Abstract: A resin composition includes: a compound (A) represented by the following formula wherein X is 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-yl-10-oxide and Y is a protecting group; and a thermosetting resin (B) containing at least one selected from among an epoxy resin, a polyphenylene ether resin, a cyanate ester resin, a phenol resin, an active ester resin, a benzoxazine resin, a maleimide resin, an acrylic resin, a methacrylic resin, a vinyl resin, an allyl resin, a propenyl resin, and a hydrocarbon-based resin having an unsaturated double bond.

Abstract: An aspect of the present invention is a resin composition containing at least one of a polyphenylene ether compound (A), having at least one of a group represented by the following Formula (1) and a group represented by the following Formula (2) in the molecule, and a maleimide compound (B); and ceramic particles (C) including aluminum titanate particles (C1). In Formula (1), p represents 0 to 10, Ar represents an arylene group, and R1 to R3 each independently represent a hydrogen atom or an alkyl group. In Formula (2), R4 represents a hydrogen atom or an alkyl group.

Abstract: A resin composition contains a curable resin. A quantity of outgas emitted from a cured product of the resin composition at a temperature falling within a range from 30° C. to 550° C. when the cured product is subjected to a thermal gravimetric analysis with a temperature increased from 30° C. to 800° C. at a temperature increase rate of 90° C. per minute is less than 27% by mass with respect to an entire mass of the cured product.

Abstract: One aspect of the present invention relates to a resin composition containing (A) a thermosetting compound having a styrene structure or a (meth)acrylate structure, and (B) a maleimide compound represented by the following formula (1): wherein in the formula, p represents an integer of 1 to 10, in which the content ratio of the component (A) to the component (B) is (A):(B)=50:50 to 90:10 in mass ratio.

Abstract: One aspect of the present application relates to a polyphenylene ether resin composition including a modified polyphenylene ether compound (A) that is terminally modified with a substituent having a carbon-carbon unsaturated double bond, and a crosslinking-type curing agent (B) having two or more carbon-carbon unsaturated double bonds in each molecule, the modified polyphenylene ether compound (A) including a modified polyphenylene ether compound (A-1) having a specific structure, and a modified polyphenylene ether compound (A-2) having a specific structure.

Abstract: An aspect of the present invention relates to a resin composition containing a polyphenylene ether compound having at least one of the groups represented by Formulas (1) and (2); and an allyl compound having a group represented by Formula (3).

Abstract: One aspect of the present application relates to a polyphenylene ether resin composition including a modified polyphenylene ether compound (A) that is terminally modified with a substituent having a carbon-carbon unsaturated double bond, and a crosslinking-type curing agent (B) having two or more carbon-carbon unsaturated double bonds in each molecule, the modified polyphenylene ether compound (A) including a modified polyphenylene ether compound (A-1) having a specific structure, and a modified polyphenylene ether compound (A-2) having a specific structure.

Abstract: A resin composition contains a styrenic block copolymer, a radical polymerizable compound, and at least one free radical compound selected from the group consisting of a compound (A) represented by Formula (1), a compound (B) represented by Formula (2), and a compound (C) having two or more of at least one group selected from groups represented by Formulas (3-1) and (3-2).

Abstract: A resin composition contains a maleimide compound (A) having an indane structure in the molecule, and a styrenic polymer being solid at 25° C.

Abstract: A resin composition contains a maleimide compound (A) that has a maleimide equivalent of 500 g/eq. or less, is solid at 25° C., and dissolves at one or more concentration in a range of 40% by mass or more and less than 100% by mass as a concentration of the maleimide compound in a mixture of at least one selected from the group consisting of toluene and methyl ethyl ketone and the maleimide compound at 25° C.; and a polymerizable compound (B) having a carbon-carbon unsaturated double bond in a molecule and a proportion of a total mass of heteroatoms to a total mass of all constituent elements of 15% by mass or less.

Abstract: A resin composition contains a maleimide compound (A) having an arylene structure bonded in the meta-orientation in the molecule, and a styrenic polymer being solid at 25° C.

Abstract: A resin composition contains a maleimide compound (A) and a phosphorus-containing compound (B). The maleimide compound (A) includes a first maleimide compound (A1) having an alkyl group, of which a carbon number is equal to or greater than six, and/or an alkylene group, of which a carbon number is equal to or greater than six. The phosphorus-containing compound (B) includes a phosphorus-containing compound (B1) having a structure expressed by the following formula (b1), where s indicates an integer falling within a range from 1 to 10, Z indicates either an arylene group or an ester bond expressed by the following formula (b1.1), R1 to R3 each independently indicate either a hydrogen atom or a monovalent organic group, and * indicates a bond.

Abstract: A resin composition contains a maleimide compound (A), a phosphine oxide compound (B), and an epoxy compound (C). The maleimide compound (A) includes a maleimide compound (A1) having an alkyl group, of which a carbon number is equal to or greater than six, and/or an alkylene group, of which a carbon number is equal to or greater than six. The phosphine oxide compound (B) has a structure expressed by the following formula (b0), where X is a monovalent or divalent hydrocarbon group having at least one aromatic ring or an alkylene group and n is either 1 or 2.

Abstract: A resin composition contains a curable resin. A minimum value (Min) of loss tangent (tan? = E?/E?) of a cured product of the resin composition is equal to or greater than 0.04. The loss tangent is a ratio of a loss modulus (E?) of the cured product of the resin composition to a storage modulus (E?) thereof. The loss modulus (E?), the storage modulus (E?), and the loss tangent (tan? = E?/E?) are obtained by dynamic mechanical analysis at a temperature equal to or higher than 100° C. and equal to or lower than 200° C.

Abstract: An aspect of the present invention relates to a resin composition containing a polyphenylene ether compound having at least one of the groups represented by Formulas (1) and (2); and an allyl compound having a group represented by Formula (3).

Abstract: An aspect of the present invention is a resin composition containing a first styrene-based block copolymer having a hardness of 20 to 70, a polyphenylene ether compound having at least one of a group represented by the following Formula (1) and a group represented by the following Formula (2) in a molecule, and a curing agent. In Formula (1), p represents 0 to 10, Z represents an arylene group, and R1 to R3 each independently represent a hydrogen atom or an alkyl group. In Formula (2), R4 represents a hydrogen atom or an alkyl group.

Abstract: An aspect of the present invention is a resin composition containing a polybutadiene compound having an epoxy group in a molecule, a polyphenylene ether compound having at least one of a group represented by the following Formula (1) and a group represented by the following Formula (2) in a molecule, a styrene-based block copolymer, and a curing agent. In Formula (1), p represents 0 to 10, Z represents an arylene group, and R1 to R3 each independently represent a hydrogen atom or an alkyl group. In Formula (2), R4 represents a hydrogen atom or an alkyl group.

Abstract: Disclosed herein is a prepreg including a woven fabric base and a semi-cured product of a resin composition impregnated into the woven fabric base. The resin composition contains a maleimide resin as Component (A), an acrylic resin as Component (B), and a phenol resin as Component (C). The Component (B) has a weight average molecular weight falling within the range from 200,000 to 850,000.

Abstract: A resin composition includes a modified poly(phenylene ether) compound having a carbon-carbon unsaturated double bond at a molecular end, a maleimide compound having two or more N-substituted maleimide groups in the molecule, and a styrene-based polymer having a weight-average molecular weight less than 10,000.

Abstract: A resin composition is provided and includes (A) a modified polyphenylene ether compound terminal-modified with a substituent having a carbon-carbon unsaturated double bond, (B) a maleimide compound containing no phenylmaleimide group and having a hydrocarbon group having 10 or more carbon atoms in the molecule thereof, and (C) at least one selected from a maleimide compound containing a phenylmaleimide group and a maleimide compound having an aliphatic hydrocarbon group having 9 or less carbon atoms in the molecule thereof, in which the content ratio of the component (A) to the component (B) is (A):(B)=20:80 to 90:10 in mass ratio.