Abstract: The game device of the present invention comprises a first image processing means for generating an image captured from the view of a virtual camera which moves together with a virtual player on landforms in a game world and displaying it as a main screen, a second image processing means for generating an image on which a destination for the virtual player can be designated and displaying it as a map image, a destination designation means for designating a destination for the virtual player, route determination means for detecting the position of a destination for the virtual player designated on the map screen, determining the shortest route connecting the detection position of the destination and the present position of the virtual player, and determining a movement route for the virtual player, and a movement control means for allowing the virtual player to move to the destination along the movement route.

Abstract: A method for manufacturing an electronic device includes the steps of forming a first resist pattern on a primary surface of a SAW element, the first resist pattern having openings at positions corresponding to those at which bumps and a sealing frame are to be formed, sequentially forming metals over the first resist pattern, the metals being formed into adhesion layers, barrier metal layers, and solder layers, removing the first resist pattern on the SAW element such that the bumps and the sealing frame are simultaneously formed. When the bumps and the sealing frame of the SAW element are bonded to bond electrodes of the bond substrate, the solder layers are melted and alloyed by heating.

Abstract: A method for manufacturing an electronic device includes the steps of forming a first resist pattern on a primary surface of a SAW element, the first resist pattern having openings at positions corresponding to those at which bumps and a sealing frame are to be formed, sequentially forming metals over the first resist pattern, the metals being formed into adhesion layers, barrier metal layers, and solder layers, removing the first resist pattern on the SAW element such that the bumps and the sealing frame are simultaneously formed. When the bumps and the sealing frame of the SAW element are bonded to bond electrodes of the bond substrate, the solder layers are melted and alloyed by heating.