Abstract: An LC composite electronic component includes a ceramic substrate that includes a magnetic layer, a thin-film insulator layer that is formed using a thin film process on a surface of the ceramic substrate, a coil-shaped inductor element that is formed in the ceramic substrate, a capacitor element that is formed in the thin-film insulator layer, and external terminals that are formed on a surface of the thin-film insulator layer. The capacitor element is located in the thin-film insulator layer and includes a first capacitor electrode, a second capacitor electrode and a thin-film dielectric body at least part of which is arranged between the first and second capacitor electrodes. The external terminals are each respectively connected to at least one out of the inductor element and the capacitor element.

Abstract: A surface-mounted LC device that includes a substrate having a first surface, multiple inductors formed on the first surface and formed respectively by multiple coiled conductor patterns, a first insulating layer covering the multiple coiled conductor patterns, and a capacitor that is formed on the first insulating layer by a planar electrode. Moreover, the planar electrode covers first zones in which portions of the coiled conductor patterns are adjacent to each other and current directions are opposite to each other in a plan view of the surface-mounted LC device.

Abstract: A surface-mount thin inductor includes a rectangular or substantially rectangular thin sheet body, loop conductor patterns each with a winding axis in a direction in which base layers in the body are stacked, and four surface electrodes that are on a first main surface of the body. A center of each of the four surface electrodes is located in a region in which the loop conductor patterns are located when viewed in a stacking direction. The four surface electrodes are disposed separately at four corners of the first main surface of the body.

Abstract: A connector module includes a substrate including stacked magnetic layers, a first principal surface, and a second principal surface opposite to the first principal surface, a surface mount connector mounted on mounting electrodes on the first principal surface of the substrate, external mounting electrodes disposed on the second principal surface of the substrate, and inductors inside the substrate and each connected at a first end thereof to a corresponding one of the mounting electrodes and connected at a second end thereof to a corresponding one of the external mounting electrodes.

Abstract: An antenna device includes a power supply coil including wire patterns provided on or in magnetic layers and antenna coils including wire patterns provided on or in the magnetic layers. The power supply coil and the antenna coils include coil winding axes thereof coinciding with a lamination direction of the magnetic layers and generate magnetic field coupling to each other. The power supply coil is located on an inner side portion relative to the antenna coils when seen in the lamination direction. At least portions of the antenna coils are located on outer side portions relative to the power supply coil in the lamination direction. With this, an antenna device and a communication apparatus capable of communicating with a communication party reliably without forming an unnecessary communication path with a party-side coil are provided.

Abstract: A coil-including component includes first and second coil elements in a laminate element body. The first coil element includes first and second coil portions. The first coil portion includes coil patterns. The second coil portion includes a coil pattern. The second coil element includes a third coil portion that includes coil patterns. The third coil portion is provided between the first coil portion and the second coil portion. Magnetic layers are provided between the coil patterns of the first coil portion and between the coil patterns of the third coil portion. Intermediate layers having lower magnetic permeability than the magnetic permeability of the magnetic layers are provided between the first coil portion and the third coil portion and between the second coil portion and the third coil portion.

Abstract: An antenna device includes a power supply coil including wire patterns provided on or in magnetic layers and antenna coils including wire patterns provided on or in the magnetic layers. The power supply coil and the antenna coils include coil winding axes thereof coinciding with a lamination direction of the magnetic layers and generate magnetic field coupling to each other. The power supply coil is located on an inner side portion relative to the antenna coils when seen in the lamination direction. At least portions of the antenna coils are located on outer side portions relative to the power supply coil in the lamination direction. With this, an antenna device and a communication apparatus capable of communicating with a communication party reliably without forming an unnecessary communication path with a party-side coil are provided.

Abstract: A multilayer inductor device (10) includes a magnetic multilayer body (100) in which magnetic layers (110, 120, 130, 140) are laminated in this order. Coil conductors (211, 212) having winding forms are formed on the magnetic layers (110, 130), respectively. The coil conductors (211, 212) are coupled to each other with via conductors (311, 312, 313) to compose a first inductor (L1). Coil conductors (221, 222) having winding forms are formed on the magnetic layers (120, 140), respectively. The coil conductors (221, 222) are coupled to each other with via conductors (321, 322, 323) to compose a second inductor (L2).

Abstract: A connector module includes a substrate including stacked magnetic layers, a first principal surface, and a second principal surface opposite to the first principal surface, a surface mount connector mounted on mounting electrodes on the first principal surface of the substrate, external mounting electrodes disposed on the second principal surface of the substrate, and inductors inside the substrate and each connected at a first end thereof to a corresponding one of the mounting electrodes and connected at a second end thereof to a corresponding one of the external mounting electrodes.

Abstract: A multilayer inductor includes a multilayer body formed by stacking magnetic layers on top of one another. Loop-like line-shaped conductors are respectively formed on the magnetic layers. The loop-like line-shaped conductors are connected to one another by interlayer connection conductors, and thereby a coil conductor having an axis extending in the stacking direction is formed. One end of the line-shaped conductor, which is an uppermost-layer-side end portion of the coil conductor, is connected to a line-shaped conductor, which is for routing and is formed on a higher layer, by a interlayer connection conductor. The line-shaped conductor is connected to an interlayer connection conductor that is formed so as to penetrate through substantially the center inside the loop-like line-shaped conductors. The interlayer connection conductor is connected to an external connection conductor on a bottom surface of the multilayer body via a line-shaped conductor and an interlayer connection conductor.

Abstract: An antenna device includes a power feed coil antenna connected to a power feed circuit, and a booster coil antenna including wound coil conductors and disposed so as to be electromagnetically coupled to the power feed coil antenna. The power feed coil antenna includes a first coil antenna and a second coil antenna each including a coil conductor, and the coil conductors of the first and second coil antennas are connected in phase with each other. The first coil antenna is disposed such that the winding axis of the coil conductor of the first coil antenna extends perpendicularly or substantially perpendicularly to the winding axis of the booster coil antenna, and such that at least a portion of the first coil antenna overlaps the coil conductor of the booster coil antenna as viewed in plan.

Abstract: An antenna device includes a power supply coil including wire patterns provided on or in magnetic layers and antenna coils including wire patterns provided on or in the magnetic layers. The power supply coil and the antenna coils include coil winding axes thereof coinciding with a lamination direction of the magnetic layers and generate magnetic field coupling to each other. The power supply coil is located on an inner side portion relative to the antenna coils when seen in the lamination direction. At least portions of the antenna coils are located on outer side portions relative to the power supply coil in the lamination direction. With this, an antenna device and a communication apparatus capable of communicating with a communication party reliably without forming an unnecessary communication path with a party-side coil are provided.

Abstract: A high-frequency device includes a substrate including a plurality of layers that are stacked on top of one another and that include dielectric and magnetic layers, terminals, pattern conductors each formed on one layer, and via conductors each extending through one layer. The pattern conductors and via conductors connect the terminals and form a signal line that transmits a high-frequency signal. A first portion of the signal line includes a via conductor extending through one magnetic layer and/or a pattern conductor sandwiched between two magnetic layers and has a predetermined resistance to the high-frequency signal. A second portion of the signal line includes a capacitor formed of two pattern electrodes with at least one dielectric layer and no magnetic layers sandwiched there between and/or an inductor including a pattern conductor formed on a dielectric layer. The high-frequency device has an impedance to the high-frequency signal at the terminals.

Abstract: A multilayer inductor device (10) includes a magnetic multilayer body (100) in which magnetic layers (110, 120, 130, 140) are laminated in this order. Coil conductors (211, 212) having winding forms are formed on the magnetic layers (110, 130), respectively. The coil conductors (211, 212) are coupled to each other with via conductors (311, 312, 313) to compose a first inductor (L1). Coil conductors (221, 222) having winding forms are formed on the magnetic layers (120, 140), respectively. The coil conductors (221, 222) are coupled to each other with via conductors (321, 322, 323) to compose a second inductor (L2).

Abstract: A high-frequency device includes a substrate including a plurality of layers that are stacked on top of one another and that include dielectric and magnetic layers, terminals, pattern conductors each formed on one layer, and via conductors each extending through one layer. The pattern conductors and via conductors connect the terminals and form a signal line that transmits a high-frequency signal. A first portion of the signal line includes a via conductor extending through one magnetic layer and/or a pattern conductor sandwiched between two magnetic layers and has a predetermined resistance to the high-frequency signal. A second portion of the signal line includes a capacitor formed of two pattern electrodes with at least one dielectric layer and no magnetic layers sandwiched there between and/or an inductor including a pattern conductor formed on a dielectric layer. The high-frequency device has an impedance to the high-frequency signal at the terminals.

Abstract: An RF signal blocking device includes a capacitor unit and an inductor unit defining an LC resonance circuit. The capacitor unit and inductor unit are set such that a cutoff frequency in the LC resonance circuit after disconnection by fusing of a second inductor including a fuse wire, among first and second inductors of the inductor unit, fluctuates within a prescribed frequency band. The RF signal blocking device reliably blocks an RF signal in a prescribed frequency band after an abnormality of fusing in the second inductor including a fuse wire occurs due to an input of an RF signal having an RF power value greater than or equal to a predetermined level.

Abstract: In a laminated inductor element, outer electrodes and terminal electrodes are electrically connected by via holes, internal wiring lines, and end surface electrodes. The via holes on an upper surface side are provided immediately under the outer electrodes and in a non-magnetic ferrite layer. The via holes on a lower surface side are provided immediately above the terminal electrodes and in a non-magnetic ferrite layer. Since outermost layers are defined by the non-magnetic ferrite layers, a parasitic inductance is not increased, even if the outermost layers are provided with the via holes. In this case, the internal wiring lines are not routed on a surface of the element. Therefore, there is no complication of a wiring pattern, and it is possible to prevent an increase in a mounting area of the element.

Abstract: A multilayer inductor includes a multilayer body formed by stacking magnetic layers on top of one another. Loop-like line-shaped conductors are respectively formed on the magnetic layers. The loop-like line-shaped conductors are connected to one another by interlayer connection conductors, and thereby a coil conductor having an axis extending in the stacking direction is formed. One end of the line-shaped conductor, which is an uppermost-layer-side end portion of the coil conductor, is connected to a line-shaped conductor, which is for routing and is formed on a higher layer, by a interlayer connection conductor. The line-shaped conductor is connected to an interlayer connection conductor that is formed so as to penetrate through substantially the center inside the loop-like line-shaped conductors. The interlayer connection conductor is connected to an external connection conductor on a bottom surface of the multilayer body via a line-shaped conductor and an interlayer connection conductor.

Abstract: An RF signal blocking device includes a capacitor unit and an inductor unit defining an LC resonance circuit. The capacitor unit and inductor unit are set such that a cutoff frequency in the LC resonance circuit after disconnection by fusing of a second inductor including a fuse wire, among first and second inductors of the inductor unit, fluctuates within a prescribed frequency band. The RF signal blocking device reliably blocks an RF signal in a prescribed frequency band after an abnormality of fusing in the second inductor including a fuse wire occurs due to an input of an RF signal having an RF power value greater than or equal to a predetermined level.

Abstract: An antenna device includes a power feed coil antenna connected to a power feed circuit, and a booster coil antenna including wound coil conductors and disposed so as to be electromagnetically coupled to the power feed coil antenna. The power feed coil antenna includes a first coil antenna and a second coil antenna each including a coil conductor, and the coil conductors of the first and second coil antennas are connected in phase with each other. The first coil antenna is disposed such that the winding axis of the coil conductor of the first coil antenna extends perpendicularly or substantially perpendicularly to the winding axis of the booster coil antenna, and such that at least a portion of the first coil antenna overlaps the coil conductor of the booster coil antenna as viewed in plan.