Patents by Inventor Hiroharu Inoue

Hiroharu Inoue has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220376032
    Abstract: A display device according to an aspect of the disclosure includes a first metal protrusion being in contact with a first power-source trunk wire, and a second metal protrusion being in contact with a second power-source trunk wire. A first bank defining the end of an organic sealing film includes the first metal protrusion, the second metal protrusion, and a first resin protrusion. The first resin protrusion overlaps the first and second metal protrusions. The first resin protrusion has a frame shape.
    Type: Application
    Filed: September 19, 2019
    Publication date: November 24, 2022
    Inventors: Tohru OKABE, Shinsuke SAIDA, Shinji ICHIKAWA, Ryosuke GUNJI, Akira INOUE, Yoshihiro NAKADA, Hiroharu JINMURA
  • Patent number: 11508792
    Abstract: In a display region, etching stopper layers are provided between a plurality of inorganic insulating films, openings are formed in the inorganic insulating films located closer to a light-emitting element than the etching stopper layers so as to expose the upper surfaces of the etching stopper layers, and flattening films are provided in the openings such that the openings are filed with the flattening films.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: November 22, 2022
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Tohru Okabe, Ryosuke Gunji, Shinji Ichikawa, Kohji Ariga, Shinsuke Saida, Hiroki Taniyama, Hiroharu Jinmura, Yoshihiro Nakada, Koji Tanimura, Yoshihiro Kohara, Akira Inoue
  • Publication number: 20220293714
    Abstract: Contact holes related to routed wires electrically connected to data signal lines running through the corner portions of a display region are larger in number than contact holes related to routed wires electrically connected to data signal lines running through the center portion of the display region.
    Type: Application
    Filed: September 27, 2019
    Publication date: September 15, 2022
    Inventors: Ryosuke GUNJI, Shinsuke SAIDA, Shinji ICHIKAWA, Tohru OKABE, Akira INOUE, Yoshihiro NAKADA, Hiroharu JINMURA
  • Patent number: 11430857
    Abstract: The display device includes a non-display area. The non-display area includes: a slit formed in an edge cover; a first conductive layer formed in the same layer as an anode, and being in contact with a cathode; and a second conductive layer formed in the same layer as a capacitance electrode and provided to overlap the slit.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: August 30, 2022
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Tohru Okabe, Shinsuke Saida, Shinji Ichikawa, Hiroki Taniyama, Ryosuke Gunji, Takeshi Yaneda, Yoshihiro Nakada, Hiroharu Jinmura, Akira Inoue
  • Publication number: 20220259363
    Abstract: An aspect of the present invention is a resin composition containing a first styrene-based block copolymer having a hardness of 20 to 70, a polyphenylene ether compound having at least one of a group represented by the following Formula (1) and a group represented by the following Formula (2) in a molecule, and a curing agent. In Formula (1), p represents 0 to 10, Z represents an arylene group, and R1 to R3 each independently represent a hydrogen atom or an alkyl group. In Formula (2), R4 represents a hydrogen atom or an alkyl group.
    Type: Application
    Filed: July 16, 2020
    Publication date: August 18, 2022
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hirosuke SAITO, Yiqun WANG, Hiroharu INOUE
  • Publication number: 20220259424
    Abstract: An aspect of the present invention is a resin composition containing a polybutadiene compound having an epoxy group in a molecule, a polyphenylene ether compound having at least one of a group represented by the following Formula (1) and a group represented by the following Formula (2) in a molecule, a styrene-based block copolymer, and a curing agent. In Formula (1), p represents 0 to 10, Z represents an arylene group, and R1 to R3 each independently represent a hydrogen atom or an alkyl group. In Formula (2), R4 represents a hydrogen atom or an alkyl group.
    Type: Application
    Filed: July 16, 2020
    Publication date: August 18, 2022
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hirosuke SAITO, Yiqun WANG, Hiroharu INOUE
  • Patent number: 11407869
    Abstract: Disclosed herein is a prepreg including a woven fabric base and a semi-cured product of a resin composition impregnated into the woven fabric base. The resin composition contains a maleimide resin as Component (A), an acrylic resin as Component (B), and a phenol resin as Component (C). The Component (B) has a weight average molecular weight falling within the range from 200,000 to 850,000.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: August 9, 2022
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Keiko Kashihara, Rihoko Watanabe, Hiroharu Inoue
  • Publication number: 20220243013
    Abstract: A resin composition includes a modified poly(phenylene ether) compound having a carbon-carbon unsaturated double bond at a molecular end, a maleimide compound having two or more N-substituted maleimide groups in the molecule, and a styrene-based polymer having a weight-average molecular weight less than 10,000.
    Type: Application
    Filed: March 18, 2020
    Publication date: August 4, 2022
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hiroaki UMEHARA, Yiqun WANG, Hiroharu INOUE
  • Patent number: 11398542
    Abstract: In a step of forming a plurality of control lines composed of a first metal layer a first metal layer branch line is formed. In a step of forming a plurality of power source lines composed of a second metal layer a second metal layer connecting portion is formed that connects each power source line with the first metal layer branch line via an opening of a first insulating film. In a step of forming a plurality of data signal lines composed of a third metal layer that is formed on a second insulating film the first metal layer branch line formed in the opening of the first insulating and the second metal layer connecting portion formed in an opening of the second insulating film are etched.
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: July 26, 2022
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Tohru Okabe, Shinsuke Saida, Shinji Ichikawa, Hiroki Taniyama, Ryosuke Gunji, Kohji Ariga, Yoshihiro Nakada, Koji Tanimura, Yoshihiro Kohara, Hiroharu Jinmura, Akira Inoue
  • Patent number: 11365274
    Abstract: A resin composition is provided and includes (A) a modified polyphenylene ether compound terminal-modified with a substituent having a carbon-carbon unsaturated double bond, (B) a maleimide compound containing no phenylmaleimide group and having a hydrocarbon group having 10 or more carbon atoms in the molecule thereof, and (C) at least one selected from a maleimide compound containing a phenylmaleimide group and a maleimide compound having an aliphatic hydrocarbon group having 9 or less carbon atoms in the molecule thereof, in which the content ratio of the component (A) to the component (B) is (A):(B)=20:80 to 90:10 in mass ratio.
    Type: Grant
    Filed: March 11, 2019
    Date of Patent: June 21, 2022
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hiroaki Umehara, Yiqun Wang, Hiroharu Inoue
  • Patent number: 11234329
    Abstract: A prepreg is used to fabricate a semiconductor package including a chip and a substrate to mount the chip thereon. The prepreg is in a semi-cured state. The substrate includes a cured product of the prepreg. The chip has: a first chip surface located opposite from the substrate; and a second chip surface located opposite from the first chip surface. The prepreg satisfies the relational expression: 0.9?X2/X1?1.0 (I), where X1 is a coefficient of thermal expansion of the first chip surface of the chip before the chip is mounted on the substrate, and X2 is a coefficient of thermal expansion of the first chip surface of the chip after the chip has been mounted on the substrate.
    Type: Grant
    Filed: December 4, 2018
    Date of Patent: January 25, 2022
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Rihoko Watanabe, Keiko Kashihara, Hiroharu Inoue
  • Patent number: 11066548
    Abstract: A polyphenylene ether resin composition includes a modified polyphenylene ether copolymer, a high-molecular-weight compound, and a crosslinking agent for the modified polyphenylene ether copolymer. The modified polyphenylene ether copolymer includes a substituent having a carbon-carbon unsaturated double bond at a molecular chain end of the modified polyphenylene ether copolymer. The high-molecular-weight compound has a glass transition temperature (Tg) measured by differential scanning calorimetry of 20° C. or lower and has a number-average molecular weight Mn ranging from 1000 to 10000, inclusive. The crosslinking agent includes at least two carbon-carbon unsaturated double bonds per molecule, and includes at least one of dicyclopentadiene acrylate and dicyclopentadiene methacrylate. In a cured state of the polyphenylene ether resin composition, the modified polyphenylene ether copolymer is phase separated from the high-molecular-weight compound.
    Type: Grant
    Filed: May 21, 2020
    Date of Patent: July 20, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hiroaki Umehara, Hiroharu Inoue
  • Patent number: 11059260
    Abstract: A prepreg including: a woven cloth substrate; and a semi-cured product of a resin composition. The resin composition contains: at least one of an (A1) component and an (A2) component, a (B) component; a (C1) component; and a (C2) component. The (A1) component is an epoxy resin having at least one of a naphthalene skeleton and a biphenyl skeleton. The (A2) component is a phenol resin having at least one of a naphthalene skeleton and a biphenyl skeleton. The (B) component is a high molecular weight polymer. The (C1) component is a first filler obtained by treating surfaces of a first inorganic filler with a first silane coupling agent represented by formula (c1). The (C2) component is a second filler obtained by treating surfaces of a second inorganic filler with a second silane coupling agent represented by formula (c2).
    Type: Grant
    Filed: July 19, 2017
    Date of Patent: July 13, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Keiko Kashihara, Takashi Hoshi, Hiroharu Inoue
  • Publication number: 20210092835
    Abstract: A prepreg is used to fabricate a semiconductor package including a chip and a substrate to mount the chip thereon. The prepreg is in a semi-cured state. The substrate includes a cured product of the prepreg. The chip has: a first chip surface located opposite from the substrate; and a second chip surface located opposite from the first chip surface. The prepreg satisfies the relational expression: 0.9?X2/X1?1.0 (I), where X1 is a coefficient of thermal expansion of the first chip surface of the chip before the chip is mounted on the substrate, and X2 is a coefficient of thermal expansion of the first chip surface of the chip after the chip has been mounted on the substrate.
    Type: Application
    Filed: December 4, 2018
    Publication date: March 25, 2021
    Inventors: Rihoko WATANABE, Keiko KASHIHARA, Hiroharu INOUE
  • Publication number: 20210061996
    Abstract: One aspect of the present application relates to a polyphenylene ether resin composition including a modified polyphenylene ether compound (A) that is terminally modified with a substituent having a carbon-carbon unsaturated double bond, and a crosslinking-type curing agent (B) having two or more carbon-carbon unsaturated double bonds in each molecule, the modified polyphenylene ether compound (A) including a modified polyphenylene ether compound (A-1) having a specific structure, and a modified polyphenylene ether compound (A-2) having a specific structure.
    Type: Application
    Filed: October 16, 2018
    Publication date: March 4, 2021
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hiroaki UMEHARA, Fumito SUZUKI, Jun YASUMOTO, Hiroharu INOUE
  • Publication number: 20210054197
    Abstract: One aspect of the present invention relates to a resin composition containing (A) a thermosetting compound having a styrene structure or a (meth)acrylate structure, and (B) at least one of maleimide compounds represented by the formulas (1) to (3).
    Type: Application
    Filed: March 11, 2019
    Publication date: February 25, 2021
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hiroaki UMEHARA, Rihoko WATANABE, Hiroharu INOUE, Yiqun WANG
  • Publication number: 20210032424
    Abstract: A resin composition is provided and contains (A) a thermosetting compound having a styrene structure or a (meth)acrylate structure, and (B) a maleimide compound represented by the following formula (1) (in the formula, p represents an integer of 1 to 10), in which the content ratio of the component (A) to the component (B) is (A):(B)=20:80 to 90:10 in mass ratio.
    Type: Application
    Filed: March 11, 2019
    Publication date: February 4, 2021
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hiroaki UMEHARA, Rihoko WATANABE, Hiroharu INOUE, Yiqun WANG
  • Publication number: 20210017317
    Abstract: A resin composition is provided and includes (A) a modified polyphenylene ether compound terminal-modified with a substituent having a carbon-carbon unsaturated double bond, (B) a maleimide compound containing no phenylmaleimide group and having a hydrocarbon group having 10 or more carbon atoms in the molecule thereof, and (C) at least one selected from a maleimide compound containing a phenylmaleimide group and a maleimide compound having an aliphatic hydrocarbon group having 9 or less carbon atoms in the molecule thereof, in which the content ratio of the component (A) to the component (B) is (A):(B)=20:80 to 90:10 in mass ratio.
    Type: Application
    Filed: March 11, 2019
    Publication date: January 21, 2021
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hiroaki UMEHARA, Yiqun WANG, Hiroharu INOUE
  • Publication number: 20200283615
    Abstract: A polyphenylene ether resin composition includes a modified polyphenylene ether copolymer, a high-molecular-weight compound, and a crosslinking agent for the modified polyphenylene ether copolymer. The modified polyphenylene ether copolymer includes a substituent having a carbon-carbon unsaturated double bond at a molecular chain end of the modified polyphenylene ether copolymer. The high-molecular-weight compound has a glass transition temperature (Tg) measured by differential scanning calorimetry of 20° C. or lower and has a number-average molecular weight Mn ranging from 1000 to 10000, inclusive. The crosslinking agent includes at least two carbon-carbon unsaturated double bonds per molecule, and includes at least one of dicyclopentadiene acrylate and dicyclopentadiene methacrylate. In a cured state of the polyphenylene ether resin composition, the modified polyphenylene ether copolymer is phase separated from the high-molecular-weight compound.
    Type: Application
    Filed: May 21, 2020
    Publication date: September 10, 2020
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hiroaki UMEHARA, Hiroharu INOUE
  • Publication number: 20200181403
    Abstract: The present application relates to a polyphenylene ether resin composition containing (A) a modified polyphenylene ether compound having a terminal modified with a substituent having an unsaturated carbon-carbon double bond, (B) a crosslinking curing agent having an unsaturated carbon-carbon double bond in the molecule, and (C) a flame retardant. The flame retardant (C) contains at least a modified cyclic phenoxy phosphazene compound represented by formula (I).
    Type: Application
    Filed: June 29, 2018
    Publication date: June 11, 2020
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Fumito SUZUKI, Hiroaki UMEHARA, Jun YASUMOTO, Hiroharu INOUE