Patents by Inventor Hirokazu Komuro
Hirokazu Komuro has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20140013600Abstract: Provided is a method for manufacturing a substrate for liquid ejection head including an ejection energy generating element and a nozzle layer including an ejection port and a liquid channel. The method includes the steps of: forming, on the substrate including the element, a metal mold member made of metal and having a flat surface, the metal mold member making up at least a part of a mold for the liquid channel, and a planarization layer made of the metal and having a flat surface to planarize a surface of the nozzle layer; coating the mold for the liquid channel and the planarization layer with negative-type photosensitive resin, thus forming a negative-type photosensitive resin layer to be the nozzle layer; exposing the resin layer to ultraviolet rays, thus forming the ejection port; and selectively removing the mold for the liquid channel, thus forming the liquid channel.Type: ApplicationFiled: June 25, 2013Publication date: January 16, 2014Inventors: Sadayoshi Sakuma, Hirokazu Komuro, Yuzuru Ishida, Kazuaki Shibata, Makoto Sakurai
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Patent number: 8613862Abstract: A manufacturing method, for a liquid discharge head substrate that includes a silicon substrate in which a liquid supply port is formed, includes the steps of: preparing the silicon substrate, on one face of which a mask layer, in which an opening has been formed, is deposited; forming a first recessed portion in the silicon substrate, so that the recessed portion is extended through the opening from the one face of the silicon substrate to the other, reverse face of the silicon substrate; forming a second recessed portion by performing wet etching for the substrate, via the first recessed portion, using the mask layer; and performing dry etching for the silicon substrate in a direction from the second recessed portion to the other face.Type: GrantFiled: September 3, 2008Date of Patent: December 24, 2013Assignee: Canon Kabushiki KaishaInventors: Kazuhiro Asai, Hirokazu Komuro, Satoshi Ibe, Takuya Hatsui, Shimpei Otaka, Hiroto Komiyama, Keisuke Kishimoto
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Publication number: 20130257995Abstract: A liquid discharge apparatus includes: a liquid discharge head which includes; a discharge port to discharge a liquid; and a substrate including: an energy generating element for generating thermal energy to discharge the liquid from the liquid discharge port; a pair of electrodes connected to the energy generating element for driving thereof; an insulating layer of an insulating material provided to cover the energy generating element; and a metal layer of a metal material provided corresponding to the energy generating element to cover the insulating layer; and a driver unit which sets a first potential of one of the pair of electrodes substantially equal to the potential of the liquid and a second potential of the other one of the pair of electrodes lower than the first potential to drive the energy generating element.Type: ApplicationFiled: November 18, 2011Publication date: October 3, 2013Applicant: CANON KABUSHIKI KAISHAInventors: Makoto Sakurai, Hirokazu Komuro, Ichiro Saito, Yuzuru Ishida, Takeru Yasuda
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Patent number: 8449080Abstract: A base for a liquid discharge head includes a heat element which forms an exothermic portion, an electrode wire that is electrically connected with the heat element, an insulative protective layer provided above the heat generating resistive element and the electrode wire and an upper protective layer provided on the protective layer. The upper protective layer is made from a TaSi alloy containing 22 at. % or more Si.Type: GrantFiled: November 27, 2008Date of Patent: May 28, 2013Assignee: Canon Kabushiki KaishaInventors: Kazuaki Shibata, Ichiro Saito, Takahiro Matsui, Teruo Ozaki, Hirokazu Komuro
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Patent number: 8445298Abstract: A process includes preparing a base material having a first surface provided with an element generating energy that is used for discharging a liquid and an electrode layer that is connected to the element; forming a hollow on a second surface, which is the surface on the opposite side of the first surface, of the base material, wherein part of the electrode layer serves as the bottom face of the hollow; covering the surface of the base material and the bottom face forming the inner face of the hollow with an insulating film; and partially exposing the electrode layer by removing part of the insulating film covering the bottom face using laser light.Type: GrantFiled: August 30, 2010Date of Patent: May 21, 2013Assignee: Canon Kabushiki KaishaInventors: Souta Takeuchi, Masaya Uyama, Hirokazu Komuro
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Patent number: 8415178Abstract: A process includes preparing a base material having a first surface provided with an element generating energy that is used for discharging a liquid and an electrode layer that is connected to the element; forming a hollow on a second surface, which is the surface on the opposite side of the first surface, of the base material, wherein part of the electrode layer serves as the bottom face of the hollow; covering the surface of the base material and the bottom face forming the inner face of the hollow with an insulating film; and partially exposing the electrode layer by removing part of the insulating film covering the bottom face using laser light.Type: GrantFiled: August 30, 2010Date of Patent: April 9, 2013Assignee: Canon Kabushiki KaishaInventors: Souta Takeuchi, Masaya Uyama, Hirokazu Komuro
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Patent number: 8322829Abstract: A liquid discharge head substrate includes an electrode layer, which is electrically connected to an element that generates energy used for discharging a liquid and provided in an inner side of a region between a first face and a third face of a substrate, and a member made of resin which covers the electrode is provided in the region.Type: GrantFiled: July 12, 2010Date of Patent: December 4, 2012Assignee: Canon Kabushiki KaishaInventors: Sadayoshi Sakuma, Hirokazu Komuro, Souta Takeuchi, Takahiro Matsui, Takuya Hatsui
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Patent number: 8312628Abstract: A method for manufacturing a liquid discharge head includes heating the surface portion of power line that is to be in contact with a member made of resin, thereby forming, from a precious metal layer and a nickel layer, an adhesion layer made of an alloy containing precious metal and nickel as major components.Type: GrantFiled: August 11, 2010Date of Patent: November 20, 2012Assignee: Canon Kabushiki KaishaInventors: Sadayoshi Sakuma, Hirokazu Komuro, Takuya Hatsui, Yuzuru Ishida
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Publication number: 20120289370Abstract: Disclosed is a cooling air intake structure for a V-belt drive continuously variable transmission, which is disposed beside the rear wheel of a small vehicle and which does not permit muddy water and dust to enter therein. A cooling air inlet through which cooling air is taken in is formed at a position beside a transmission case and above a cooling fan side opening formed in the transmission case opposite to a drive pulley. A cooling air passage extending from the cooling air inlet to the side opening is formed so as to surround the side opening. Cooling air taken in through the cooling air inlet is guided so as to flow upward first and then flows downward along a U-shaped cooling air passage to the side opening of the transmission case beside the cooling fan.Type: ApplicationFiled: September 3, 2009Publication date: November 15, 2012Applicant: HONDA MOTOR CO., LTD.Inventors: Teruhide Yamanishi, Hirokazu Komuro, Ryuji Tsuchiya, Nobutaka Horii, Hideo Kashima
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Patent number: 8291576Abstract: Provided is a method of manufacturing a liquid ejection head having an element which generates energy utilized for ejecting liquid and an electrode layer electrically connecting the element. The method includes the steps of: providing an electrode layer on a substrate, a width of one portion of the electrode layer being smaller than that of another portion near the one portion; providing a resist layer on a part of the electrode layer by a screen printing method or a dispense method in such a manner that an end of the resist layer is positioned at the one portion; providing another layer on another part excluding the part of the electrode layer by utilizing the resist layer as a mask; and removing the resist layer.Type: GrantFiled: June 15, 2009Date of Patent: October 23, 2012Assignee: Canon Kabushiki KaishaInventors: Satoshi Ibe, Hirokazu Komuro, Takuya Hatsui, Sadayoshi Sakuma
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Patent number: 8240815Abstract: An inkjet head includes a recording element substrate for discharging ink, a supply port penetrating the recording element substrate and serving as an ink flow path, a protrusion formed at a position surrounding the supply port, projecting from one surface of the recording element substrate, and having a first metal layer at a distal end, and a supporting member having a second metal layer welded with the first metal layer and supporting the recording element substrate.Type: GrantFiled: July 22, 2010Date of Patent: August 14, 2012Assignee: Canon Kabushiki KaishaInventors: Masaya Uyama, Souta Takeuchi, Hirokazu Komuro
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Patent number: 8197705Abstract: A method of manufacturing a substrate for a liquid discharge head having a silicon substrate in which a liquid supply port is provided includes providing the silicon substrate, an etching mask layer having an aperture being formed on one surface of the silicon substrate, forming a region comprising an amorphous silicon in the interior of the silicon substrate by irradiating the silicon substrate with laser light, forming a recess, which has an opening at a part of a portion exposed from the aperture on the one surface, from the one surface of the silicon substrate toward the region, and forming the supply port by performing etching on the silicon substrate in which the recess and the region have been formed from the one surface through the aperture of the etching mask layer.Type: GrantFiled: September 3, 2008Date of Patent: June 12, 2012Assignee: Canon Kabushiki KaishaInventors: Keisuke Kishimoto, Hirokazu Komuro, Satoshi Ibe, Takuya Hatsui, Kazuhiro Asai, Shimpei Otaka, Hiroto Komiyama
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Patent number: 8191998Abstract: A compact print head enabling high-quality, high-speed printing is provided. A liquid ejecting head includes: a substrate, having elements that generate energy used to eject liquid from ejection openings, and provided with a liquid supply port that communicates with a surface of the substrate having the elements and an opposite surface thereof; a member, provided above the surface of the substrate, and having walls of a liquid flow path that communicates with ejection openings and the supply port; an insulating layer, provided so as to cover the supply port, and provided with a plurality of through-holes; and a conducting layer electrically coupled to the elements, and provided within the insulating layer so as to be insulated with respect to the liquid.Type: GrantFiled: June 10, 2009Date of Patent: June 5, 2012Assignee: Canon Kabushiki KaishaInventors: Kazuaki Shibata, Hirokazu Komuro, Takuya Hatsui, Takahiro Matsui
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Patent number: 8182072Abstract: There is provided a substrate for an inkjet printing head and a method for manufacturing the same, in which the substrate has a structure that different kinds of metals do not come into contact with ink or moisture. For this purpose, the structure is constituted such that a diffusion preventing layer for mainly protecting a lower layer among power wiring metals is covered by a metal layer for mainly supplying power, in connection with its upper surface and at least part of a side surface. Herewith, since a single metal appears on a surface of the power wiring including up to its side surface, even circumstance occurs of coming into contact with the ink or the moisture, a battery reaction accompanied by difference of ionization tendency is not generated, and thus corrosion or short-circuit of the power wiring is suppressed.Type: GrantFiled: April 18, 2008Date of Patent: May 22, 2012Assignee: Canon Kabushiki KaishaInventors: Satoshi Ibe, Hirokazu Komuro, Takuya Hatsui, Keisuke Kishimoto, Hiroto Komiyama
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Patent number: 8177988Abstract: A method for manufacturing a substrate for a liquid discharge head having a silicon substrate provided with a supply port of a liquid comprises steps of preparing a substrate which is provided with a passive film on one side face thereof, has a first recess and a second recess provided therein so as to penetrate from the one side face into the inner part through the passive film, wherein the recesses satisfy a relation of a Ă—tan 54.7 degrees?d, where a is defined as a distance between the first recess and the second recess, and d is defined as a depth of the second recess, and forming the supply port by anisotropically etching the crystal from the one side face.Type: GrantFiled: September 3, 2008Date of Patent: May 15, 2012Assignee: Canon Kabushiki KaishaInventors: Hiroto Komiyama, Hirokazu Komuro, Satoshi Ibe, Takuya Hatsui, Keisuke Kishimoto, Shimpei Otaka, Sadayoshi Sakuma
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Publication number: 20120111828Abstract: Provided is a method for manufacturing an ejection element substrate which is provided with a flow-channel-forming member having an ejection orifice for ejecting a liquid and a liquid flow channel that is communicated with the ejection orifice, and a substrate having a supply port for supplying the liquid to the liquid flow channel, and further a filter structure formed in the bottom of the supply port, including: forming the supply port by forming a through-hole by etching the substrate from a second face of the substrate on the side opposite to a first face of the substrate, on which the flow-channel-forming member is disposed; providing a resinous protection film on the side face and the bottom of the supply port; and forming a minute opening in the resinous protection film in the bottom of the supply port by carrying out a laser processing from the side of the second face.Type: ApplicationFiled: October 26, 2011Publication date: May 10, 2012Applicant: CANON KABUSHIKI KAISHAInventors: Souta Takeuchi, Hirokazu Komuro, Sadayoshi Sakuma
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Patent number: 8152278Abstract: A liquid ejection head includes a substrate including, at a surface thereof, an ejection energy generating means for generating ejection energy for ejecting liquid, a flow path forming member provided with an ejection outlet, the substrate further including a liquid supply opening, penetrating therethrough, for supplying the liquid to be ejected by the ejection energy to a flow path of the flow path forming member; a reinforcing member connected to a back side of the substrate; a first penetrating electrode, penetrating the substrate from a front side to the back side thereof, for supplying electric power to the ejection energy generating means; and a second penetrating electrode penetrating the reinforcing member from a front side to a back side thereof, the second penetrating electrode being electrically connected to the first penetrating electrode.Type: GrantFiled: December 13, 2007Date of Patent: April 10, 2012Assignee: Canon Kabushiki KaishaInventor: Hirokazu Komuro
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Patent number: 8152279Abstract: An ink jet printing head substrate has a high adhesion between an electrode layer and a nozzle formation member and the corrosion or electrolysis, for example, of an electrode due to the contact between the electrode and ink can be reduced. The ink jet printing head includes an electrode layer for supplying power to a heat-generating portion that is provided on a substrate and that generates thermal energy for ejecting ink; and a resin layer provided on the electrode layer via a nickel-containing layer. The electrode layer includes precious metal as a main component. The nickel-containing layer consists of a gold-nickel alloy containing nickel.Type: GrantFiled: June 16, 2009Date of Patent: April 10, 2012Assignee: Canon Kabushiki KaishaInventors: Sadayoshi Sakuma, Hirokazu Komuro, Satoshi Ibe, Takuya Hatsui
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Patent number: 8114305Abstract: A method of manufacturing a silicon substrate for a liquid discharge head with a liquid supply opening formed therein includes: forming one processed portion by laser processing on the substrate from one surface of the substrate; expanding the one processed portion to form a recess portion by performing laser processing at a position which overlaps a part of the one processed portion and does not overlap another part of the one processed portion; and etching from the one surface the substrate with the recess portion formed therein to form the liquid supply opening.Type: GrantFiled: September 3, 2008Date of Patent: February 14, 2012Assignee: Canon Kabushiki KaishaInventors: Hiroto Komiyama, Hirokazu Komuro, Satoshi Ibe, Takuya Hatsui, Keisuke Kishimoto, Kazuhiro Asai, Shimpei Otaka
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Patent number: 8091235Abstract: A manufacturing method for manufacturing a liquid ejection element including a liquid flow path which is open at an ejection outlet for ejecting liquid, and an energy generating member for generating energy usable for ejecting the liquid from liquid flow path through the ejection outlet, the manufacturing method, includes a step of forming the energy generating member on a front side of a substrate; a step of forming a top plate member on the side having the energy generating member formed by the energy generating member forming step, wherein the top plate member is a member in which the liquid flow path and the ejection outlet are formed; and a step of thinning the substrate, having the top plate member formed thereon by the top plate member forming step, from a back side thereof.Type: GrantFiled: May 1, 2009Date of Patent: January 10, 2012Assignee: Canon Kabushiki KaishaInventor: Hirokazu Komuro