Abstract: A heat-conductive silicone composition comprising at least (A) an organopolysiloxane, (B) a heat-conductive filler, and (C) a specific organosiloxane. The silicone composition is excellent in handleability, even when it contains a large amount of a heat-conductive filler for the purpose of attaining higher heat conductivity.

Abstract: A curable silicone composition comprising: (A) an organopolysiloxane that has a branched molecular structure and contains in one molecule at least two univalent hydrocarbon groups with phenolic hydroxyl groups therein; (B) a linear-chain organopolysiloxane having at least two univalent hydroxyl groups with epoxy groups that are free of aromatic rings; and (C) a curing accelerator.

Abstract: A room-temperature-curable organopolysiloxane composition comprising: (A) an organopolysiloxane having 1.5 or more end groups having at least one hydroxyl group on the average; (B) a silane or a siloxane oligomer having three or more silicon-bonded hydrolyzable groups; (D) an inorganic powder; and either (C) microparticles of thermoplastic resin containing a platinum compound having an average diameter from 0.1 to 20 ?m; or (C1) a platinum compound; and (C2) an organosiloxane oligomer which contains aryl and alkenyl groups and has 8 or less silicon atoms in each molecule and which contains in each molecule at least one divalent organosiloxane as represented by the formula: —(R2)(R3)SiO—(R2)(R3)Si—, (where R2 is an aryl group, and R3 is an alkenyl group), in a quantity of at least 2 moles of component (C2) per 1 mole platinum atoms in component (C1).

Abstract: A curable organopolysiloxane composition includes: (A) a straight-chain organopolysiloxane having per molecule at least two silicon-bonded alkenyl groups and at least one silicon-bonded aryl group; (B) a branched-chain organopolysiloxane with siloxane units represented by the following general formula: RSiO3/2, where R is a substituted or unsubstituted monovalent hydrocarbon group, and having per molecule at least one silicon-bonded alkenyl group and at least one silicon-bonded aryl group; (C) an organopolysiloxane having in one molecule at least two silicon-bonded hydrogen atoms; and (D) a hydrosilylation catalyst; and a semiconductor device with a semiconductor element coated with a cured body of the aforementioned composition.

Abstract: A method of manufacturing a semiconductor device sealed in a cured silicone body by placing a semiconductor device into a mold and subjecting a curable silicone composition that fills the spaces between said mold and said semiconductor device to compression molding, wherein the curable silicone composition comprises the following components: (A) an organopolysiloxane having at least two alkenyl groups per molecule; (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule; (C) a platinum-type catalyst; and (D) a filler, wherein either at least one of components (A) and (B) contains a T-unit siloxane and/or Q-unit siloxane. By the utilization this method, a sealed semiconductor device is free of voids in the sealing material, and a thickness of the cured silicone body can be controlled.

Abstract: A room-temperature-curable organopolysiloxane composition comprising: (A) an organopolysiloxane having 1.5 or more end groups having at least one hydroxyl group on the average; (B) a silane or a siloxane oligomer having three or more silicon-bonded hydrolyzable groups; (D) an inorganic powder; and either (C) microparticles of thermoplastic resin containing a platinum compound having an average diameter from 0.1 to 20 ?m; or (C1) a platinum compound; and (C2) an organosiloxane oligomer which contains aryl and alkenyl groups and has 8 or less silicon atoms in each molecule and which contains in each molecule at least one divalent organosiloxane as represented by the formula: —(R2)(R3)SiO—(R2)(R3)Si—, (where R2 is an aryl group, and R3 is an alkenyl group), in a quantity of at least 2 moles of component (C2) per 1 mole platinum atoms in component (C1).

Abstract: A method of manufacturing a layered silicone composite material comprising the steps of: applying a second addition-curable organopolysiloxane composition that contains a second adhesion promoter onto a first silicone layer that is formed by curing a first addition-curable organopolysiloxane composition containing a first adhesion promoter and where the first silicone layer has a hardness of less than JIS A 50; and forming a second silicone layer that has hardness of JIS A 50 or more by curing said second addition-curable organopolysiloxane composition.

Abstract: A curable organopolysiloxane composition comprising (A) a linear organopolysiloxane having at least two alkenyl groups and at least one aryl group per molecule, (B) a branched organopolysiloxane having at least one alkenyl group and at least one aryl group per molecule, and having siloxane units represented by the general formula: RsiO2/3, (C) a linear organopolysiloxane with both terminal ends of the molecular chain blocked by silicon bonded hydrogen atoms having at least one aryl group per molecule, and (D) a hydrosilation reaction catalyst, and a semiconductor device whose semiconductor elements are coated with the cured product of the above-described composition. The curable organopolysiloxane composition shows low viscosity, excellent filling properties, and excellent curability that cures to form a soft cured product of a large refractive index, high light transmittance, and high adhesion to substrates, as well as the semiconductor device shows superior reliability.

Abstract: A curable organopolysiloxane composition includes: (A) a straight-chain organopolysiloxane having per molecule at least two silicon-bonded alkenyl groups and at least one silicon-bonded aryl group; (B) a branched-chain organopolysiloxane with siloxane units represented by the following general formula: RSiO3/2, where R is a substituted or unsubstituted monovalent hydrocarbon group, and having per molecule at least one silicon-bonded alkenyl group and at least one silicon-bonded aryl group; (C) an organopolysiloxane having in one molecule at least two silicon-bonded hydrogen atoms; and (D) a hydrosilylation catalyst; and a semiconductor device with a semiconductor element coated with a cured body of the aforementioned composition.

Abstract: A silicone gel composition is characterized by excellent storage stability in a non-cured state and by high adhesion to a substrate and long-term stability of consistency at elevated temperatures after curing. The silicone gel composition comprises: a polyorganosiloxane (A), which consists of polyorganosiloxane (A-1) that contains R(CH3)2SiO2/2 units, RsiO3/2 units R(CH3)2SiO1/2 units, and polydiorganosiloxane (A-2) that contains R(CH3)2SiO2/2 units and R(CH3)2SiO1/2 units, and R(CH3) which contains in one molecule two silicon-bonded hydrogen atoms; an addition-reaction platinum catalyst (C); an organosilicon compound (D) selected from silane of the general formula (R1O)nSiR24-n or a partially hydrolyzed condensate thereof; and an organic titanium compound (E).

Abstract: A heat-conductive silicone composition comprising at least (A) an organopolysiloxane, (B) a heat-conductive filler, and (C) a specific organosiloxane. The silicone composition is excellent in handleability, even when it contains a large amount of a heat-conductive filler for the purpose of attaining higher heat conductivity.

Abstract: A room-temperature-curable organopolysiloxane composition comprising:

Abstract: A silicone gel composition is characterized by excellent storage stability in a non-cured state and by high adhesion to a substrate and long-term stability of consistency at elevated temperatures after curing. The silicone gel composition comprises: a polyorganosiloxane (A), which consists of polyorganosiloxane (A-1) that contains R(CH3)2SiO2/2 units, RsiO3/2 units, and R(CH3) 2SiO1/2 units, and polydiorganosiloxane (A-2) that contains R(CH3)2SiO2/2 units and R(CH3)2SiO1/2 units; a polyorganosiloxane (B), which contains in one molecule two silicon-bonded hydrogen atoms; an addition-reaction platinum catalyst (C); an organosilicon compound (D) selected from silane of the general formula (R1O)nSiR24-n or a partially hydrolyzed condensate thereof; and an organic titanium compound (E).

Abstract: A silalkylene oligosiloxane described by general formula 1

Abstract: A thermally conductive silicone rubber composition, comprising (A) a curable organopolysiloxane (B) a curing agent; and (C) a filler prepared by treating the surface of a thermally conductive filler with an oligosiloxane having a formula selected from (i) (R1O)aSi(OSiR23)(4−a) and (ii) (R1O)aR2(3−a)SiO[R22SiO]nSi(OSiR23)bR2(3−b) wherein R1 is alkyl, each R2 is independently a monovalent hydrocarbon group free of aliphatic unsaturation, subscript a is an integer from 1 to 3, b is an integer from 1 to 3, and n is an integer having a value greater than or equal to 0.

Abstract: An oligosiloxane having the formula (R1O)aSi(OSiR22R3)4−a wherein R1 is alkyl; each R2 is independently selected from C1 to C10 monovalent hydrocarbyl free of aliphatic unsaturation; R3 is hydrocarbly free of aliphatic unsaturation and having at least 11 carbon atoms; and a is 1, 2, or 3; and a method of preparing an alkoxy-functional oligosiloxane.

Abstract: A thermally conductive silicone rubber composition comprising (A) a curable organopolysiloxane, (B) a curing agent, and (C) a thermally conductive filler surface treated with (D) a silalkylene oligosiloxane described by formula 1

Abstract: A silicone gel composition comprising (A) 100 parts by weight of an organopolysiloxane comprising 80 to 98 mole % of R(CH3)SiO2/2 units, 0.1 to 10.0 mole % of RSiO3/2 units, and 0.1 to 10 mole % of R(CH3)2SiO1/2 units, wherein R is methyl, phenyl, or alkenyl, and provided 0.25 to 4.0 mole % the R groups in the organopolysiloxane are alkenyl; (B) an organopolysiloxane having an average of at least 2 silicon-bonded hydrogen atoms per molecule in an amount sufficient to provide from 0.1 to 5 silicon-bonded hydrogen atoms per alkenyl group in component (A); (C) a platinum catalyst; (D) 0.01 to 10 parts by weight of a silica powder; and (E) 0.01 to 5 parts by weight of a thixotropic agent selected from at least one epoxy compound, at least one polyhydric alcohol, and mixtures thereof; wherein the silicone gel composition has an apparent viscosity ratio of 2.0 to 10.0 and cures to form a silicone gel having a ¼ consistency of 10 to 200.

Abstract: A curable silicone composition for a vibration-isolating laminate comprising (A) 100 parts by weight of an organopolysiloxane having at least two alkenyl groups per molecule and a viscosity of 10-100,000 mPa.s at 25.degree. C.; (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule and a viscosity of 1-100,000 mPa.s at 25.degree. C. in an amount such that this component contains 0.2-5 mol of silicon atom-bonded hydrogen atoms per mole of alkenyl groups in component (A); (C) 1-300 parts by weight of an inorganic filler; and (D) a hydrosilylation catalyst in an amount sufficient to cure the composition, designed for forming a cured silicone product for a vibration-isolating laminate by laminating a metal layer and a cured silicone layer having a loss factor of 0.4 or greater and a storage modulus of 1.0.times.10.sup.5 dyne/cm.sup.2 or greater at 25.degree. C. and a shear frequency of 0.2 Hz.

Abstract: A silicone gel composition comprising: (A) 100 parts by weight of an organopolysiloxane containing at least two alkenyl groups per molecule and having a viscosity of 0.01 to 100 Pa.s at 25.degree. C.; (B) an organopolysiloxane containing at least two silicon-bonded hydrogen atoms per molecule and having a viscosity of 0.001 to 10 Pa.s at 25.degree. C. in an amount sufficient to provide from 0.2 to 5 moles of silicon-bonded hydrogen atoms per one mole of alkenyl groups in component (A); (C) 0.01 to 15 parts by weight of a silica powder having a specific surface area of at least 50 m.sup.2 /g; (D) 0.0001 to 1.0 part by weight of a diamine compound represented by the following general formula: R.sup.1.sub.2 N--R.sup.2 --NR.sup.1.sub.2 wherein each R.sup.1 is independently a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and R.sup.