipe 11 penetrating from the upper surface 10a to the lower surface 10b; forming a first seed layer 21 made of a metal material on the upper surface 10a of the single crystal SiC; and forming a first plated layer 31 on the first seed layer 21 so as to close an upper end of the micropipe 11, using an electroplating method.Type: ApplicationFiled: October 22, 2015Publication date: April 28, 2016Inventors: Akinori YONEDA, Shinya SONOBE, Hiroaki YUTO