Abstract: A semiconductor structure, the semiconductor structure includes a substrate with a first conductivity type and a laterally diffused metal-oxide-semiconductor (LDMOS) device on the substrate, the LDMOS device includes a first well region on the substrate, and the first well region has a first conductivity type. A second well region with a second conductivity type, the second conductivity type is complementary to the first conductivity type, a source doped region in the second well region with the first conductivity type, and a deep drain doped region in the first well region, the deep drain doped region has the first conductivity type.

Abstract: A semiconductor device includes insulating substrate; a compound semiconductor layer provided in a first region of a surface of the insulating substrate; and a silicon layer provided in a second region, differing from the first region, of the surface of the insulating substrate. The semiconductor device further includes: a first gate electrode provided on a surface of the compound semiconductor layer; a pair of conductive members provided at positions on the surface of the compound semiconductor layer to sandwich the first gate electrode between the pair of conductive members; a second gate electrode provided on a surface of the silicon layer; and a pair of diffusion layers provided at positions in the silicon layer to sandwich the second gate electrode between the pair of diffusion layers. One of the conductive members is electrically connected to one of the diffusion layers.

Abstract: A semiconductor device having reduced size, and a manufacturing method of the semiconductor device, where the semiconductor device has a silicon layer provided in a first region on a sapphire substrate, and a silicon device formed on the silicon layer. An oxide semiconductor layer is provided in a second region on the sapphire substrate, and an oxide semiconductor device is formed in the oxide semiconductor layer. The silicon device is connected to the oxide semiconductor device by plural wiring lines formed in a wiring line layer.

Abstract: A semiconductor device includes insulating substrate; a compound semiconductor layer provided in a first region of a surface of the insulating substrate; and a silicon layer provided in a second region, differing from the first region, of the surface of the insulating substrate. The semiconductor device further includes: a first gate electrode provided on a surface of the compound semiconductor layer; a pair of conductive members provided at positions on the surface of the compound semiconductor layer to sandwich the first gate electrode between the pair of conductive members; a second gate electrode provided on a surface of the silicon layer; and a pair of diffusion layers provided at positions in the silicon layer to sandwich the second gate electrode between the pair of diffusion layers. One of the conductive members is electrically connected to one of the diffusion layers.

Abstract: The present disclosure provides a semiconductor device that may reduce the size of the semiconductor device and a manufacturing method thereof. A silicon layer is provided in a first region of on a sapphire substrate, and a silicon device is formed on the silicon layer. An oxide semiconductor layer is provided in a second region on the sapphire substrate, and an oxide semiconductor device is formed in the oxide semiconductor layer. The silicon device is connected to the oxide semiconductor device by plural wiring lines formed in a wiring line layer.

Abstract: A method of producing a Schottky diode includes the steps of: forming a resist layer on the semiconductor substrate; performing a first exposure process on the resist layer; performing a first developing process for developing the resist layer to form a first Schottky diode having an excess region; performing a first cleaning process; performing a second exposure process on the first Schottky diode; performing a second developing process on the first Schottky diode to remove the excess region from the first Schottky diode so that a second Schottky diode corresponding to the specific Schottky diode is formed; and performing a second cleaning process.

Abstract: An H-bridge circuit includes a lower-arm field-effect transistor and a current supplying element that turns on when the drain of the lower-arm field-effect transistor is negatively biased due to regenerative current. When turned on, the current supplying element conducts current from the source to the drain of the lower-arm field-effect transistor, in parallel with a parasitic diode inherent in the lower-arm field effect transistor. The current supplying element competes with other parasitic elements that conduct current from peripheral circuitry to the drain of the lower-arm field-effect transistor, thereby reducing the amount of such current drawn through the peripheral circuitry and lessening the impact of the regenerative current on the peripheral circuits.

Abstract: A method of producing a Schottky diode includes the steps of: forming a resist layer on the semiconductor substrate; performing a first exposure process on the resist layer; performing a first developing process for developing the resist layer to form a first Schottky diode having an excess region; performing a first cleaning process; performing a second exposure process on the first Schottky diode; performing a second developing process on the first Schottky diode to remove the excess region from the first Schottky diode so that a second Schottky diode corresponding to the specific Schottky diode is formed; and performing a second cleaning process.

Abstract: An H-bridge circuit includes a lower-arm field-effect transistor and a current supplying element that turns on when the drain of the lower-arm field-effect transistor is negatively biased due to regenerative current. When turned on, the current supplying element conducts current from the source to the drain of the lower-arm field-effect transistor, in parallel with a parasitic diode inherent in the lower-arm field effect transistor. The current supplying element competes with other parasitic elements that conduct current from peripheral circuitry to the drain of the lower-arm field-effect transistor, thereby reducing the amount of such current drawn through the peripheral circuitry and lessening the impact of the regenerative current on the peripheral circuits.

Abstract: A semiconductor device comprises a substrate, a first conductive film, a first insulation film, a second insulation film, a second conductive film, and a third conductive film. The first conductive film is formed on the substrate. The first insulation film is formed on the first conductive film and has a first opening. The first opening is formed as having multiple crossing trenches each having a predetermined width. The second insulation film is formed on the sides and bottom of the first opening. The second conductive film is formed on the second insulation film in the interior of the first opening. The third conductive film is formed on the second insulation film and the second conductive film.

Abstract: According to the present invention, a dye-sensitized solar cell includes a conductive substrate, which is transparent; and a photovoltaic (photoelectric exchange) layer formed on the conductive substrate. The photovoltaic layer comprises a lighter (brighter) region and a darker region therein.

Abstract: A semiconductor device comprises a substrate, a first conductive film, a first insulation film, a second insulation film, a second conductive film, and a third conductive film. The first conductive film is formed on the substrate. The first insulation film is formed on the first conductive film and has a first opening. The first opening is formed as having multiple crossing trenches each having a predetermined width. The second insulation film is formed on the sides and bottom of the first opening. The second conductive film is formed on the second insulation film in the interior of the first opening. The third conductive film is formed on the second insulation film and the second conductive film.

Abstract: In a dye-sensitized solar cell comprising a first electrode having a photoelectric conversion layer, a second electrode disposed so as to oppose the first electrode, and electrolyte filled at least in between the first electrode and second electrode, the first electrode is constructed with a plurality of first electrode layers disposed superposed in a direction that opposes to the second electrode.

Abstract: A dye-sensitized solar cell, comprising: a light-transmission substrate; a plurality of auxiliary electrodes, formed on the light-transmission substrate; an oxide semiconductor layer which is formed on the light-transmission substrate so as to cover the plurality of auxiliary electrodes directly; and dyes, adhered to the oxide semiconductor layer. Each of electrons, excited at the dyes, is transferred to a nearest auxiliary electrode over a distance “C”, which is smaller than a thickness “B” of the oxide semiconductor layer.

Abstract: A method of producing a semiconductor device includes the steps of: preparing a double SOI substrate, forming a deep trench, filling the deep trench, forming an opening, forming a cavity, depositing a polycrystalline silicon layer, and forming a bipolar transistor.

Abstract: A method of producing a semiconductor device includes the steps of: preparing a double SOI substrate, forming a deep trench, filling the deep trench, forming an opening, forming a cavity, depositing a polycrystalline silicon layer, and forming a bipolar transistor.

Abstract: A semiconductor device capable of preventing the occurrence of stress in a field region, and to prevent dislocation, caused by the stress, in the active region is provided. The semiconductor device includes a support substrate; an active island region having single crystal silicon being formed on the support substrate; a CVD film being configured to surround a periphery of the active island region; a boundary between the active island region and the CVD film having an interstice portion being formed therein, the interstice portion being configured to surround the single crystal silicon layer; and a first insulating film being configured to bury the interstice portion.

Abstract: A method of producing a semiconductor device includes the steps of: preparing a double SOI substrate, forming a deep trench, filling the deep trench, forming an opening, forming a cavity, depositing a polycrystalline silicon layer, and forming a bipolar transistor.

Abstract: A semiconductor device capable of preventing the occurrence of stress in a field region, and to prevent dislocation, caused by the stress, in the active region is provided. The semiconductor device includes a support substrate; an active island region having single crystal silicon being formed on the support substrate; a CVD film being configured to surround a periphery of the active island region; a boundary between the active island region and the CVD film having an interstice portion being formed therein, the interstice portion being configured to surround the single crystal silicon layer; and a first insulating film being configured to bury the interstice portion.

Abstract: A semiconductor device comprises a substrate, a first conductive film, a first insulation film, a second insulation film, a second conductive film, and a third conductive film. The first conductive film is formed on the substrate. The first insulation film is formed on the first conductive film and has a first opening. The first opening is formed as having multiple crossing trenches each having a predetermined width. The second insulation film is formed on the sides and bottom of the first opening. The second conductive film is formed on the second insulation film in the interior of the first opening. The third conductive film is formed on the second insulation film and the second conductive film.