Patents by Inventor Hiroji Enami

Hiroji Enami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6001943
    Abstract: The present invention provides a silicone gel composition for use in sealing and filling of electrical and electronic parts, which are characterized by the fact that when said composition is cured, said composition forms a silicone gel in which the loss elastic modulus at a temperature of 25.degree. C. and a shear frequency of 0.1 Hz is 1.0.times.10.sup.2 to 1.0.times.10.sup.4 Pa, and in which the complex elastic modulus is 1.0.times.10.sup.5 Pa or less, and a silicone gel which is characterized by the fact that in a silicone gel which seals or fills electrical or electronic parts, the loss elastic modulus of this silicone gel at a temperature of 25.degree. C. and a shear frequency of 0.1 Hz is 1.0.times.10.sup.2 to 1.0.times.10.sup.4 Pa, and the complex elastic modulus is 1.0.times.10.sup.5 Pa or less.
    Type: Grant
    Filed: January 28, 1998
    Date of Patent: December 14, 1999
    Assignee: Dow Corning Toray Silicone Co., Ltd.
    Inventors: Hiroji Enami, Yuji Hamada, Akihiro Nakamura, Takeaki Saiki
  • Patent number: 5969023
    Abstract: A curable silicone composition cures to form a silicone cured product with improved fire-retarding properties. The composition comprises a hydrosilylation-reaction curable silicone composition Fire-retarding properties are imparted to the composition using a silica powder with a specific surface area of not less than 50 sq. m/g and a diamine compound. The cured product is preferably a silicone gel.
    Type: Grant
    Filed: March 5, 1998
    Date of Patent: October 19, 1999
    Assignee: Dow Corning Toray Silicone Co., Ltd.
    Inventors: Hiroji Enami, Yuji Hamada, Takeaki Saiki
  • Patent number: 5548038
    Abstract: The present invention provides organosiloxane compositions that cure to optically transparent gels by a hydrosilation reaction and contain a) two types of alkenyl-substituted organopolysiloxanes, and b) a diorganopolysiloxane containing an average of at least two silicon-bonded hydrogen atoms per molecule that are located on non-terminal silicon atoms. The molar ratio of silicon-bonded hydrogen atoms to alkenyl radicals in the composition is from 0.1 to 1.2.
    Type: Grant
    Filed: March 14, 1995
    Date of Patent: August 20, 1996
    Assignee: Dow Corning Toray Silicone Co., Ltd.
    Inventors: Hiroji Enami, Takeaki Saiki
  • Patent number: 5290841
    Abstract: An organocyclosiloxane having utility as a coupling agent is disclosed, said organocyclosiloxane having the general formula ##STR1## wherein R.sup.1 is independently selected from monovalent hydrocarbon groups having 1 to 8 carbons, R.sup.2 is selected from the group consisting of an alkoxy group and an alkoxysilylalkyl group, R.sup.3 is an organofunctional group selected from the group consisting of glycidoxyalkyl, methacryloxyalkyl, N-(trialkylsilyl)aminoalkyl, (hydroxyphenyl)alkyl and haloalkyl, x is 1 to 6 and y is 1 to 6, with the proviso that x+y is an integer having a value of 3 to 8.
    Type: Grant
    Filed: February 16, 1993
    Date of Patent: March 1, 1994
    Assignee: Dow Corning Toray Silicone Co., Ltd.
    Inventors: Hiroji Enami, Shoji Akamatsu
  • Patent number: 5239085
    Abstract: An organocyclosiloxane having utility as a coupling agent is disclosed said organocyclosiloxane having the general formula ##STR1## wherein R.sup.1 is independently selected from monovalent hydrocarbon groups having 1 to 8 carbons, R.sup.2 is selected from the group consisting of an alkoxy group and an alkoxysilylalkyl group, R.sup.3 is an organofunctional group selected from the group consisting of glycidoxyalkyl, methacryloxyalkyl, N-(trialkylsilyl)aminoalkyl (hydroxyphenyl)alkyl and haloalkyl x is 1 to 6 and y is 1 to 6, with the proviso that x+y is an integer having a value of 3 to 8.
    Type: Grant
    Filed: February 26, 1992
    Date of Patent: August 24, 1993
    Assignee: Dow Corning Toray Silicone Co., Ltd.
    Inventors: Hiroji Enami, Shoji Akamatsu
  • Patent number: 5153332
    Abstract: An organocyclosiloxane is disclosed which has both silicon-bonded alkoxy groups and organofunctional groups within each molecule. This cyclic siloxane finds utility as a coupling agent and has the general formula ##STR1## wherein R.sup.1 is independently selected from the group consisting of a monovalent hydrocarbon group having 1 to 8 carbon atoms and a monovalent halogen-substituted hydrocarbon group having 1 to 8 carbon atoms, R.sup.2 is selected from the group consisting of an alkoxy group and an alkoxysilylalkyl group, R.sup.3 is an organofunctional group selected from the group consisting of glycidoxyalkyl groups, methacryloxyalkyl groups, N-(trialkylsilyl)aminoalkyl groups, (hydroxyphenyl)alkyl groups, and haloalkyl groups and n and m each represent an integer having a value of 1 to 6 with the proviso that n+m is an integer with a value of 3 to 8.
    Type: Grant
    Filed: September 10, 1991
    Date of Patent: October 6, 1992
    Assignee: Dow Corning Toray Silicone Company, Ltd.
    Inventors: Hiroji Enami, Shoji Akamatsu
  • Patent number: 5084587
    Abstract: The present invention relates to novel alkylamino-substituted organosilicon compounds and a method for their preparation. The described process involves a dehydrohalogenation reaction between a triorganosilylalkyl halide and an aminophenol in the presence of a hydrogen halide acceptor.
    Type: Grant
    Filed: July 15, 1991
    Date of Patent: January 28, 1992
    Assignee: Dow Corning Toray Silicone Company, Limited
    Inventors: Hiroji Enami, Takeshi Imai
  • Patent number: 5077420
    Abstract: The present invention relates to novel alkylamino-substituted organosilicon compounds and a method for their preparation. The described process involves a dehydrohalogenation reaction between a triorganosilylalkyl halide and an aminophenol in the presence of a hydrogen halide acceptor.
    Type: Grant
    Filed: June 18, 1990
    Date of Patent: December 31, 1991
    Assignee: Dow Corning Toray Silicone Company, Ltd.
    Inventors: Hiroji Enami, Takeshi Imai
  • Patent number: 5075357
    Abstract: A water resistant epoxy resin composition is disclosed, said composition comprising an epoxy resin, a compound having at least two phenolic hydroxyl groups sufficient to cure the epoxy resin component, an aromatic nitrogen-containing silane coupling agent and an inorganic filler. The epoxy resin composition is well suited for use as a sealant for electronic components.
    Type: Grant
    Filed: September 17, 1990
    Date of Patent: December 24, 1991
    Assignee: Dow Corning Toray Silicone Company, Ltd.
    Inventors: Hiroji Enami, Takeshi Imai