Abstract: An article is provided with a wireless communication device that is constructed to be attached to the article without using an adhesive. The article with the wireless communication device includes a wireless IC chip, a power feeding circuit board including a terminal electrode to which the wireless IC chip is connected, an article, and a conductive thread for attaching the power feeding circuit board to the article. The conductive thread contacts the terminal electrode and functions as a radiator while the power feeding circuit board is attached to the article.

Abstract: A surface-mounted LC device that includes a substrate having a first surface, multiple inductors formed on the first surface and formed respectively by multiple coiled conductor patterns, a first insulating layer covering the multiple coiled conductor patterns, and a capacitor that is formed on the first insulating layer by a planar electrode. Moreover, the planar electrode covers first zones in which portions of the coiled conductor patterns are adjacent to each other and current directions are opposite to each other in a plan view of the surface-mounted LC device.

Abstract: A multilayer element includes a multilayer body defined by stacking base layers, inductor electrodes, a capacitor electrode on an outer portion, and outer terminals. Inductors are defined using the inductor electrodes. The inductors are connected between the outer terminals, and the inductors are connected to the capacitor electrode. The multilayer element may be easily used to make an LC filter by placing a metal shield opposite a capacitor electrode to define a capacitance between the capacitor electrode and the metal shield.

Abstract: An RFID tag is provided that has reduced size while a decrease in communication distance is prevented. The RFID tag includes an inductor element having a coiled antenna built in a substrate and an RFIC element mounted on a mounting surface of the substrate and electrically connected to the coiled antenna. The coiled antenna is disposed such that a winding axis becomes parallel to or inclined with respect to the mounting surface of the substrate. The area of the RFIC element viewed in a direction orthogonal to the mounting surface of the substrate is larger than opening area of the coiled antenna viewed in winding axis direction of the coiled antenna. The RFIC element is disposed without overlapping at least a portion of opening region of the coiled antenna when viewed in winding axis direction of the coiled antenna.

Abstract: In an impedance matching circuit, first to fourth inductors are formed by a conductor pattern of a coil shape, and a fifth inductor is formed by a conductor pattern of an unwound shape. The first inductor and the third inductor are respectively formed in different layers of a substrate and are arranged in such a relationship as to have coil openings overlapping each other. Moreover, the second inductor and the fourth inductor are respectively formed in different layers of the substrate and are arranged in such a relationship as to have coil openings overlapping each other. Two coils interposing the mounting position of the RFIC are in a 180° rotational symmetry relationship.

Abstract: An RFID tag is provided as a wireless communication device that transmits and receives a communication signal. The RFID tag includes a base material, a conductor pattern including an antenna pattern provided at the base material, and a discharge auxiliary electrode. The discharge auxiliary electrode is disposed at a position where the discharge auxiliary electrode overlaps or is close to the antenna pattern in planar view, and lowers a dielectric breakdown voltage between two different opposed portions on the conductor pattern. With this configuration, ignition and combustion is prevented even in a situation in which the RFID tag is subjected to high-frequency power for heating a food item while attached to the food item.

Abstract: An electronic component includes a board, a surface mount device, a nonmagnetic resin layer, a metal shield layer, and a magnetic shield layer. The board includes first and second principal surfaces facing each other, and a magnetic body layer. The surface mount device is mounted on the first principal surface of the board. The nonmagnetic resin layer covers the surface mount device. The metal shield layer covers the nonmagnetic resin layer. The magnetic shield layer covers an entire or substantially an entire surface of the metal shield layer.

Abstract: An interposer includes an insulating element body, a wiring electrode inside the element body, a signal terminal electrode at the top surface of the element body and connected to a flat cable with a conductive bonding material interposed therebetween, and a ground terminal electrode. A through-hole penetrates through the element body to allow a bar-shaped metal fixing member to be inserted. A metal fixing member connecting electrode to be electrically connected to a metal fixing member is provided at at least one of the top surface of the element body and an inner wall of the through-hole. Predetermined signal terminal electrodes are electrically connected by the wiring electrode. The ground terminal electrode and the metal fixing member connecting electrode are electrically connected.

Abstract: An electronic component includes a wiring substrate, surface mount devices mounted on a front surface of the wiring substrate, and a shield plate fixed on a side adjacent to top surfaces of the surface mount devices. The shield plate includes a magnetic ceramic sintered sheet and a first metal film. The magnetic ceramic sintered sheet includes a first main surface and a second main surface. The first metal film is disposed on the first main surface of the magnetic ceramic sintered sheet.

Abstract: An electronic module includes a substrate, electronic components mounted on the substrate, a magnetic body provided on the substrate so as to cover the electronic components, and a metal shield provided on the magnetic body. An electronic circuit is defined using the electronic components. The electronic circuit includes a signal circuit. The metal shield includes ground connection portions connected to a ground electrode of the substrate, and a circuit connection portion connected to the signal circuit at a position different from the ground connection portions.

Abstract: An RFID tag is provided that transmits and receives a communication signal. The RFID tag includes a base material, antenna patterns provided on the base material, an RFIC package that is a feeding circuit connected to the antenna patterns, and an ignition protection member provided on the base material or the antenna patterns. Moreover, the ignition protection member contains moisture, such that ignition and combustion can be prevented even in a situation where the RFID tag is subjected to high-frequency power for heating a food item while attached to the food item or the like.

Abstract: An interposer includes an insulating element body, a wiring electrode inside the element body, a signal terminal electrode at the top surface of the element body and connected to a flat cable with a conductive bonding material interposed therebetween, and a ground terminal electrode. A through-hole penetrates through the element body to allow a bar-shaped metal fixing member to be inserted. A metal fixing member connecting electrode to be electrically connected to a metal fixing member is provided at at least one of the top surface of the element body and an inner wall of the through-hole. Predetermined signal terminal electrodes are electrically connected by the wiring electrode. The ground terminal electrode and the metal fixing member connecting electrode are electrically connected.

Abstract: A composite component-embedded circuit board includes a circuit board including a first functional block disposed closer to an upper surface of the circuit board, and a second functional block different from the first functional block and disposed closer to a lower surface of the circuit board, and a composite chip circuit embedded in the circuit board and including first and second circuit elements. The composite component further includes first and second terminal electrodes. The first terminal electrode is disposed on an upper surface of the composite component. The first terminal electrode is connected to the composite circuit and to the first functional block. The second terminal electrode is disposed on a lower surface of the composite component. The second terminal electrode is connected to the composite circuit and to the second functional block.

Abstract: An antenna device includes a power supply coil including wire patterns provided on or in magnetic layers and antenna coils including wire patterns provided on or in the magnetic layers. The power supply coil and the antenna coils include coil winding axes thereof coinciding with a lamination direction of the magnetic layers and generate magnetic field coupling to each other. The power supply coil is located on an inner side portion relative to the antenna coils when seen in the lamination direction. At least portions of the antenna coils are located on outer side portions relative to the power supply coil in the lamination direction. With this, an antenna device and a communication apparatus capable of communicating with a communication party reliably without forming an unnecessary communication path with a party-side coil are provided.

Abstract: An interposer includes an insulating element body, a wiring electrode inside the element body, a signal terminal electrode at the top surface of the element body and connected to a flat cable with a conductive bonding material interposed therebetween, and a ground terminal electrode. A through-hole penetrates through the element body to allow a bar-shaped metal fixing member to be inserted. A metal fixing member connecting electrode to be electrically connected to a metal fixing member is provided at at least one of the top surface of the element body and an inner wall of the through-hole. Predetermined signal terminal electrodes are electrically connected by the wiring electrode. The ground terminal electrode and the metal fixing member connecting electrode are electrically connected.

Abstract: A multilayer element includes a multilayer body defined by stacking base layers, inductor electrodes, a capacitor electrode on an outer portion, and outer terminals. Inductors are defined using the inductor electrodes. The inductors are connected between the outer terminals, and the inductors are connected to the capacitor electrode. The multilayer element may be easily used to make an LC filter by placing a metal shield opposite a capacitor electrode to define a capacitance between the capacitor electrode and the metal shield.

Abstract: A manufacturing method including mounting a ceramic plate on a circuit board such that the ceramic plate can be prevented from falling over. An electronic circuit module manufacturing method includes mounting a ceramic plate including a resin layer on a principal surface of a circuit board in such a manner that a principal surface of the ceramic plate is perpendicular or substantially perpendicular to the principal surface of the circuit board, and removing the resin layer from the principal surface of the ceramic plate mounted on the circuit board. In the step of mounting, the ceramic plate is supported by the resin layer and is thus prevented from falling over.

Abstract: An RFID tag is provided as a wireless communication device that transmits and receives a communication signal. The RFID tag includes a base material, a conductor pattern including an antenna pattern provided at the base material, and a discharge auxiliary electrode. The discharge auxiliary electrode is disposed at a position where the discharge auxiliary electrode overlaps or is close to the antenna pattern in planar view, and lowers a dielectric breakdown voltage between two different opposed portions on the conductor pattern. With this configuration, ignition and combustion is prevented even in a situation in which the RFID tag is subjected to high-frequency power for heating a food item while attached to the food item.

Abstract: An electronic device includes a main substrate including an electronic component electrode thereon, a composite electronic component, and an antenna element. The composite electronic component includes a base substrate, a surface mount component mounted on the base substrate, a magnetic shielding layer covering the surface mount component, and is mounted on the electronic component electrode. The antenna element includes a flexible base and an antenna coil conductor disposed on the flexible base. The antenna element is disposed on the magnetic shielding layer of the composite electronic component.

Abstract: An RFID tag is provided that transmits and receives a communication signal. The RFID tag includes a base material, antenna patterns provided on the base material, an RFIC package that is a feeding circuit connected to the antenna patterns, and an ignition protection member provided on the base material or the antenna patterns. Moreover, the ignition protection member contains moisture, such that ignition and combustion can be prevented even in a situation where the RFID tag is subjected to high-frequency power for heating a food item while attached to the food item or the like.