Abstract: In an issue processing system for a right to use a resource in a data processing system having a global service program based on a fault-tolerant method providing a current processing server and a spare processing server, the resource management server includes: a re-transmission examination unit for examining a message from the processing server and determining whether it is a re-transmitted message based on a discriminator attached to the message for requesting acquirement of the right to use the resource; a discriminator addition unit for adding the discriminator to the message for requesting the right to use to be issued when that right to use is registered; and a right to use examination unit for examining whether the message is already registered based on a previous message for the re-transmission by referring to the discriminator attached by the discriminator addition unit when the message indicates the re-transmission message based on the detection of the re-transmission examination unit; wherein, whe

Abstract: Data rates of a first video signal and a second video signal which are significantly different are converted to respective predetermined data rates, and both the video signals of one frame are divided into respective numbers of macro block. A ratio of the number of macro block of the first video signal to the number of macro block of the second signal is made to 1:n, where n is a natural number, and a ratio of the number of pixel in one macro block of a color difference signal of the first video signal to the number of pixel in one macro block of the color difference signal of the second video signal is made to 1:m, where m is a natural number. A ratio of the data rate of the color difference signal of the first video signal to the data rate of the color difference signal of the second video signal is made to 1:n.times.m and a ratio of a moving speed of a magnetic tape in the first video signal to a moving speed of the magnetic tape in the second video image is made to 1:n.

Abstract: A transfer molded semiconductor method arranges a semiconductor chip on a flat die pad so that, at least one predetermined edge surface of the semiconductor chip extends or protrudes over a corresponding edge of the flat die pad. The predetermined edge of the die pad is arranged on the opposite side of a gate beneath a lead frame at the other side. The arrangement suppresses the formation of voids at a side surface of the semiconductor chip, e.g., the side surface opposite the gate at which resin is injected.

Abstract: Digital video signal of one frame is converted to macro blocks which are arranged in a predetermined order in one rectangular block. The macro blocks are converted to synchronizing block data and are recorded in a predetermined number of tracks of a magnetic tape. In high speed reproducing operation, a tape running speed is selected to a reference speed at which scanning areas of the tracks of successive frames having the same track number are shifted in a direction every frame number, and video data which are on every other frame are arranged on the reproduced video image.

Abstract: In a file access processing system for executing sequential access for a copied file in a data processing device which includes a data processing unit and an access processing unit, and the data processing device being connected to an external storage device having a file management table and a copy file, the access processing unit includes: an access executing unit for executing an access to the file management table and the copy file in the external storage device; a setting unit for setting file organization information into the file management table, after the setting unit obtains the file organization information, which indicates whether the file is a record file or it is a stream file, by referring to the head information of the file when the copied file is first sequentially accessed; and a judgment unit for detecting whether the file is a record file or it is the stream file by referring to the file organization information set into the file management table of the file when the copied file is sequent

Abstract: A semiconductor device has a semiconductor element mounted on inner leads of a TAB tape and first and second heat radiator elements having respective first and second peripheral flanges which cooperatively engage and thereby support the TAB tape in a sandwich manner therebetween, at least one heat radiator member having a central portion protruding toward and providing a support for the semiconductor element. A sealing resin fills the space between the heat radiator members and thereby integrally interconnects and hermetically seals interior surfaces of the leads of the TAB tape. A central portion of at least one of the heat radiator members protrudes toward and provides a support for the semiconductor element.

Abstract: In a video signal digital magnetic recording and/or reproducing apparatus, an input image data array is rearranged into a different data array appropriate for data compression and then subjected to a data compression by variable length coding. The resulting data are rearranged after the data compression and then recorded sequentially onto a video track of a magnetic tape in the same order as that in the frame. In a high-speed playback mode, only the lower frequency component data is decoded every sync block, so that the data reproduced from one video track adjoin each other in the playback picture on the screen.

Abstract: A method of spraying release agent on a semiconductor chip molding die. The die has a pot for supplying resin to be molded, cavities in which semiconductor chips to be packaged are disposed, respectively, and a runner disposed between the pot and the cavities, for conducting the resin from the pot to the cavities. This method includes the steps of spraying at least the pot and the runner mentioned above with non-silicone release agent and selectively spraying only the cavities with silicone-based release agent.

Abstract: A TAB tape or tape-like carrier used for an automatic bonding process when manufacturing high-frequency semiconductor devices has a plurality of electrically conductive circuit patterns on a flexible insulative film having a plurality of holes located in gaps between adjacent circuit patterns. A ground layer is formed on a back surface of the insulative film, and electrically conductive layers or material are formed on inner peripherals walls of the holes or filled in the holes, so that the ground layer is electrically connected to the respective condcutive layers or material.

Abstract: A TAB tape or tape-like carrier used for an automatic bonding process when manufacturing high-frequency semiconductor devices has a plurality of electrically conductive circuit patterns on a flexible insulative film having a plurality of holes located in gaps between adjacent circuit pattterns. A ground layer is formed on a back surface of the insulative film, and electrically conductive layers or material are formed on inner peripherals walls of the holes or filled in the holes, so that the ground layer is electrically connected to the respective conductive layers or material.

Abstract: A transfer sheet includes an electrodeposited metal foil having a smooth surface and a rough surface attached to a heatproof flexible base sheet. Using such a transfer sheet, a circuit substrate is formed by etching the electrodeposited metal foil to form a circuit pattern, placing the transfer sheet into a cavity of a mold in such a manner that the rough surface of the circuit pattern faces an inside of the mold cavity, pouring a melting resin into the mold cavity to form a molded article, and peeling the transfer sheet from the molded article so that the circuit pattern remains on the resin base.

Abstract: A process for forming a circuit substrate comprising placing an electrodeposited metal foil having a rough surface provided with a large number of fine projections in a cavity of a mold in such a manner that the rough surface faces an inside of the mold cavity; pouring a melting resin into the mold cavity to form a molded article; peeling the metal foil from the molded article to form a large number of fine concavities corresponding to the projections; electroless-plating the resin base to form a metal film; and photoetching to form a circuit pattern on the resin base.