Abstract: There is provided a method of manufacturing a group III nitride semiconductor substrate including: a fixing step S10 of fixing abase substrate, which includes a group III nitride semiconductor layer having a semipolar plane as a main surface, to a susceptor; a first growth step S11 of forming a first growth layer by growing a group III nitride semiconductor over the main surface of the group III nitride semiconductor layer in a state in which the base substrate is fixed to the susceptor using an HVPE method; a cooling step S12 of cooling a laminate including the susceptor, the base substrate, and the first growth layer; and a second growth step S13 of forming a second growth layer by growing a group III nitride semiconductor over the first growth layer in a state in which the base substrate is fixed to the susceptor using the HVPE method.

Abstract: According to the present invention, there is provided a group III nitride semiconductor substrate (free-standing substrate 30) that is formed of group III nitride semiconductor crystals. Both exposed first and second main surfaces in a relationship of top and bottom are semipolar planes. A variation coefficient of an emission wavelength of each of the first and second main surfaces, which is calculated by dividing a standard deviation of an emission wavelength by an average value of the emission wavelength, is 0.05% or less in photoluminescence (PL) measurement in which mapping is performed in units of an area of 1 mm2 by emitting helium-cadmium (He—Cd) laser, which has a wavelength of 325 nm and an output of 10 mW or more and 40 mW or less, at room temperature. In a case where devices are manufactured over the free-standing substrate 30, variations in quality among the devices are suppressed.

Abstract: A distance measurement device includes: a signal division unit to divide a digital signal into N digital signals (N is an integer equal to or greater than 2), the digital signal showing interference light between reflected light which is received from a distance measurement target, and reference light; a frequency shift unit to shift a frequency of each of the N digital signals after distribution; a Fourier transform unit to perform a Fourier transform on each of the N digital signals after frequency shift; and a distance calculation unit to determine a frequency component related to the distance measurement target, to determine a shift amount related to a signal after the Fourier transform which includes the determined frequency component, and to calculate the distance from the distance measurement device to the distance measurement target from the sum of the frequency of the determined frequency component and the determined shift amount.

Abstract: An electrical junction box includes a case body having a plurality of connector portions, a power supply side circuit board accommodated in the case body and a spare connector mounting portion provided in an upper portion of the case body and configured such that a spare connector is attached to and detached from the spare connector mounting portion. The spare connector includes a fuse configured to electrically connect the power supply side circuit board to a device side terminal connected to an end of an electric wire configured to be electrically connected to an electronic device.

Abstract: An electrical junction box includes a case body having a plurality of connector portions, a power supply side circuit board accommodated in the case body and a general-purpose connector mounting unit provided in the case body and configured such that a plurality of types of connectors are selectively attached to and detached from the general-purpose connector mounting unit. The general-purpose connector mourning unit is configured such that a power supply side terminal of the plurality of types of connectors is electrically connected to a terminal connection portion of the power supply side circuit board.

Abstract: An electrical junction box includes a frame body, a rescue terminal portion formed in a rectangular parallelepiped shape in a plan view and including a longitudinal side face, two lateral side faces connected to the longitudinal side face, and an upper face, a resin cover configured to cover the longitudinal side face, the two lateral side faces and the upper face. The resin cover includes a rotary shaft extending along the longitudinal side face and provided on a side where the longitudinal side face is provided and on a base end portion of the rescue terminal portion opposite to the upper face, the resin cover being configured to rotate with respect to the frame body about the rotary shaft.

Abstract: This free-cutting copper alloy contains Cu: 58.5 to 63.5%, Si: more than 0.4% and 1.0% or less, Pb: 0.003 to 0.25%, and P: 0.005 to 0.19%, with the remainder being Zn and inevitable impurities, a total amount of Fe, Mn, Co and Cr is less than 0.40%, a total amount of Sn and Al is less than 0.40%, a relationship of 56.3?f1=[Cu]?4.7×[Si]+0.5×[Pb]?0.5×[P]?59.3 is satisfied, constituent phases of a metal structure have relationships of 20?(?)?75, 25?(?)?80, 0?(?)<2, 20?(?)1/2×3+(?)×(?0.5×([Si])2+1.5×[Si])?78, and 33?(?)1/2×3+(?)×(?0.5×([Si])2+1.5×[Si])+([Pb])1/2×33+([P])1/2×14, and a compound including P is present in ? phase.

Abstract: A controller includes a key top, a substrate, and an elastic member. The elastic member includes a pressed portion, a base, a skirt portion, and a pressing member. The substrate includes a contact. When viewed in the first direction, the pressing member is surrounded by an outer peripheral edge of a prescribed region. In the second direction, a distance between an end of the outer peripheral edge of the prescribed region on a side of a swing center of the key top and an end of a top surface on the side of the swing center is longer than a distance between an end of the outer peripheral edge of the prescribed region opposite to the swing center and an end of the top surface opposite to the swing center. In the second direction, the contact is located closer to the swing center than the top surface.

Abstract: A vehicle includes a traveling information acquiring device configured to recognize a first vehicle that travels in the same lane as the vehicle and in front of the vehicle, recognize a second vehicle that travels in the same lane as the vehicle and travels in front of the first vehicle and acquire traveling information of the first vehicle and the second vehicle; and a control device configured to control the behavior of the vehicle acceleration or deceleration based on a vehicle speed difference between a vehicle speed of the first vehicle and the vehicle speed of the second vehicle when the second vehicle is recognized during the execution of the follow-up control that controls the vehicle speed of the vehicle and adjusts the distance between the vehicle and the first vehicle.

Abstract: This free-cutting copper alloy includes Cu: more than 61.0% and less than 65.0%, Si: more than 1.0% and less than 1.5%, Pb: 0.003% to less than 0.20%, and P: more than 0.003% and less than 0.19%, with the remainder being Zn and unavoidable impurities, a total content of Fe, Mn, Co, and Cr is less than 0.40%, a total content of Sn and Al is less than 0.40%, a relationship of 56.5?f1=[Cu]?4.5×[Si]+0.5×[Pb]?[P]?59.5 is satisfied, constituent phases of a metallographic structure have relationships of 20?(?)?80, 15?(?)?80, 0?(?)<8, 18×(?)/(?)<9, 20?(?)1/2×3+(?)×([Si])1/2?88, and 33?(?)1/2×3+(?)×([Si])1/2+([Pb])1/2×35+([P])1/2×15, and a compound including P is present in ? phase.

Abstract: This copper alloy casting includes, in terms of mass %: Cu: higher than 58.5% and lower than 65.0%; Si: higher than 0.40% and lower than 1.40%; Pb: higher than 0.002% and lower than 0.25%; P: higher than 0.003% and lower than 0.19%; and Bi: 0.001% to 0.100% as an optional element, with the balance being Zn and inevitable impurities, the total content of Fe, Mn, Co, and Cr is lower than 0.45% and the total content of Sn and Al is lower than 0.45%, a relationship of 56.0?f1=[Cu]?5×[Si]+0.5×[Pb]+0.5×[Bi]?0.5×[P]?59.5 is satisfied, when Bi is included, a relationship of 0.003<f0=[Pb]+[Bi]<0.25 is further satisfied.

Abstract: An electronic device includes a housing, a display, a light source, a light guide plate, and a mark portion. The light source is provided inside the housing and below the display. The mark portion is provided in the rear surface of the housing and includes a portion that shines as light from the light source passes therethrough. A lower end of the mark portion is defined as a first end and an upper end of the mark portion is defined as a second end. When viewed in a direction from the rear surface toward the front surface, the light source is located between the first end and the second end, and a distance from the second end to the light source is longer than a distance from the first end to the light source.

Abstract: This free-cutting copper alloy comprises 76.0-78.7% Cu, 3.1-3.6% Si, 0.40-0.85% Sn, 0.05-0.14% P, and at least 0.005% to less than 0.020% Pb, with the remainder comprising Zn and inevitable impurities. The composition satisfies the following relations: 75.0?f1=Cu+0.8×Si?7.5×Sn+P+0.5×Pb?78.2; 60.0?f2=Cu?4.8×Si?0.8×Sn?P+0.5×Pb?61.5; and 0.09?f3=P/Sn?0.30. The area percentage (%) of respective constituent phases satisfies the following relations: 30???65; 0???2.0; 0???0.3; 0???2.0; 96.5?f4=?+?; 99.4?f5=?+?+?+?; 0?f6=?+??3.0; and 35?f7=1.05×?+6×?1/2+0.5×??70. ? phase is present in ? phase, the long side of the ? phase is at most 50 ?m, and the long side of the ? phase is at most 25 ?m.

Abstract: This free-cutting copper alloy contains Cu: more than 57.5% but less than 64.5%, Si: more than 0.20% but less than 1.20%, Pb: more than 0.001% but less than 0.20%, Bi: more than 0.10% but less than 1.00%, and P: more than 0.001% but less than 0.20%, with the balance being Zn and unavoidable impurities, wherein the total amount of Fe, Mn, Co and Cr is less than 0.45%, the total amount of Sn and Al is less than 0.45%, relationships of 56.3?f1=[Cu]?4.8×[Si]+0.5×[Pb]+0.5×[Bi]?0.5×[P]?59.5 and 0.12?f2=[Pb]+[Bi]<1.0 are satisfied.

Abstract: A first optical path length from an emission surface of a first optical system to a reflection surface of a target object is calculated on the basis of first reflected light received by the first optical system and reference light generated by a splitter. A second optical path length from an emission surface of the second optical system to a reflection surface of a reflector is calculated on the basis of second reflected light reflected by the reflector and received by the second optical system and the reference light generated by the splitter A refractive index of a space is calculated on the basis of the second optical path length, and a distance from the emission surface of the first optical system to the reflection surface of the target object is calculated on the basis of the refractive index and the first optical path length.

Abstract: This free-cutting copper alloy includes Cu: more than 58.0% and less than 65.0%, Si: more than 0.30% and less than 1.30%, Pb: more than 0.001% and 0.20% or less, Bi: more than 0.020% and 0.10% or less, and P: more than 0.001% and less than 0.20%, with the remainder being Zn and unavoidable impurities, a total amount of Fe, Mn, Co and Cr is less than 0.45%, a total amount of Sn and Al is less than 0.45%, relationships of 56.5?[Cu]?4.7×[Si]+0.5×[Pb]+0.5×[Bi]?0.5×[P]?59.5, and 0.025?[Pb]+[Bi]<0.25 are satisfied, in constituent phases of a metallographic structure, relationships of 20?(?)<85, 15<(?)?80, 0?(?)<5, 8.0?([Bi]+[Pb]?0.002)1/2×10+([P]?0.001)1/2×5+((?)?7)1/2×([Si]?0.1)1/2×1.2+(?)1/2×0.5?17.0, and 0.9?([Bi]+[Pb]?0.002)1/2×((?)?7)1/2×([Si]?0.1)1/2?4.0 are satisfied, and a particle containing Bi is present in ? phase.

Abstract: The optical distance measurement device is configured in such a manner that the frequency-swept light output unit outputs frequency-swept light during a time period from when frequency sweeping of frequency-swept light being output is completed to when the next frequency sweeping becomes possible, the frequency-swept light output during the time period being frequency swept at a different frequency from the frequency-swept light being output.

Abstract: A mold includes: a first molding surface configured to form a lens surface of a scanning lens being elongated in a main-scanning direction; and a first coolant passage, which is disposed within the mold and through which a coolant to control the temperature of the first molding surface flows, wherein the first coolant passage includes: a first passage portion corresponding to a first lens portion which is a portion protruding most in an optical axis direction in the lens surface; and a second passage portion corresponding to a second lens portion which is a portion retreated most in the optical axis direction in the lens surface, and the second passage portion is located to be closer to the second lens portion than a virtual plane, which passes through the first passage portion and is orthogonal to the optical axis direction.

Abstract: An electric wire includes a core wire made of a conductive metal, and an insulating covering that covers an outer circumference of the core wire. A part of at least one of the core wire and the insulating covering is formed with a flat part flatter than a rest of the at least one of the core wire and the insulating covering.