Patents by Inventor Hiroharu Inoue

Hiroharu Inoue has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11957014
    Abstract: A display device includes: a plurality of control lines; a plurality of power supply lines; a plurality of data signal lines; an oxide semiconductor layer; a first metal layer; a gate insulation film; a first inorganic insulation film; a second metal layer; a second inorganic insulation film; and a third metal layer. The oxide semiconductor layer, in a plan view, contains therein semiconductor lines formed as isolated regions between a plurality of drivers and a display area. The semiconductor lines cross the plurality of control lines and the plurality of power supply lines, are in contact with the plurality of control lines via an opening in a gate insulation film, are in contact with the plurality of power supply lines via an opening in the first inorganic insulation film, and have a plurality of narrowed portions, such that thicker and thinner regions exist along the same line.
    Type: Grant
    Filed: July 30, 2018
    Date of Patent: April 9, 2024
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Tohru Okabe, Shinsuke Saida, Shinji Ichikawa, Hiroki Taniyama, Ryosuke Gunji, Kohji Ariga, Yoshihiro Nakada, Koji Tanimura, Yoshihiro Kohara, Hiroharu Jinmura, Akira Inoue
  • Patent number: 11950462
    Abstract: A first conductive layer in the same layer as that of a first electrode is coupled to a third conductive layer and a second electrode in the same layer as that of a third metal layer through a slit formed in a flattening film of a non-display area. Second conductive layers in the same layer as that of a second metal layer are provided to overlap with the slit.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: April 2, 2024
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Tohru Okabe, Shinsuke Saida, Shinji Ichikawa, Hiroki Taniyama, Ryosuke Gunji, Kohji Ariga, Yoshihiro Nakada, Koji Tanimura, Yoshihiro Kohara, Akira Inoue, Hiroharu Jinmura, Takeshi Yaneda
  • Patent number: 11945910
    Abstract: One aspect of the present invention relates to a resin composition containing (A) a thermosetting compound having a styrene structure or a (meth)acrylate structure, and (B) a maleimide compound represented by the following formula (1): wherein in the formula, p represents an integer of 1 to 10, in which the content ratio of the component (A) to the component (B) is (A):(B)=50:50 to 90:10 in mass ratio.
    Type: Grant
    Filed: March 11, 2019
    Date of Patent: April 2, 2024
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hiroaki Umehara, Rihoko Watanabe, Hiroharu Inoue, Yiqun Wang
  • Publication number: 20240084133
    Abstract: One aspect of the present application relates to a polyphenylene ether resin composition including a modified polyphenylene ether compound (A) that is terminally modified with a substituent having a carbon-carbon unsaturated double bond, and a crosslinking-type curing agent (B) having two or more carbon-carbon unsaturated double bonds in each molecule, the modified polyphenylene ether compound (A) including a modified polyphenylene ether compound (A-1) having a specific structure, and a modified polyphenylene ether compound (A-2) having a specific structure.
    Type: Application
    Filed: November 22, 2023
    Publication date: March 14, 2024
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hiroaki UMEHARA, Fumito SUZUKI, Jun YASUMOTO, Hiroharu INOUE
  • Patent number: 11905409
    Abstract: An aspect of the present invention relates to a resin composition containing a polyphenylene ether compound having at least one of the groups represented by Formulas (1) and (2); and an allyl compound having a group represented by Formula (3).
    Type: Grant
    Filed: February 22, 2023
    Date of Patent: February 20, 2024
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Kosuke Tsuda, Hirosuke Saito, Yiqun Wang, Hiroharu Inoue
  • Patent number: 11866580
    Abstract: One aspect of the present application relates to a polyphenylene ether resin composition including a modified polyphenylene ether compound (A) that is terminally modified with a substituent having a carbon-carbon unsaturated double bond, and a crosslinking-type curing agent (B) having two or more carbon-carbon unsaturated double bonds in each molecule, the modified polyphenylene ether compound (A) including a modified polyphenylene ether compound (A-1) having a specific structure, and a modified polyphenylene ether compound (A-2) having a specific structure.
    Type: Grant
    Filed: October 16, 2018
    Date of Patent: January 9, 2024
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hiroaki Umehara, Fumito Suzuki, Jun Yasumoto, Hiroharu Inoue
  • Publication number: 20230357558
    Abstract: A resin composition contains a styrenic block copolymer, a radical polymerizable compound, and at least one free radical compound selected from the group consisting of a compound (A) represented by Formula (1), a compound (B) represented by Formula (2), and a compound (C) having two or more of at least one group selected from groups represented by Formulas (3-1) and (3-2).
    Type: Application
    Filed: September 10, 2021
    Publication date: November 9, 2023
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Yiqun WANG, Hirosuke SAITO, Hiroharu INOUE
  • Publication number: 20230331944
    Abstract: A resin composition contains a maleimide compound (A) that has a maleimide equivalent of 500 g/eq. or less, is solid at 25° C., and dissolves at one or more concentration in a range of 40% by mass or more and less than 100% by mass as a concentration of the maleimide compound in a mixture of at least one selected from the group consisting of toluene and methyl ethyl ketone and the maleimide compound at 25° C.; and a polymerizable compound (B) having a carbon-carbon unsaturated double bond in a molecule and a proportion of a total mass of heteroatoms to a total mass of all constituent elements of 15% by mass or less.
    Type: Application
    Filed: September 9, 2021
    Publication date: October 19, 2023
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hirosuke SAITO, Hiroaki UMEHARA, Hiroharu INOUE, Rihoko WATANABE
  • Publication number: 20230331957
    Abstract: A resin composition contains a maleimide compound (A) having an indane structure in the molecule, and a styrenic polymer being solid at 25° C.
    Type: Application
    Filed: September 9, 2021
    Publication date: October 19, 2023
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Rihoko WATANABE, Hirosuke SAITO, Hiroaki UMEHARA, Hiroharu INOUE
  • Publication number: 20230323104
    Abstract: A resin composition contains a maleimide compound (A) having an arylene structure bonded in the meta-orientation in the molecule, and a styrenic polymer being solid at 25° C.
    Type: Application
    Filed: September 9, 2021
    Publication date: October 12, 2023
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Rihoko WATANABE, Hirosuke SAITO, Hiroaki UMEHARA, Hiroharu INOUE
  • Publication number: 20230257581
    Abstract: A resin composition contains a maleimide compound (A) and a phosphorus-containing compound (B). The maleimide compound (A) includes a first maleimide compound (A1) having an alkyl group, of which a carbon number is equal to or greater than six, and/or an alkylene group, of which a carbon number is equal to or greater than six. The phosphorus-containing compound (B) includes a phosphorus-containing compound (B1) having a structure expressed by the following formula (b1), where s indicates an integer falling within a range from 1 to 10, Z indicates either an arylene group or an ester bond expressed by the following formula (b1.1), R1 to R3 each independently indicate either a hydrogen atom or a monovalent organic group, and * indicates a bond.
    Type: Application
    Filed: June 14, 2021
    Publication date: August 17, 2023
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Jun YASUMOTO, Rihoko WATANABE, Teppei WASHIO, Hiroharu INOUE
  • Publication number: 20230250282
    Abstract: A resin composition contains a maleimide compound (A), a phosphine oxide compound (B), and an epoxy compound (C). The maleimide compound (A) includes a maleimide compound (A1) having an alkyl group, of which a carbon number is equal to or greater than six, and/or an alkylene group, of which a carbon number is equal to or greater than six. The phosphine oxide compound (B) has a structure expressed by the following formula (b0), where X is a monovalent or divalent hydrocarbon group having at least one aromatic ring or an alkylene group and n is either 1 or 2.
    Type: Application
    Filed: June 14, 2021
    Publication date: August 10, 2023
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Rihoko WATANABE, Jun YASUMOTO, Hiroharu INOUE
  • Publication number: 20230250281
    Abstract: A resin composition contains a curable resin. A minimum value (Min) of loss tangent (tan? = E?/E?) of a cured product of the resin composition is equal to or greater than 0.04. The loss tangent is a ratio of a loss modulus (E?) of the cured product of the resin composition to a storage modulus (E?) thereof. The loss modulus (E?), the storage modulus (E?), and the loss tangent (tan? = E?/E?) are obtained by dynamic mechanical analysis at a temperature equal to or higher than 100° C. and equal to or lower than 200° C.
    Type: Application
    Filed: June 14, 2021
    Publication date: August 10, 2023
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Jun YASUMOTO, Rihoko WATANABE, Teppei WASHIO, Hiroharu INOUE
  • Publication number: 20230193024
    Abstract: An aspect of the present invention relates to a resin composition containing a polyphenylene ether compound having at least one of the groups represented by Formulas (1) and (2); and an allyl compound having a group represented by Formula (3).
    Type: Application
    Filed: February 22, 2023
    Publication date: June 22, 2023
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Kosuke TSUDA, Hirosuke SAITO, Yiqun WANG, Hiroharu INOUE
  • Publication number: 20220259363
    Abstract: An aspect of the present invention is a resin composition containing a first styrene-based block copolymer having a hardness of 20 to 70, a polyphenylene ether compound having at least one of a group represented by the following Formula (1) and a group represented by the following Formula (2) in a molecule, and a curing agent. In Formula (1), p represents 0 to 10, Z represents an arylene group, and R1 to R3 each independently represent a hydrogen atom or an alkyl group. In Formula (2), R4 represents a hydrogen atom or an alkyl group.
    Type: Application
    Filed: July 16, 2020
    Publication date: August 18, 2022
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hirosuke SAITO, Yiqun WANG, Hiroharu INOUE
  • Publication number: 20220259424
    Abstract: An aspect of the present invention is a resin composition containing a polybutadiene compound having an epoxy group in a molecule, a polyphenylene ether compound having at least one of a group represented by the following Formula (1) and a group represented by the following Formula (2) in a molecule, a styrene-based block copolymer, and a curing agent. In Formula (1), p represents 0 to 10, Z represents an arylene group, and R1 to R3 each independently represent a hydrogen atom or an alkyl group. In Formula (2), R4 represents a hydrogen atom or an alkyl group.
    Type: Application
    Filed: July 16, 2020
    Publication date: August 18, 2022
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hirosuke SAITO, Yiqun WANG, Hiroharu INOUE
  • Patent number: 11407869
    Abstract: Disclosed herein is a prepreg including a woven fabric base and a semi-cured product of a resin composition impregnated into the woven fabric base. The resin composition contains a maleimide resin as Component (A), an acrylic resin as Component (B), and a phenol resin as Component (C). The Component (B) has a weight average molecular weight falling within the range from 200,000 to 850,000.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: August 9, 2022
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Keiko Kashihara, Rihoko Watanabe, Hiroharu Inoue
  • Publication number: 20220243013
    Abstract: A resin composition includes a modified poly(phenylene ether) compound having a carbon-carbon unsaturated double bond at a molecular end, a maleimide compound having two or more N-substituted maleimide groups in the molecule, and a styrene-based polymer having a weight-average molecular weight less than 10,000.
    Type: Application
    Filed: March 18, 2020
    Publication date: August 4, 2022
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hiroaki UMEHARA, Yiqun WANG, Hiroharu INOUE
  • Patent number: 11365274
    Abstract: A resin composition is provided and includes (A) a modified polyphenylene ether compound terminal-modified with a substituent having a carbon-carbon unsaturated double bond, (B) a maleimide compound containing no phenylmaleimide group and having a hydrocarbon group having 10 or more carbon atoms in the molecule thereof, and (C) at least one selected from a maleimide compound containing a phenylmaleimide group and a maleimide compound having an aliphatic hydrocarbon group having 9 or less carbon atoms in the molecule thereof, in which the content ratio of the component (A) to the component (B) is (A):(B)=20:80 to 90:10 in mass ratio.
    Type: Grant
    Filed: March 11, 2019
    Date of Patent: June 21, 2022
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hiroaki Umehara, Yiqun Wang, Hiroharu Inoue
  • Patent number: 11234329
    Abstract: A prepreg is used to fabricate a semiconductor package including a chip and a substrate to mount the chip thereon. The prepreg is in a semi-cured state. The substrate includes a cured product of the prepreg. The chip has: a first chip surface located opposite from the substrate; and a second chip surface located opposite from the first chip surface. The prepreg satisfies the relational expression: 0.9?X2/X1?1.0 (I), where X1 is a coefficient of thermal expansion of the first chip surface of the chip before the chip is mounted on the substrate, and X2 is a coefficient of thermal expansion of the first chip surface of the chip after the chip has been mounted on the substrate.
    Type: Grant
    Filed: December 4, 2018
    Date of Patent: January 25, 2022
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Rihoko Watanabe, Keiko Kashihara, Hiroharu Inoue